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FDA803Q-V0T

STMicroelectronics

FDA803Q-V0T by STMicroelectronics

FDA803Q-V0T from STMicroelectronics is a Class D audio amplifier designed for automotive applications, meeting AEC-Q100 standards. It operates b/w -40 °C to 125 °C and supports supply voltages from 3.3V to 18V. Its compact design features a 48-terminal, very thin profile package for efficient heat dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,992 parts In-Stock

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4,992

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Digiode

USA . 1,927 parts In-Stock

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1,927

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Anansix

USA . 476 parts In-Stock

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476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 263 parts In-Stock

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$0.745

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263

$0.745

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Northwest PG Solutions

USA . 959 parts In-Stock

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$0.820

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959

$0.820

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$1.149

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$1.034

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1,904

$1.149

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$1.034

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MKK Technologies

India . 1,234 parts In-Stock

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$2.161

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1,234

$2.161

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DigiPath Technology Company

USA . 1,234 parts In-Stock

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$2.161

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1,234

$2.161

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AZTECH Wire

Italy . 795 parts In-Stock

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$20.200

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795

$20.200

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Microchip USA

USA . 3,422 parts In-Stock

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$23.595

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3,422

$23.595

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Corphita

USA . 3,012 parts In-Stock

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3,012

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Parana Technologies

USA . 1,855 parts In-Stock

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$1.374

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1,855

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$1.374

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Overview

Elevate your audio experience with the FDA803Q-V0T from STMicroelectronics, a leader in innovative electronics. This Class D audio amplifier delivers exceptional sound quality in a compact design, perfect for automotive and consumer applications. With AEC-Q100 certification, you can trust its reliability even in the most demanding environments. Enjoy superior performance, energy efficiency, and durability, making it the ideal choice for discerning customers seeking unmatched value.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, making it suitable for space-constrained applications.

Screening Level: AEC-Q100

This specification ensures high reliability and performance, making it ideal for automotive and high-temperature environments.

Package Shape: SQUARE

The square package shape provides an efficient layout and spacing for heat dissipation and ease of integration into existing designs.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D amplifiers are known for their high efficiency, allowing for reduced heat generation and longer battery life in portable devices.

No. of Terminals: 48

The high number of terminals allows for a wide range of connectivity options, supporting complex audio configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective thermal management while maintaining a low profile, ideal for modern, compact electronic designs.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this amplifier suitable for use in demanding conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in both extreme cold and heat, making it versatile for various environments.

Terminal Position: QUAD

Quad terminal positioning enhances the layout options, which can lead to improved signal integrity and reduced electromagnetic interference.

Maximum Seated Height: 1.05 mm

The low height allows for low-profile designs, facilitating integration into slim devices without compromising performance.

Width: 7 mm

A compact width fits seamlessly into designs where space is at a premium, while still allowing for adequate heat dissipation.

Minimum Supply Voltage (Vsup): 3.3 V

The low minimum supply voltage requirement enables battery-operated devices to run efficiently without high power demands.

Length: 7 mm

A matching length to width ensures a square footprint, maximizing space efficiency on PCBs.

Technology: BCD

BCD technology provides benefits like reduced power consumption and improved linearity, enhancing audio quality.

Terminal Form: NO LEAD

No-lead terminals reduce parasitic inductance and capacitance, contributing to better performance in high-frequency applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density PCB layouts, crucial for modern electronics designs.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage accommodates a variety of applications, providing flexibility in design and power management.

Technical Specifications

Audio & Video Amplifiers FDA803Q-V0T attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

FDA803Q-V0T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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