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LE55CZ-AP

STMicroelectronics

LE55CZ-AP by STMicroelectronics

LE55CZ-AP by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 5.5 V and a max output current of 0.1 A. It operates in temperatures from -40 °C to 125 °C, featuring low dropout voltage of 0.2 V. Ideal for stable power supply applications, it ensures high line and load regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,871 parts In-Stock

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4,871

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Digiode

USA . 1,202 parts In-Stock

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1,202

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Anansix

USA . 722 parts In-Stock

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722

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 657 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

$1.863

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657

$2.070

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$1.863

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MKK Technologies

India . 2,081 parts In-Stock

1+ parts

$3.892

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2,081

$3.892

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DigiPath Technology Company

USA . 2,081 parts In-Stock

1+ parts

$3.892

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2,081

$3.892

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Corphita

USA . 3,484 parts In-Stock

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3,484

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Parana Technologies

USA . 29 parts In-Stock

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$2.475

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29

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$2.475

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Overview

Elevate your projects with the LE55CZ-AP from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This premium fixed LDO regulator ensures reliable performance with minimal dropout voltage, making it ideal for various applications such as consumer electronics and automotive systems. Its robust design supports extreme temperatures, delivering consistent power that enhances device efficiency. Choose the LE55CZ-AP for unmatched quality and performance that drives your success!

Feature Benefit Bullets

Maximum Dropout Voltage: 1.5 V

A low dropout voltage ensures better performance in applications where the input voltage is close to the output voltage, enhancing power efficiency.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature allows the regulator to function reliably in demanding environments or high-temperature applications.

Technology: BIPOLAR

Bipolar technology typically offers lower noise levels and better linearity, making it suitable for sensitive applications.

Package Shape: ROUND

The round package shape can facilitate easier installation and can be space-efficient for specific applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide good mechanical strength and reliability, particularly in high-vibration environments.

Operating Temperature (TJ-Min): -40 °C

Operating in extreme low temperatures enhances versatility, making the product suitable for a wider range of applications.

Packing Method: AMMO PACK

Ammo pack packing method enhances ease of use in automated assembly, potentially reducing production time and costs.

Minimum Output Voltage: 5.28 V

A minimum output voltage that is relatively high allows it to cater to various applications requiring stable power supply.

Maximum Voltage Tolerance: 4%

A tight voltage tolerance ensures consistent performance in supplying power to sensitive electronic devices.

Nominal Output Voltage: 5.5 V

A fixed nominal output voltage of 5.5 V is ideal for powering common digital circuits and other electronics.

No. of Terminals: 3

Three terminals simplify the design and layout of circuits while making it easy to integrate into various applications.

Package Style (Meter): CYLINDRICAL

A cylindrical package style can improve thermal performance and can also be more compact than traditional styles.

Adjustability: FIXED

Fixed adjustability simplifies design and minimizes the chances of output voltage misconfiguration.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many applications, promoting compatibility with various PCB layouts.

Maximum Line Regulation: 0.03%

Excellent line regulation ensures stable output voltage despite variations in input voltage, crucial for sensitive devices.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

The fixed positive single output allows for direct application in single-voltage systems, making it easy to implement.

Terminal Finish: TIN

TIN terminal finish offers good solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: BOTTOM

Bottom terminal position can facilitate better thermal management when mounted on a PCB.

Maximum Output Voltage: 5.72 V

This maximum output voltage provides flexibility in different application requirements while still staying within range.

Maximum Load Regulation: 0.025%

Exceptional load regulation minimizes voltage fluctuations when load conditions change, safeguarding sensitive components.

Minimum Input Voltage: 6.2 V

A reasonable minimum input voltage allows the regulator to be used in a variety of power supply configurations.

Maximum Output Current: 0.1 A

An output current capability of 0.1 A makes this regulator suitable for low-power applications, ensuring efficiency.

Nominal Dropout Voltage: 0.2 V

A low nominal dropout voltage is beneficial for maintaining output voltage stability even with less headroom between input and output.

Maximum Input Voltage: 18 V

A high maximum input voltage allows for diverse applications across various voltage systems, adding to flexibility.

Maximum Input Voltage Absolute: 20 V

An absolute maximum input voltage rating of 20 V provides a safety margin, ensuring protection against potential voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE55CZ-AP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

6.2 V

JESD-30 Code:

O-XBCY-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.025 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

5.72 V

Minimum Output Voltage-1:

5.28 V

Nominal Output Voltage-1:

5.5 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Packing Method:

AMMO PACK

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

4 %

Trade Compliance

LE55CZ-AP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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