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L9954XP

STMicroelectronics

L9954XP by STMicroelectronics

L9954XP by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 28V and built-in protections against overcurrent and thermal issues. It features a compact 36-terminal design, ideal for automotive applications. With a nominal output peak current limit of 3A, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,211 parts In-Stock

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7,211

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Digiode

USA . 3,247 parts In-Stock

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3,247

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Anansix

USA . 549 parts In-Stock

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549

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Bristol Electronics

USA . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,850 parts In-Stock

1+ parts

$8.293

100+ parts

-

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1,850

$8.293

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AZTECH Wire

Italy . 944 parts In-Stock

1+ parts

$8.940

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-

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944

$8.940

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$11.177

100+ parts

-

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$10.059

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742

$11.177

-

$10.059

-

MKK Technologies

India . 315 parts In-Stock

1+ parts

$21.018

100+ parts

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315

$21.018

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DigiPath Technology Company

USA . 315 parts In-Stock

1+ parts

$21.018

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315

$21.018

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Vigor

Singapore . 7,498 parts In-Stock

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7,498

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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A-Z Elektronik GmbH

Germany . 1,634 parts In-Stock

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1,634

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Alle Elektronik GmbH

Germany . 1,089 parts In-Stock

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1,089

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Corphita

USA . 537 parts In-Stock

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537

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Parana Technologies

USA . 335 parts In-Stock

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$13.364

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335

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$13.364

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Overview

Unlock unparalleled performance with the L9954XP from STMicroelectronics, a leader in innovative solutions. This advanced peripheral driver offers robust protection against transient, overcurrent, and thermal risks, ensuring reliability in demanding applications. With its compact design and dual-terminal configuration, it seamlessly integrates into your projects, delivering stability and efficiency. Experience the exceptional quality and support that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various operating conditions.

Surface Mount: YES

Surface mount design allows for efficient use of PCB space and simplifies automated assembly.

Maximum Supply Voltage: 5.3 V

Supports a wide range of applications with a maximum supply voltage that offers flexibility in power management.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient placement and fits neatly into compact circuit designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure the product can withstand various fault conditions, enhancing reliability.

Maximum Supply Voltage-1: 28 V

The high maximum supply voltage provides versatility for different applications requiring substantial power.

No. of Terminals: 36

A higher number of terminals offers more interfacing options, allowing for complex designs and functionalities.

Package Style (Meter): SMALL OUTLINE

Compact small outline style is ideal for being integrated into space-constrained electronic devices.

Minimum Supply Voltage-1: 7 V

The minimum voltage requirement of 7V allows operation in various conditions while ensuring efficient performance.

Minimum Supply Voltage: 4.5 V

Operating at a minimum of 4.5V ensures compatibility with a wide range of power supply systems.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and resistance to oxidation, ensuring strong electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout design, enhancing connectivity options.

Maximum Seated Height: 2.45 mm

A low seated height of 2.45 mm ensures compatibility with thin profiles, ideal for modern electronic designs.

Width: 7.5 mm

At 7.5 mm wide, it strikes an optimal balance between functionality and space utilization on PCBs.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C indicates its robustness during soldering processes without damage.

Length: 10.4 mm

Measurement of 10.4 mm allows for easy integration into various circuit layouts, supporting diverse applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of handling during soldering.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V aligns well with common power supply standards, simplifying design efforts.

Turn-on Time: 80 us

Rapid turn-on time (80 microseconds) ensures quick response in dynamic system applications.

Terminal Pitch: 0.5 mm

0.5 mm pitch allows for a compact layout while maintaining reliability in connections between terminals.

Nominal Supply Voltage-1: 16 V

A nominal voltage of 16V expands the usage capability for applications requiring higher voltages.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates suitable handling and storage conditions, ensuring product quality and reliability.

Nominal Output Peak Current Limit: 3 A

A peak current limit of 3 A allows it to drive powerful loads, making it suitable for high-performance applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed specifically for buffer or inverter applications, it ensures optimal performance and signal integrity.

Turn-off Time: 300 us

A turn-off time of 300 microseconds enables efficient management of downstream electronics, contributing to system stability.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current offers versatility in signal handling and compatibility with various circuit designs.

Technical Specifications

Peripheral Drivers L9954XP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage:

5.3 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

28 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

16 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Turn-off Time:

300 us

Turn-on Time:

80 us

Width:

7.5 mm

Trade Compliance

L9954XP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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