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L9390

STMicroelectronics

L9390 by STMicroelectronics

L9390 by STMicroelectronics is a versatile interface IC designed for industrial applications, operating b/w -40 °C and 105°C. It features a max supply voltage of 3.6V, supports up to 12 bits of driving capability, and comes in a compact 14mm square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,043

-

-

-

-

Digiode

USA . 3,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,432

-

-

-

-

Anansix

USA . 2,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,025

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$8.380

100+ parts

-

1k+ parts

$7.542

10k+ parts

-

2,032

$8.380

-

$7.542

-

MKK Technologies

India . 1,060 parts In-Stock

1+ parts

$15.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$15.759

-

-

-

DigiPath Technology Company

USA . 1,060 parts In-Stock

1+ parts

$15.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$15.759

-

-

-

AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$19.790

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$19.790

-

-

-

Microchip USA

USA . 1,516 parts In-Stock

1+ parts

$33.374

100+ parts

-

1k+ parts

-

10k+ parts

-

1,516

$33.374

-

-

-

Corphita

USA . 2,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,112

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-

-

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Parana Technologies

USA . 779 parts In-Stock

1+ parts

-

100+ parts

$10.020

1k+ parts

-

10k+ parts

-

779

-

$10.020

-

-

Overview

Unlock the potential of your designs with the L9390 from STMicroelectronics, a leader in innovative semiconductor solutions. This highly reliable interface IC is tailored for industrial applications, ensuring exceptional performance even in extreme temperatures. Its compact design and advanced features provide seamless integration into your projects, delivering unmatched efficiency and longevity. Elevate your products with the quality and expertise that only STMicroelectronics can offer, driving success and value in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliable performance and longevity of the product in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into printed circuit boards, enhancing versatility in applications.

Maximum Supply Voltage: 3.6 V

The ability to operate at a maximum supply voltage of 3.6 V makes this IC suitable for low-power applications, reducing energy consumption.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates better thermal management.

Power Supplies (V): 35

The wide range of power supply options (up to 35V) provides flexibility in circuit design and adaptation to different power sources.

No. of Terminals: 100

With 100 terminals, this interface IC offers extensive connectivity options, supporting complex configurations and enhanced functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for efficient thermal management and compact designs, making it ideal for high-density applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliability in demanding environments, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate in extremely low temperatures (-40 °C) makes this IC ideal for harsh environments and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in layout and improves ease of soldering in surface-mounted applications.

Maximum Seated Height: 1.2 mm

A low maximum seated height allows for a slimmer profile in assemblies, thus contributing to compact designs.

Width: 14 mm

The width of 14 mm enables efficient placement on boards and contributes to the compact arrangement in circuitry.

Length: 14 mm

With a length of 14 mm, this component can easily fit into tight spaces while still providing optimal performance.

Temperature Grade: INDUSTRIAL

Certified for industrial-grade applications, this product assures reliability and robustness in rigorous conditions.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical strength, ensuring secure connections in electronic assemblies.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V permits compatibility with most modern digital systems, facilitating easy integration.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for high-density packaging, essential for advanced and compact electronic designs.

Driver No. of Bits: 12

A 12-bit driver capacity provides high-resolution control, making this interface IC suitable for a variety of precision applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this IC is designed to facilitate communication between different components, promoting seamless integration in systems.

Technical Specifications

Other Function Interface ICs L9390 attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Driver No. of Bits:

12

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

35

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

L9390 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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