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L9954LXPTR

STMicroelectronics

L9954LXPTR by STMicroelectronics

L9954LXPTR by STMicroelectronics is a versatile peripheral driver featuring a 36-terminal, small outline package with dual terminal positioning. It supports buffer/inverter interfaces and can source/sink current effectively. Ideal for automotive applications, it withstands peak reflow temps of 260 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,000

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-

-

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Digiode

USA . 4,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,661

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-

-

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Vyrian

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

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4,477

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-

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Anansix

USA . 2,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,385

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,491 parts In-Stock

1+ parts

$3.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$3.680

-

-

-

IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$8.286

100+ parts

-

1k+ parts

$7.458

10k+ parts

-

750

$8.286

-

$7.458

-

AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$11.090

100+ parts

-

1k+ parts

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583

$11.090

-

-

-

MKK Technologies

India . 1,005 parts In-Stock

1+ parts

$15.582

100+ parts

-

1k+ parts

-

10k+ parts

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1,005

$15.582

-

-

-

DigiPath Technology Company

USA . 1,005 parts In-Stock

1+ parts

$15.582

100+ parts

-

1k+ parts

-

10k+ parts

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1,005

$15.582

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Perfect Parts

USA . 53,760 parts In-Stock

1+ parts

-

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53,760

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 6,221 parts In-Stock

1+ parts

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100+ parts

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6,221

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Alle Elektronik GmbH

Germany . 4,147 parts In-Stock

1+ parts

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100+ parts

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4,147

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-

-

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Kepictronics

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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-

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Corphita

USA . 3,608 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,608

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Microchip USA

USA . 3,590 parts In-Stock

1+ parts

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3,590

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Futuretech Components

Singapore . 497 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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497

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Parana Technologies

USA . 471 parts In-Stock

1+ parts

-

100+ parts

$9.908

1k+ parts

-

10k+ parts

-

471

-

$9.908

-

-

Overview

Elevate your projects with the L9954LXPTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality peripheral driver is designed for seamless integration, ensuring reliability and efficiency in diverse applications such as automotive, industrial, and consumer electronics. Experience enhanced performance and versatility, backed by ST's commitment to excellence, helping you achieve your goals with confidence and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures a robust and reliable product that can withstand various operating conditions.

Surface Mount: YES

Being surface mount allows for compact designs and easy integration into modern electronic assemblies, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of board space, thus enabling designs that maximize performance and minimize size.

No. of Terminals: 36

With 36 terminals, this product provides ample connectivity options, supporting complex circuitry and versatile application use cases.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, making it suitable for high-density electronic designs.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, enhancing the reliability of connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility on PCBs, enabling efficient circuit design and assembly processes.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow time of 30 seconds strikes a balance between effective soldering and minimizing thermal stress on the components.

Peak Reflow Temperature: 260 °C

This high peak reflow temperature ensures compatibility with lead-free soldering processes, catering to environmentally conscious manufacturing.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and allow for easy visual inspection, facilitating quality control in manufacturing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making the device suitable for use in many applications with proper handling and storage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This specification ensures that the product is optimized for interfacing with various peripheral devices, enhancing system performance and reliability.

Output Current Flow Direction: SOURCE AND SINK

Support for both sourcing and sinking current allows for versatile applications, accommodating different circuit designs and operational requirements.

Technical Specifications

Peripheral Drivers L9954LXPTR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

L9954LXPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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