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LSM9DS0

STMicroelectronics

LSM9DS0 by STMicroelectronics

LSM9DS0 by STMicroelectronics is a 24-terminal analog circuit IC with a supply voltage range of 2.4V to 3.6V, operating b/w -40°C to 85°C. Its thin profile and fine pitch make it suitable for industrial applications requiring precise motion sensing and orientation tracking in compact spaces.

Median Price

$4.102

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$4.102

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-

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200

$4.102

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Digiode

USA . 2,155 parts In-Stock

1+ parts

-

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2,155

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Vyrian

USA . 1,502 parts In-Stock

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1,502

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Anansix

USA . 497 parts In-Stock

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497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,775 parts In-Stock

1+ parts

$4.102

100+ parts

-

1k+ parts

-

10k+ parts

$4.020

5,775

$4.102

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-

$4.020

Argo Parts USA

USA . 2,042 parts In-Stock

1+ parts

$4.102

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-

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2,042

$4.102

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.102

100+ parts

-

1k+ parts

$3.897

10k+ parts

$3.815

2,000

$4.102

-

$3.897

$3.815

Semicontronic

India . 1,379 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,379

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$6.295

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588

$6.295

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Ampacity Inc.

Singapore . 834 parts In-Stock

1+ parts

$7.500

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834

$7.500

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Corohmni

South Africa . 12 parts In-Stock

1+ parts

$8.320

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12

$8.320

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$9.148

100+ parts

$8.691

1k+ parts

$8.691

10k+ parts

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5,000

$9.148

$8.691

$8.691

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IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$10.506

100+ parts

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1k+ parts

$9.456

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1,391

$10.506

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$9.456

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MKK Technologies

India . 913 parts In-Stock

1+ parts

$19.757

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913

$19.757

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DigiPath Technology Company

USA . 913 parts In-Stock

1+ parts

$19.757

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913

$19.757

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Aztec Data Supply Inc.

USA . 924 parts In-Stock

1+ parts

$21.380

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924

$21.380

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Lixinc

USA . 2,734 parts In-Stock

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2,734

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Parana Technologies

USA . 1,208 parts In-Stock

1+ parts

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$12.562

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1,208

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$12.562

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Corphita

USA . 922 parts In-Stock

1+ parts

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922

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Overview

Unleash the power of innovation with the LSM9DS0 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability in their products. The LSM9DS0 falls under the category of Other Function Semiconductors, offering a wide range of applications. With its advanced features and cutting-edge technology, this product provides unparalleled value and benefits to customers. Experience seamless performance and endless possibilities with the LSM9DS0 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and resistance to impact, making it a reliable choice.

Surface Mount

YES - Allows for easy and efficient installation, saving time and effort during assembly.

Package Shape

SQUARE - Helps optimize space utilization and layout design for the product.

Nominal Supply Voltage (Vsup)

3 V - Ensures stable and consistent power supply for optimal performance.

No. of Terminals

24 - Provides ample connectivity options for various circuit configurations.

Package Style (Meter)

GRID ARRAY, THIN PROFILE, FINE PITCH - Offers high-density packaging for compact and space-efficient electronic designs.

Maximum Operating Temperature

85 °C - Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature

40 °C - Withstands extreme cold conditions for versatile applications.

Terminal Finish

NICKEL PALLADIUM GOLD - Offers superior conductivity and corrosion resistance for long-lasting usage.

Terminal Position

BOTTOM - Facilitates easy access and connection to other electronic components.

Maximum Seated Height

1.07 mm - Low profile design minimizes space requirements in compact devices.

Width (mm)

4 mm - Compact width enables flexibility in layout design and integration into tight spaces.

Other IC type

ANALOG CIRCUIT - Provides analog signal processing capabilities for versatile applications.

Minimum Supply Voltage (Vsup)

2.4 V - Allows for operation with lower power inputs for energy-efficient performance.

Length

4 mm - Compact length contributes to overall space-saving and efficient design.

Temperature Grade

INDUSTRIAL - Suitable for industrial applications with demanding operating conditions.

Terminal Form

BUTT - Offers a secure and reliable terminal connection for stable circuit performance.

Terminal Pitch

0.5 mm - Provides precise spacing between terminals for accurate signal transmission.

Moisture Sensitivity Level (MSL)

3 - Ensures resistance to moisture and humidity for reliable operation in various environments.

Maximum Supply Voltage (Vsup)

3.6 V - Safely accommodates higher power inputs without risking damage to the device.

Technical Specifications

Other Function Semiconductors LSM9DS0 attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

4 mm

Trade Compliance

LSM9DS0 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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