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F276-CEG-P-TR

STMicroelectronics

F276-CEG-P-TR by STMicroelectronics

F276-CEG-P-TR microcontroller by STMicroelectronics features a 16-bit address bus, 5V power supply, and 64 MHz clock frequency. Ideal for automotive applications, it offers 24-Ch ADCs, 10-Bit PWM channels, and connectivity options like CAN and I2C. With a compact flatpack package style and wide temperature range (-40 to 125°C), it's suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,836 parts In-Stock

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4,836

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Vyrian

USA . 4,113 parts In-Stock

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4,113

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Anansix

USA . 369 parts In-Stock

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369

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 517 parts In-Stock

1+ parts

$12.551

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517

$12.551

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IDEA Electronic Components Group

UK . 1,560 parts In-Stock

1+ parts

$17.626

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-

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$15.864

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1,560

$17.626

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$15.864

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Ampacity Inc.

Singapore . 1,350 parts In-Stock

1+ parts

$23.000

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1,350

$23.000

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Corohmni

South Africa . 268 parts In-Stock

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$24.956

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268

$24.956

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MKK Technologies

India . 721 parts In-Stock

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$33.145

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721

$33.145

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DigiPath Technology Company

USA . 721 parts In-Stock

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$33.145

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721

$33.145

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Aztec Data Supply Inc.

USA . 152 parts In-Stock

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$63.640

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$63.640

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Component Stockers USA

USA . 666 parts In-Stock

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$99.990

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666

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 15,801 parts In-Stock

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Continental Prestige Electronics

USA . 5,234 parts In-Stock

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Microchip USA

USA . 4,260 parts In-Stock

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Parana Technologies

USA . 2,158 parts In-Stock

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$21.075

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$21.075

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Argo Parts USA

USA . 1,087 parts In-Stock

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Corphita

USA . 786 parts In-Stock

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786

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the next level of innovation with the F276-CEG-P-TR microcontroller by STMicroelectronics. Crafted with precision and expertise, this high-quality product offers unmatched performance and reliability for a wide range of applications. With advanced features and cutting-edge technology, this microcontroller provides customers with superior value, efficiency, and flexibility. Trust STMicroelectronics to deliver excellence in every aspect, empowering you to achieve your goals with confidence. Elevate your projects with the F276-CEG-P-TR microcontroller and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the microcontroller lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options.

Address Bus Width: 16

The 16-bit address bus width allows for access to a larger memory space.

Bit Size: 16

The 16-bit processing capability enables handling of more complex operations and data.

Power Supplies (V): 5

Operates efficiently at a standard 5V power supply.

No. of Terminals: 144

The large number of terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK

The flatpack package style helps in saving space and enables dense PCB layouts.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency of 64MHz supports fast processing speeds.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive environments with varying temperatures.

RAM Bytes: 2048

Ample RAM capacity of 2048 bytes for efficient data processing and storage.

Technical Specifications

Microcontrollers F276-CEG-P-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F276-CEG-P-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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