Loading...

L3281AD1

STMicroelectronics

L3281AD1 by STMicroelectronics

STMicroelectronics L3281AD1 is a Telephone Line IC with 14 terminals in a small outline package. Operating temperature range from -20 to 55 °C, suitable for telecom applications. Features Gull Wing terminals and measures 3.9mm width by 8.65mm length with a seated height of 1.75mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

-

-

-

-

Digiode

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

-

-

-

-

Vyrian

USA . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$14.779

100+ parts

-

1k+ parts

$13.301

10k+ parts

-

806

$14.779

-

$13.301

-

MKK Technologies

India . 2,213 parts In-Stock

1+ parts

$27.791

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213

$27.791

-

-

-

DigiPath Technology Company

USA . 2,213 parts In-Stock

1+ parts

$27.791

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213

$27.791

-

-

-

Parana Technologies

USA . 2,307 parts In-Stock

1+ parts

-

100+ parts

$17.670

1k+ parts

-

10k+ parts

-

2,307

-

$17.670

-

-

Corphita

USA . 2,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

-

-

-

-

Overview

Enhance your telecommunications systems with the L3281AD1 by STMicroelectronics. This high-quality Telephone Line IC offers unparalleled reliability and performance, backed by the reputable manufacturer's commitment to excellence. Ideal for a wide range of applications in the telecommunications industry, this product provides customers with exceptional value and benefits. Upgrade your communication devices with the L3281AD1 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs.

No. of Terminals: 14

Having 14 terminals provides flexibility for connecting various components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board.

Maximum Operating Temperature: 55 °C

High maximum operating temperature ensures reliable performance even in warm environments.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stable connections.

Maximum Seated Height: 1.75 mm

Low seated height helps in compact design and efficient use of space.

Width: 3.9 mm

Compact width makes it suitable for space-constrained applications.

Length: 8.65 mm

Optimal length for fitting into standard circuit board layouts.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where temperature consistency is important.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering.

Telecom IC Type: TELEPHONE SPEECH CIRCUIT

Specifically designed for telephone speech circuits, ensuring high-quality audio transmission.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration with other components on the circuit board.

Technical Specifications

Telephone Line ICs L3281AD1 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

L3281AD1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2