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LE45CZ-AP

STMicroelectronics

LE45CZ-AP by STMicroelectronics

LE45CZ-AP by STMicroelectronics is a fixed positive LDO regulator with a nominal output of 4.5 V and a max load current of 0.1 A. It operates in temperatures from -40 °C to 125 °C, featuring low dropout voltage of 0.2 V. Ideal for stable power supply applications, it ensures minimal line and load regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,823 parts In-Stock

1+ parts

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4,823

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Digiode

USA . 2,249 parts In-Stock

1+ parts

-

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2,249

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Anansix

USA . 1,807 parts In-Stock

1+ parts

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1,807

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,375 parts In-Stock

1+ parts

$4.506

100+ parts

-

1k+ parts

$4.056

10k+ parts

-

2,375

$4.506

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$4.056

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MKK Technologies

India . 1,739 parts In-Stock

1+ parts

$8.474

100+ parts

-

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10k+ parts

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1,739

$8.474

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DigiPath Technology Company

USA . 1,739 parts In-Stock

1+ parts

$8.474

100+ parts

-

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10k+ parts

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1,739

$8.474

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Corphita

USA . 4,574 parts In-Stock

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4,574

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Parana Technologies

USA . 2,129 parts In-Stock

1+ parts

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100+ parts

$5.388

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2,129

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$5.388

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Overview

Unlock the potential of your designs with the LE45CZ-AP from STMicroelectronics, a leader in innovative semiconductor solutions. This fixed positive voltage regulator delivers outstanding reliability and performance, ensuring your applications run smoothly even in demanding environments. With its robust design and wide operating temperature range, the LE45CZ-AP is perfect for automotive, industrial, and consumer electronics, providing exceptional efficiency and stability. Experience quality you can trust and elevate your projects with this essential component!

Feature Benefit Bullets

Maximum Dropout Voltage: 1.5 V

A low dropout voltage allows the regulator to maintain consistent output even with minimal input voltage, ensuring reliable performance in various conditions.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature increases the reliability of the product in demanding environments, making it suitable for use in high-temperature applications.

Technology: BIPOLAR

Bipolar technology generally offers better noise performance and improved power efficiency, which enhances overall circuit performance.

Package Shape: ROUND

The round package shape can provide improved space efficiency in PCB layouts, allowing for more compact designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong mechanical support and is advantageous for applications with significant thermal or mechanical stress.

Operating Temperature (TJ-Min): -40 °C

A wide operating temperature range ensures reliable operation in extreme conditions, making it ideal for outdoor or industrial applications.

Packing Method: AMMO PACK

Ammo packing is convenient for automated assembly processes, optimizing production efficiency and reducing handling time.

Minimum Output Voltage: 4.32 V

The minimum output voltage specification allows for slight variations in output while maintaining performance standards, providing flexibility in design.

Maximum Voltage Tolerance: 4%

A tight voltage tolerance indicates precision in output voltage regulation, essential for applications where voltage stability is critical.

Nominal Output Voltage: 4.5 V

A nominal output of 4.5 V is ideal for powering a variety of digital circuits, making it versatile for numerous applications.

No. of Terminals: 3

Three terminals simplify circuit integration while ensuring effective thermal dissipation and stable performance.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for better airflow and heat dissipation, which can enhance thermal performance in compact layouts.

Adjustability: FIXED

A fixed output reduces complexity in design, eliminating the need for external components to set the output voltage.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard in many applications, facilitating compatibility with existing PCB designs.

Maximum Line Regulation: 0.03%

Excellent line regulation ensures minimal change in output voltage despite variations in input voltage, enhancing stability.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

The fixed positive output is ideal for systems requiring stable voltage without the need for adjustments, ensuring simpler and reliable operation.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability, ensuring strong connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning can lead to better PCB space optimization and simpler routing of traces.

Maximum Output Voltage: 4.68 V

The maximum output voltage of 4.68 V supports a range of applications that can operate efficiently within this output voltage range.

Maximum Load Regulation: 0.025%

Exceptional load regulation guarantees that output voltage remains steady under varying load conditions, preserving device functionality.

Minimum Input Voltage: 5.2 V

A relatively low minimum input voltage requirement broadens usability with various power sources.

Maximum Output Current: 0.1 A

A maximum output current of 0.1 A is suitable for low to moderate power applications, making it versatile for many circuit designs.

Nominal Dropout Voltage: 0.2 V

A very low nominal dropout voltage enables efficient operation, allowing the regulator to perform well with minimal headroom.

Maximum Input Voltage: 18 V

A high maximum input voltage supports a wide range of power sources, increasing the regulator's flexibility in different applications.

Maximum Input Voltage Absolute: 20 V

The absolute maximum input voltage provides an added layer of safety margin, protecting the device from voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE45CZ-AP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

5.2 V

JESD-30 Code:

O-XBCY-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.025 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

4.68 V

Minimum Output Voltage-1:

4.32 V

Nominal Output Voltage-1:

4.5 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Packing Method:

AMMO PACK

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

4 %

Trade Compliance

LE45CZ-AP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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