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L6229PD

STMicroelectronics

L6229PD by STMicroelectronics

L6229PD by STMicroelectronics is a robust brushless DC motor controller designed for automotive applications. It operates at a nominal voltage of 48V, supports up to 2.8A output current, and functions effectively in temperatures ranging from -40 °C to 150 °C. Its compact size and surface mount design make it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 248 parts In-Stock

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248

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Avnet

USA . 31 parts In-Stock

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31

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Distributors (In-Stock)

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Vyrian

USA . 4,714 parts In-Stock

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4,714

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Anansix

USA . 2,042 parts In-Stock

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2,042

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Digiode

USA . 1,555 parts In-Stock

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1,555

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Pegasus Components GmbH

Germany . 426 parts In-Stock

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426

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ComSIT Distribution GmbH

Germany . 52 parts In-Stock

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52

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Distributors (Availability)

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Vigor

Singapore . 1,227 parts In-Stock

1+ parts

$5.460

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-

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1,227

$5.460

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IDEA Electronic Components Group

UK . 141 parts In-Stock

1+ parts

$14.765

100+ parts

-

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$13.289

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141

$14.765

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$13.289

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AZTECH Wire

Italy . 466 parts In-Stock

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$15.380

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466

$15.380

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Microchip USA

USA . 1,648 parts In-Stock

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$20.335

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1,648

$20.335

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MKK Technologies

India . 62 parts In-Stock

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$27.765

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62

$27.765

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DigiPath Technology Company

USA . 62 parts In-Stock

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$27.765

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62

$27.765

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A-Z Elektronik GmbH

Germany . 6,407 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,271 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,743 parts In-Stock

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$17.654

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1,743

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$17.654

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Perfect Parts

USA . 1,534 parts In-Stock

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Corphita

USA . 1,031 parts In-Stock

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Authorized Procurement Solutions

USA . 248 parts In-Stock

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248

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iodParts Technologies Inc.

India . 31 parts In-Stock

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31

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Overview

Elevate your design with the L6229PD from STMicroelectronics—your trusted partner in motion control solutions. This robust brushless DC motor controller not only excels in demanding environments but also simplifies implementation, offering unmatched reliability and efficiency. With a wide operating temperature range and superior performance, it’s perfect for automotive applications and beyond. Choose STMicroelectronics for innovation that empowers your projects and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material offers reliable protection against environmental factors, enhancing longevity.

Surface Mount: YES

Surface mount technology enables compact designs, making the IC suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, allowing for more efficient circuit layouts.

Nominal Supply Voltage (Vsup): 48 V

Support for a nominal supply voltage of 48V makes it ideal for high-performance applications.

Power Supplies (V): 48

A consistent power supply rating simplifies design considerations and ensures compatibility in various systems.

No. of Terminals: 36

A greater number of terminals enables more functionalities and connections, enhancing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design reduce PCB real estate usage, beneficial for compact electronic devices.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability even in extreme conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Operating in low temperatures expands the range of applications, especially in colder environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and protects against oxidation, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layouts, accommodating various design preferences.

Maximum Seated Height: 3.5 mm

A low maximum seated height contributes to a slim profile, enabling integration into low-profile devices.

Width: 11 mm

Compact width facilitates easy placement on crowded PCBs, enhancing design efficiency.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

This IC type specializes in brushless DC motors, adding significant efficiency and performance for motor control applications.

Minimum Supply Voltage (Vsup): 8 V

Wide supply voltage range (8V to 52V) offers flexibility in various applications and makes it easy to integrate into different systems.

Maximum Time At Peak Reflow Temperature: 30 s

Ability to withstand extended peak reflow temperature ensures reliability during soldering process.

Peak Reflow Temperature: 245 °C

High peak reflow temperature compatibility allows for integration with advanced soldering techniques.

Length: 15.9 mm

Compact length aids in optimizing space on the circuit board, supporting efficient design strategies.

Temperature Grade: AUTOMOTIVE

Automotive grade rating signifies stringent testing and reliability, making it suitable for automotive applications.

Maximum Supply Current (Isup): 10 mA

Low supply current requirements enable energy-efficient operation, making it suitable for battery-powered devices.

Maximum Output Current: 2.8 A

Robust output current capability provides the performance necessary for driving motors and other high-load devices.

Technology: BCDMOS

BCD technology combines CMOS and bipolar functionalities, enhancing performance and integration capabilities.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly processes, improving manufacturability.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for denser connections, which is essential for modern compact electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates appropriate handling to avoid moisture-related issues, ensuring product integrity in storage and assembly.

Maximum Supply Voltage (Vsup): 52 V

The high maximum supply voltage cater to demanding applications, enabling the IC to operate in various environments.

Technical Specifications

Motion Control ICs L6229PD attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

52 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

11 mm

Trade Compliance

L6229PD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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