Loading...

F276-CEG-P

STMicroelectronics

F276-CEG-P by STMicroelectronics

F276-CEG-P microcontroller by STMicroelectronics features a 16-bit CPU with a max clock frequency of 64 MHz, supporting up to 144 terminals. It operates within -40 °C to 125 °C and includes ADC channels for versatile applications in automotive systems. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,715

-

-

-

-

Vyrian

USA . 1,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

-

-

-

-

Anansix

USA . 545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

545

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 370 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$0.720

-

-

-

Northwest PG Solutions

USA . 1,319 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

-

10k+ parts

-

1,319

$0.792

-

-

-

IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$21.499

100+ parts

-

1k+ parts

$19.349

10k+ parts

-

1,871

$21.499

-

$19.349

-

MKK Technologies

India . 416 parts In-Stock

1+ parts

$40.427

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$40.427

-

-

-

DigiPath Technology Company

USA . 416 parts In-Stock

1+ parts

$40.427

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$40.427

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,349

-

-

-

-

Microchip USA

USA . 4,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,728

-

-

-

-

Parana Technologies

USA . 2,087 parts In-Stock

1+ parts

-

100+ parts

$25.705

1k+ parts

-

10k+ parts

-

2,087

-

$25.705

-

-

Corphita

USA . 304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

304

-

-

-

-

Overview

Unlock the potential of your projects with the F276-CEG-P microcontroller from STMicroelectronics. Renowned for its quality and reliability, STMicroelectronics delivers robust solutions tailored for automotive applications. This versatile microcontroller boasts exceptional performance and advanced features, ensuring efficient data processing and seamless connectivity. Elevate your designs with confidence, knowing you're backed by a trusted industry leader dedicated to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight characteristics, making the device suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient circuit design, reducing space and improving overall system integration.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides flexibility for various power supply configurations in the application.

Address Bus Width: 24

A 24-bit address bus width enhances the memory addressing capabilities, allowing for larger memory expansions.

Package Shape: SQUARE

The square package shape facilitates easier handling and placement during manufacturing.

Bit Size: 16

A 16-bit architecture strikes a balance between performance and resource utilization, suitable for a variety of applications.

Power Supplies (V): 5

Operating with a standard 5V supply simplifies design and integration with existing systems.

No. of Terminals: 144

A higher number of terminals allows for greater connectivity options in various applications.

Package Style (Meter): FLATPACK

The flatpack style contributes to low-profile designs, perfect for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Allows for a broader range of power supply choices, accommodating different operational scenarios.

Maximum Operating Temperature: 125 °C

High-temperature operation makes it ideal for automotive and industrial environments.

CPU Family: ST10

The ST10 family provides a robust and reliable platform for embedded applications.

Minimum Operating Temperature: -40 °C

Extensive temperature range ensures reliable performance in extreme environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of oxidation.

ADC Channels: YES

Analog-to-digital capabilities add versatility for applications requiring signal processing.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and improves interconnectivity.

ROM Words: 131072

A substantial ROM size allows for significant code storage, enhancing functionality.

Maximum Seated Height: 4.07 mm

A low profile reduces spatial conflicts in densely populated boards.

Width: 28 mm

Compact width facilitates space-saving designs in complex electronics.

External Data Bus Width: 16

A 16-bit data bus supports efficient data transfer rates, enhancing overall system performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Integrated peripherals like timers and PWM channels expand application possibilities without requiring additional components.

Maximum Clock Frequency: 64 MHz

High clock frequency allows for faster processing, improving application responsiveness.

Length: 28 mm

A compact length supports integration into smaller devices without compromising performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring compliant performance in various environmental conditions.

Peripheral IC Type: MICROCONTROLLER

A dedicated microcontroller ensures optimized control and processing capabilities for specific tasks.

RAM Bytes: 2048

Adequate RAM enables efficient data processing and storage during operation.

Technology: CMOS

CMOS technology results in lower power consumption and higher density integration.

Terminal Form: GULL WING

Gull wing terminals facilitate easy PCB assembly and rework.

Analog To Digital Converters: 24-Ch 10-Bit

High-channel ADCs enhance the capability of handling multiple analog inputs efficiently.

Nominal Supply Voltage: 5 V

Standard nominal voltage ensures compatibility with widely used power supplies.

PWM Channels: YES

Integrated PWM channels support control of motors and other peripherals effectively.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Diverse connectivity options enhance communication capabilities with other devices.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and field reprogramming of firmware.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch supports denser layouts, ideal for modern compact designs.

Speed: 64 rpm

Supports low-speed applications while maintaining high reliability over extended periods.

On Chip Program ROM Width: 32

Broader ROM width facilitates efficient memory access and higher performance.

No. of I/O Lines: 111

A high number of I/O lines enables extensive interfacing capability with various components.

Technical Specifications

Microcontrollers F276-CEG-P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F276-CEG-P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3