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L99SD01-E

STMicroelectronics

L99SD01-E by STMicroelectronics

L99SD01-E by STMicroelectronics is a small outline interface IC with 36 terminals. It operates b/w 6-28V, making it suitable for various applications. With a compact size of 10.3mm x 7.5mm and gull wing terminal form, it is ideal for surface mount designs requiring dual terminal positions.

Median Price

$5.885

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 616 parts In-Stock

1+ parts

$5.110

100+ parts

$3.500

1k+ parts

$2.650

10k+ parts

-

616

$5.110

$3.500

$2.650

-

Newark

USA . 616 parts In-Stock

1+ parts

$6.660

100+ parts

$4.990

1k+ parts

$4.340

10k+ parts

-

616

$6.660

$4.990

$4.340

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,275

-

-

-

-

Anansix

USA . 1,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,675

-

-

-

-

Digiode

USA . 747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

747

-

-

-

-

Chip Stock

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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98

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$3.830

-

-

-

IDEA Electronic Components Group

UK . 1,477 parts In-Stock

1+ parts

$11.046

100+ parts

-

1k+ parts

$9.941

10k+ parts

-

1,477

$11.046

-

$9.941

-

AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$12.980

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$12.980

-

-

-

MKK Technologies

India . 516 parts In-Stock

1+ parts

$20.770

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$20.770

-

-

-

DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$20.770

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$20.770

-

-

-

Ampacity Inc.

Singapore . 760 parts In-Stock

1+ parts

$38.500

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$38.500

-

-

-

Microchip USA

USA . 2,145 parts In-Stock

1+ parts

$95.794

100+ parts

-

1k+ parts

-

10k+ parts

-

2,145

$95.794

-

-

-

Corphita

USA . 2,054 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,054

-

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,000

-

-

-

-

Perfect Parts

USA . 1,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

-

-

-

-

Parana Technologies

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

$13.207

1k+ parts

-

10k+ parts

-

1,331

-

$13.207

-

-

Futuretech Components

Singapore . 428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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428

-

-

-

-

Overview

Unlock the potential of your electronic systems with the L99SD01-E by STMicroelectronics. Crafted with precision and expertise, this INTERFACE CIRCUIT offers unparalleled quality and reliability. Its versatile applications in a variety of industries make it an essential component for your projects. With a wide supply voltage range and compact design, this product provides exceptional value, efficiency, and performance. Elevate your creations with the L99SD01-E and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal properties, helping to dissipate heat efficiently and improving overall reliability.

Surface Mount: YES

Surface mount design makes it easy to integrate into printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 28 V

Can handle high voltage requirements, providing versatility in various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment in compact electronic devices.

No. of Terminals: 36

High number of terminals allow for multiple connections and functions within the same package.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Compact small outline package with heat sink/slugs for efficient heat dissipation, and shrink pitch for optimal board space utilization.

Minimum Supply Voltage: 6 V

Can operate at low voltage levels, making it suitable for low-power applications.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options.

Maximum Seated Height: 2.47 mm

Low profile design for space-constrained applications.

Width: 7.5 mm

Narrow width for compact and streamlined design integration.

Length: 10.3 mm

Optimal length for proper alignment and placement within electronic devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connection.

Nominal Supply Voltage: 13 V

Suitable voltage level for standard operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on circuit boards.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing functions, ensuring compatibility and seamless communication between components.

Technical Specifications

Other Function Interface ICs L99SD01-E attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.47 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

L99SD01-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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