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L9950XPTR

STMicroelectronics

L9950XPTR by STMicroelectronics

L9950XPTR by STMicroelectronics is a versatile brush DC motor controller with a max output current of 10 A and operates b/w 7-28 V. It features a compact rectangular package (7.5 x 10.3 mm) and supports surface mount applications. Ideal for motion control in various devices, it ensures efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,254 parts In-Stock

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12,254

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Chip Stock

USA . 10,600 parts In-Stock

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10,600

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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4,000

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Sensible Micro Corp

USA . 2,989 parts In-Stock

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2,989

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Digiode

USA . 2,427 parts In-Stock

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2,427

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Anansix

USA . 511 parts In-Stock

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511

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Greenchips

USA . 291 parts In-Stock

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291

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SIE Connect GmbH - GreenChips

Germany . 291 parts In-Stock

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291

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$5.369

100+ parts

-

1k+ parts

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10k+ parts

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2,500

$5.369

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Component Stockers USA

USA . 2,073 parts In-Stock

1+ parts

$7.770

100+ parts

$7.380

1k+ parts

$7.140

10k+ parts

-

2,073

$7.770

$7.380

$7.140

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IDEA Electronic Components Group

UK . 226 parts In-Stock

1+ parts

$12.647

100+ parts

-

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$11.383

10k+ parts

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226

$12.647

-

$11.383

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$17.980

100+ parts

-

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508

$17.980

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MKK Technologies

India . 923 parts In-Stock

1+ parts

$23.782

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923

$23.782

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DigiPath Technology Company

USA . 923 parts In-Stock

1+ parts

$23.782

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923

$23.782

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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Perfect Parts

USA . 8,809 parts In-Stock

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8,809

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QUARKTWIN TECHNOLOGY LTD

USA . 7,669 parts In-Stock

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7,669

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RC Electronics

USA . 6,657 parts In-Stock

1+ parts

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100+ parts

$5.770

1k+ parts

$5.270

10k+ parts

$5.110

6,657

-

$5.770

$5.270

$5.110

GreenTree Electronics

Israel . 5,000 parts In-Stock

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Microchip USA

USA . 2,953 parts In-Stock

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2,953

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A-Z Elektronik GmbH

Germany . 2,693 parts In-Stock

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2,693

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Futuretech Components

Singapore . 2,000 parts In-Stock

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2,000

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Alle Elektronik GmbH

Germany . 1,795 parts In-Stock

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1,795

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Parana Technologies

USA . 1,008 parts In-Stock

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$15.122

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1,008

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$15.122

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Corphita

USA . 481 parts In-Stock

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481

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Overview

Unlock unparalleled performance with the L9950XPTR from STMicroelectronics, a leader in innovative motion control solutions. This high-quality IC offers exceptional reliability and efficiency for your brush DC motor applications. Designed for seamless integration, its compact package ensures easy mounting while delivering robust power management. Elevate your projects with a trusted partner dedicated to quality, enhancing your product's performance and longevity. Experience the advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and high circuit density, making it suitable for modern applications.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient space utilization on circuit boards.

Nominal Supply Voltage (Vsup): 8 V

A nominal supply voltage of 8 V offers flexibility for various applications, optimizing performance under stable conditions.

Power Supplies (V): 5,8/16

Supports multiple supply voltage options, making it versatile for different systems and configurations.

No. of Terminals: 36

A higher number of terminals facilitates more complex connectivity and functionalities, enhancing integration possibilities.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package saves space while the heat sink/slug design helps manage heat dissipation effectively.

Terminal Finish: MATTE TIN

Matte tin finish ensures reliable solder joint quality, contributing to overall device integrity.

Terminal Position: DUAL

Dual terminal positioning aids in better connectivity and easier handling during PCB assembly.

Maximum Seated Height: 2.45 mm

A low seated height allows for low-profile designs, making it ideal for space-constrained applications.

Width: 7.5 mm

A compact width aids in minimizing PCB size while ensuring stability and robustness.

Other IC type: BRUSH DC MOTOR CONTROLLER

Specifically designed for brush DC motors, ensuring optimal performance and efficiency in motor control applications.

Minimum Supply Voltage (Vsup): 7 V

A minimum supply voltage of 7 V ensures consistent operation across various load requirements.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates good thermal stability during assembly processes, improving manufacturing reliability.

Length: 10.3 mm

A short length complements compact designs, ensuring versatility in applications.

Maximum Output Current: 10 A

Capable of handling up to 10 A output current, providing substantial power for demanding applications.

Terminal Form: GULL WING

Gull wing terminals are easier to solder and inspect, enhancing assembly efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density layouts, ideal for modern electronics.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 implies moderate sensitivity to moisture, allowing for sufficient handling time before requiring dry storage.

Maximum Supply Voltage (Vsup): 28 V

A high maximum supply voltage of 28 V provides flexibility for applications requiring greater voltage.

Technical Specifications

Motion Control ICs L9950XPTR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,8/16

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L9950XPTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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