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L3281AB

STMicroelectronics

L3281AB by STMicroelectronics

STMicroelectronics L3281AB is a Telephone Line IC with 14 terminals in an IN-LINE package. Operating temperature range from -20 to 55 °C, suitable for commercial telecom applications. Features dual terminal position and through-hole form factor, ideal for telephone speech circuits.

Median Price

$5.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 131 parts In-Stock

1+ parts

$5.600

100+ parts

$2.426

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131

$5.600

$2.426

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Anansix

USA . 2,871 parts In-Stock

1+ parts

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2,871

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Digiode

USA . 2,550 parts In-Stock

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2,550

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Cyclops Electronics Ltd

UK . 1,150 parts In-Stock

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1,150

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Vyrian

USA . 1,084 parts In-Stock

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1,084

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Corel Iberica Componentes, S.L.

Spain . 279 parts In-Stock

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279

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Microfarads

USA . 126 parts In-Stock

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126

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LittleDiode

UK . 4 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 834 parts In-Stock

1+ parts

$11.556

100+ parts

-

1k+ parts

$10.401

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834

$11.556

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$10.401

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MKK Technologies

India . 1,727 parts In-Stock

1+ parts

$21.731

100+ parts

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1,727

$21.731

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DigiPath Technology Company

USA . 1,727 parts In-Stock

1+ parts

$21.731

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1,727

$21.731

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A-Z Elektronik GmbH

Germany . 6,413 parts In-Stock

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6,413

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Alle Elektronik GmbH

Germany . 4,275 parts In-Stock

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4,275

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Kepictronics

USA . 3,450 parts In-Stock

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3,450

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Corphita

USA . 2,287 parts In-Stock

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2,287

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Parana Technologies

USA . 1,543 parts In-Stock

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$13.817

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1,543

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$13.817

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Assy Fe

Spain . 1,295 parts In-Stock

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1,295

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Epart123

USA . 150 parts In-Stock

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150

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Overview

Upgrade your telephone line experience with the L3281AB by STMicroelectronics, a reliable and high-quality Telephone Line IC. Manufactured by STMicroelectronics, a global leader in semiconductor technology, this product offers unparalleled value and benefits to customers. Ideal for various applications in telecommunications, the L3281AB is designed to provide seamless communication with a temperature range of -20 °C to 55°C. Trust STMicroelectronics for cutting-edge technology that enhances your connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product easy to handle and less prone to damage during installation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space in the product design, making it compact and easy to integrate into different systems.

No. of Terminals: 14

Having a higher number of terminals allows for more connectivity options and flexibility in the design of telephone line circuits.

Package Style: IN-LINE

In-line package style is commonly used and easily mountable, making the product versatile and compatible with various applications.

Maximum Operating Temperature: 55 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, ensuring reliability in different environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the product to function effectively in cold environments, expanding its usability in diverse conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal transmission capability, enhancing the reliability of the telephone line circuit.

Maximum Seated Height: 5.1 mm

Compact maximum seated height allows for a slim design and easy integration into space-constrained applications, optimizing the layout of the circuit.

Width: 7.62 mm

Narrow width enables the product to be used in tight spaces without compromising on functionality, making it suitable for various installation scenarios.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for performance and reliability, ensuring compatibility with mainstream applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, making assembly and maintenance easier while enhancing the overall durability of the product.

Telecom IC Type: TELEPHONE SPEECH CIRCUIT

Specifically designed for telephone speech circuit applications, this product offers optimized functionality and performance in telecommunication systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy connectivity and compatibility with widely available components, simplifying integration and maintenance processes.

Technical Specifications

Telephone Line ICs L3281AB attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T14

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

L3281AB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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