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LE45ABZ-TR

STMicroelectronics

LE45ABZ-TR by STMicroelectronics

LE45ABZ-TR by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 4.5 V and a max output current of 0.1 A. It operates b/w -40 °C to 125 °C, featuring a low dropout voltage of just 0.2 V. Ideal for applications requiring stable power supply in compact designs, it ensures high efficiency with minimal line regulation at 0.02%.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,913 parts In-Stock

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4,913

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Digiode

USA . 4,521 parts In-Stock

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4,521

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Anansix

USA . 2,494 parts In-Stock

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2,494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 368 parts In-Stock

1+ parts

$8.021

100+ parts

-

1k+ parts

$7.219

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368

$8.021

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$7.219

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Microchip USA

USA . 315 parts In-Stock

1+ parts

$8.027

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315

$8.027

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MKK Technologies

India . 91 parts In-Stock

1+ parts

$15.082

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91

$15.082

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DigiPath Technology Company

USA . 91 parts In-Stock

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$15.082

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91

$15.082

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QUARKTWIN TECHNOLOGY LTD

USA . 23,558 parts In-Stock

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23,558

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Corphita

USA . 3,915 parts In-Stock

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3,915

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Parana Technologies

USA . 1,128 parts In-Stock

1+ parts

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$9.590

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1,128

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$9.590

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Overview

Unlock the potential of your designs with the LE45ABZ-TR from STMicroelectronics, a trusted name in the industry. This fixed positive LDO regulator delivers reliable performance across diverse applications, ensuring efficiency and stability even in extreme conditions. With its compact cylindrical package and robust specifications, it guarantees optimal output for your projects, making it the perfect choice for demanding electronic applications. Experience unmatched quality and innovation today!

Feature Benefit Bullets

Maximum Dropout Voltage: 1.5 V

The low maximum dropout voltage allows for efficient voltage regulation, ensuring minimal power loss.

Operating Temperature (TJ-Max): 125 °C

This high maximum operating temperature offers reliability and stability in demanding environments.

Technology: BIPOLAR

Bipolar technology provides better performance and lower noise compared to some other technologies.

Package Shape: ROUND

The round package shape aids in space-efficient designs, making it suitable for compact applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical stability, making the product easier to handle and solder.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range ensures reliable performance in extreme conditions.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, enhancing production efficiency.

Minimum Output Voltage: 4.41 V

The minimum output voltage specification guarantees consistent performance in sensitive electronics.

Maximum Voltage Tolerance: 2%

The 2% maximum voltage tolerance allows for flexible design while maintaining system reliability.

Nominal Output Voltage: 4.5 V

A nominal output voltage of 4.5 V fits well in many applications, especially in digital circuits.

No. of Terminals: 3

The 3-terminal configuration simplifies the design while ensuring ease of integration in circuits.

Package Style (Meter): CYLINDRICAL

Cylindrical package design aids in cooling and can fit into various application spaces.

Adjustability: FIXED

A fixed output simplifies design requirements and reduces potential points of failure.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is compatible with various PCB designs, promoting easier integration.

Maximum Line Regulation: 0.02%

Excellent line regulation ensures consistent output despite variations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

As a fixed positive LDO, it provides stable output voltage with low dropout, making it ideal for powering sensitive ICs.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring durability.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better heat dissipation and increased PCB space efficiency.

Maximum Output Voltage: 4.59 V

The maximum output voltage ensures compatibility with different voltage-sensitive applications.

Maximum Load Regulation: 0.015%

Exceptional load regulation helps maintain output stability under varying load conditions.

Minimum Input Voltage: 5.2 V

A minimum input voltage of 5.2 V allows for efficient operation within demanding setups.

Maximum Output Current: 0.1 A

The ability to support up to 0.1 A output current makes it suitable for low to moderate power applications.

Peak Reflow Temperature: 250 °C

The capability to withstand high reflow temperatures ensures reliable soldering during manufacturing.

Nominal Dropout Voltage: 0.2 V

A very low nominal dropout voltage translates to higher efficiency and better performance.

Maximum Input Voltage: 18 V

Supporting a maximum input voltage of 18 V provides flexibility in various circuit designs.

Maximum Input Voltage Absolute: 20 V

The absolute maximum input voltage ensures a robust design, allowing for occasional overvoltage scenarios.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE45ABZ-TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

5.2 V

JESD-30 Code:

O-XBCY-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.015 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

4.59 V

Minimum Output Voltage-1:

4.41 V

Nominal Output Voltage-1:

4.5 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Packing Method:

TR

Peak Reflow Temperature (C):

250

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Trade Compliance

LE45ABZ-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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