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HDMI05-CL01F3

STMicroelectronics

HDMI05-CL01F3 by STMicroelectronics

HDMI05-CL01F3 by STMicroelectronics is a consumer IC in a very thin profile, square package with 8 terminals. It operates b/w -30 °C to 85°C and features a fine pitch of 0.4 mm. Ideal for compact electronic applications requiring reliable performance.

Median Price

$0.155

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,043 parts In-Stock

1+ parts

$0.155

100+ parts

-

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4,043

$0.155

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Mouser Electronics

USA . 1,424 parts In-Stock

1+ parts

$0.600

100+ parts

$0.355

1k+ parts

$0.239

10k+ parts

$0.193

1,424

$0.600

$0.355

$0.239

$0.193

Verical

USA . 4,043 parts In-Stock

1+ parts

-

100+ parts

$0.155

1k+ parts

-

10k+ parts

-

4,043

-

$0.155

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Chip1Stop

Japan . 4,043 parts In-Stock

1+ parts

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4,043

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Distributors (In-Stock)

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Digiode

USA . 660 parts In-Stock

1+ parts

$0.145

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-

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660

$0.145

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Vyrian

USA . 3,558 parts In-Stock

1+ parts

$0.153

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-

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3,558

$0.153

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Anansix

USA . 967 parts In-Stock

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967

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Distributors (Availability)

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Corphita

USA . 4,719 parts In-Stock

1+ parts

$0.138

100+ parts

-

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4,719

$0.138

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Component Stockers USA

USA . 12,218 parts In-Stock

1+ parts

$0.150

100+ parts

$0.150

1k+ parts

$0.150

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-

12,218

$0.150

$0.150

$0.150

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

$0.238

10k+ parts

-

1,047

$0.265

-

$0.238

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MKK Technologies

India . 1,557 parts In-Stock

1+ parts

$0.498

100+ parts

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1,557

$0.498

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DigiPath Technology Company

USA . 1,557 parts In-Stock

1+ parts

$0.498

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1,557

$0.498

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Native Components

USA . 746 parts In-Stock

1+ parts

$1.741

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746

$1.741

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Northwest PG Solutions

USA . 2,300 parts In-Stock

1+ parts

$1.915

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2,300

$1.915

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Perfect Parts

USA . 7,323 parts In-Stock

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7,323

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A-Z Elektronik GmbH

Germany . 6,506 parts In-Stock

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6,506

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,337 parts In-Stock

1+ parts

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4,337

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Parana Technologies

USA . 1,885 parts In-Stock

1+ parts

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100+ parts

$0.317

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1,885

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$0.317

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Overview

Elevate your consumer electronics with the HDMI05-CL01F3 from STMicroelectronics, a trusted name in innovation. This high-quality IC ensures seamless connectivity and reliability, making it perfect for a range of applications, from TVs to gaming consoles. Its compact design allows for easy integration, enhancing performance without compromising space. Experience unmatched durability and efficiency that adds real value to your projects, propelling them to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for high-density circuit designs, facilitating efficient use of board space and improved manufacturing processes.

Package Shape: SQUARE

A square package shape optimizes space on PCB layouts and enables easier integration into smaller devices.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC meets the specific needs for performance and reliability in everyday electronic devices.

No. of Terminals: 8

Having 8 terminals allows for sufficient connectivity options while maintaining a compact design, which is ideal for space-constrained devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports advanced circuit designs with fine pitch and thin profile, enabling modern high-performance electronics.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in moderate heat environments, broadening the range of applications.

Minimum Operating Temperature: -30 °C

The ability to function in temperatures as low as -30 °C makes this IC suitable for use in environments with colder climates.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and ensures a robust electrical connection, improving overall performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and better surface contact on PCBs, enhancing reliability.

Maximum Seated Height: 0.66 mm

A low seated height allows for a compact design profile, which is essential for portable consumer devices.

Width: 1.14 mm

The narrow width allows for high-density layouts, making this IC fit well into space-limited applications.

Length: 1.14 mm

The compact length further contributes to the overall efficiency of space usage on PCBs, benefiting modern electronics.

Terminal Form: BALL

Ball terminals provide enhanced electrical connections and mechanical stability, ensuring reliable device performance.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for more terminals within a compact area, supporting sophisticated circuit designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, which is manageable during the assembly process, allowing for simpler handling.

Technical Specifications

Other Function Consumer ICs HDMI05-CL01F3 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B8

JESD-609 Code:

e1

Length:

1.14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.14 mm

Trade Compliance

HDMI05-CL01F3 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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