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LD1084D2T-R

STMicroelectronics

LD1084D2T-R by STMicroelectronics

LD1084D2T-R from STMicroelectronics is an adjustable positive LDO regulator with a max output current of 5A and a dropout voltage of 1.5V. It operates b/w -40 °C to 125 °C, making it ideal for various applications in harsh environments. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,098 parts In-Stock

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2,098

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Digiode

USA . 1,787 parts In-Stock

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1,787

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Anansix

USA . 1,603 parts In-Stock

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1,603

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Distributors (Availability)

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Microchip USA

USA . 112 parts In-Stock

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$7.127

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112

$7.127

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IDEA Electronic Components Group

UK . 178 parts In-Stock

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$8.504

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-

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$7.654

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178

$8.504

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$7.654

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MKK Technologies

India . 2,322 parts In-Stock

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$15.992

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2,322

$15.992

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DigiPath Technology Company

USA . 2,322 parts In-Stock

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$15.992

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2,322

$15.992

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AZTECH Wire

Italy . 242 parts In-Stock

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$18.580

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242

$18.580

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Component Stockers USA

USA . 719 parts In-Stock

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$99.990

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719

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,387 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Metaverse IC Inc.

Canada . 1,800 parts In-Stock

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Parana Technologies

USA . 1,760 parts In-Stock

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$10.168

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$10.168

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Kepictronics

USA . 1,000 parts In-Stock

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Corphita

USA . 445 parts In-Stock

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445

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Overview

Elevate your designs with the LD1084D2T-R from STMicroelectronics, a leader in innovative solutions. This adjustable LDO regulator combines reliability with versatility, ensuring optimal performance across a wide temperature range. Perfect for powering digital circuits and automotive applications, its impressive load regulation and compact size make it an ideal choice for engineers seeking efficiency without compromise. Trust STMicroelectronics for quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the internal components, making it suitable for various applications.

Maximum Dropout Voltage-1: 1.5 V

A low maximum dropout voltage ensures efficient operation and minimal power loss, which is ideal for battery-powered devices.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, saving space on PCBs.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature supports use in demanding environments, enhancing reliability and lifespan.

Technology: BIPOLAR

Bipolar technology typically offers better performance characteristics, including lower noise and higher stability.

Package Shape: RECTANGULAR

Rectangular packaging helps optimize space on the board and is commonly used in modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring a reliable connection on the PCB.

Operating Temperature (TJ-Min): -40 °C

The wide temperature range allows operation in harsh environments, expanding the potential applications.

Packing Method: TR

Tape and reel (TR) packing supports automated assembly processes, increasing manufacturing efficiency.

Minimum Output Voltage-1: 1.225 V

A minimum output voltage of 1.225 V allows for fine-tuning of the output, accommodating various load requirements.

No. of Terminals: 2

With only two terminals, this LDO regulator simplifies circuit design and reduces board complexity.

Maximum Line Regulation (%/V): 0.014

Excellent line regulation ensures stable output voltage despite variations in input voltage, enhancing performance reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements, making it suitable for compact electronic devices.

Adjustability: ADJUSTABLE

An adjustable output voltage feature provides flexibility to meet specific design requirements.

Maximum Load Regulation (%): 0.4 %

Low load regulation guarantees minimal output voltage variation under different load conditions, ensuring stable performance.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for compatibility with a variety of PCB layouts and designs.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This adjustable positive LDO design is ideal for precision analog circuits requiring stable output.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces oxidation, enhancing reliability in circuit connections.

Terminal Position: SINGLE

Single terminal positioning simplifies the footprint on the PCB, making it easier to design compact assemblies.

Maximum Output Voltage-1: 1.275 V

Provides precision voltage control, allowing developers to meet specific application voltage requirements with minimal waste.

Maximum Output Current-1: 5 A

A maximum output current of 5 A supports high-power applications, making this LDO suitable for a wide range of devices.

Maximum Time At Peak Reflow Temperature (s): 30

A succinct reflow time ensures compatibility with various soldering processes, supporting reliable assembly.

Peak Reflow Temperature °C: 245

A peak reflow temperature of 245 °C meets standard soldering profiles, ensuring proper integration into electronic assemblies.

Nominal Dropout Voltage-1: 1.3 V

Low nominal dropout voltage means the regulator can maintain output voltage close to its input, improving overall efficiency.

Width: 9.15 mm

A compact width allows it to fit into tight spaces within designs, perfect for portable and space-constrained applications.

Maximum Seated Height: 4.83 mm

The low height profile supports designs with limited vertical space, enabling more versatility in electronic device design.

Length: 10.2 mm

A manageable length allows for straightforward placement on PCBs, helping to ease assembly processes.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LD1084D2T-R attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

1.5 V

Nominal Dropout Voltage-1:

1.3 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.2 mm

Maximum Line Regulation (%/V):

.014

Maximum Load Regulation (%):

.4 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

5 A

Maximum Output Voltage-1:

1.275 V

Minimum Output Voltage-1:

1.225 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

245

Qualification Status:

Not Qualified

Maximum Seated Height:

4.83 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9.15 mm

Trade Compliance

LD1084D2T-R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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