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ESD051-1BF4

STMicroelectronics

ESD051-1BF4 by STMicroelectronics

ESD051-1BF4 by STMicroelectronics is a bidirectional transient voltage suppressor diode ideal for protecting sensitive electronics. It features a max reverse power dissipation of 110 W, operates b/w -55 °C to 150 °C, and has a breakdown voltage of 5.8 V. This device is perfect for applications requiring robust ESD protection per IEC61000-4-2 standards.

Median Price

$0.118

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 60,000 parts In-Stock

1+ parts

$0.118

100+ parts

$0.018

1k+ parts

-

10k+ parts

-

60,000

$0.118

$0.018

-

-

Mouser Electronics

USA . 29,634 parts In-Stock

1+ parts

$0.140

100+ parts

$0.024

1k+ parts

-

10k+ parts

$0.019

29,634

$0.140

$0.024

-

$0.019

Newark

USA . 55,890 parts In-Stock

1+ parts

$0.144

100+ parts

$0.025

1k+ parts

-

10k+ parts

-

55,890

$0.144

$0.025

-

-

DigiKey

USA . 9,909 parts In-Stock

1+ parts

$0.200

100+ parts

$0.076

1k+ parts

$0.049

10k+ parts

$0.037

9,909

$0.200

$0.076

$0.049

$0.037

Avnet

USA . 150,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150,000

-

-

-

-

Farnell

UK . 55,890 parts In-Stock

1+ parts

-

100+ parts

$0.020

1k+ parts

$0.018

10k+ parts

$0.018

55,890

-

$0.020

$0.018

$0.018

Element14

Singapore . 55,890 parts In-Stock

1+ parts

-

100+ parts

$0.033

1k+ parts

$0.031

10k+ parts

$0.030

55,890

-

$0.033

$0.031

$0.030

EBV Elektronik

Germany . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Verical

USA . 44,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.022

10k+ parts

-

44,690

-

-

$0.022

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,113 parts In-Stock

1+ parts

$0.024

100+ parts

-

1k+ parts

-

10k+ parts

-

3,113

$0.024

-

-

-

Digiode

USA . 949 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

-

10k+ parts

-

949

$0.114

-

-

-

Flip Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Anansix

USA . 2,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,069

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 60,088 parts In-Stock

1+ parts

$0.020

100+ parts

-

1k+ parts

-

10k+ parts

-

60,088

$0.020

-

-

-

IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$0.035

100+ parts

-

1k+ parts

$0.031

10k+ parts

-

2,270

$0.035

-

$0.031

-

MKK Technologies

India . 1,989 parts In-Stock

1+ parts

$0.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,989

$0.066

-

-

-

DigiPath Technology Company

USA . 1,989 parts In-Stock

1+ parts

$0.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,989

$0.066

-

-

-

Corphita

USA . 4,257 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

-

4,257

$0.108

-

-

-

Continental Prestige Electronics

USA . 68,746 parts In-Stock

1+ parts

$0.138

100+ parts

$0.059

1k+ parts

$0.030

10k+ parts

$0.019

68,746

$0.138

$0.059

$0.030

$0.019

Native Components

USA . 364 parts In-Stock

1+ parts

$69.005

100+ parts

-

1k+ parts

-

10k+ parts

$66.245

364

$69.005

-

-

$66.245

Northwest PG Solutions

USA . 1,493 parts In-Stock

1+ parts

$75.905

100+ parts

-

1k+ parts

-

10k+ parts

-

1,493

$75.905

-

-

-

Eastek

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.040

45,000

-

-

-

$0.040

A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Parana Technologies

USA . 397 parts In-Stock

1+ parts

-

100+ parts

$0.042

1k+ parts

-

10k+ parts

-

397

-

$0.042

-

-

Overview

Protect your circuits with the ESD051-1BF4 from STMicroelectronics, a leader in advanced electronic solutions. This robust transient suppression device offers unparalleled reliability, safeguarding sensitive components from voltage spikes and ensuring seamless performance across various applications—from consumer electronics to industrial systems. With its compact design and exceptional clamping capabilities, experience peace of mind knowing your devices are shielded by industry excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection from environmental factors, making the device reliable in various applications.

Configuration: SINGLE

A single configuration means a straightforward design, simplifying integration into electronic circuits and reducing complexity.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, optimizing space and enhancing performance.

Maximum Non Repetitive Peak Reverse Power Dissipation: 110 W

High power dissipation capability ensures the device can handle significant surge events, providing robust transient protection.

Maximum Reverse Current: 0.07 uA

A low reverse current rating indicates excellent leakage characteristics, contributing to the device's efficiency and reliability.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in placement on PCB layouts and can be advantageous for heat dissipation.

Reverse Test Voltage: 5 V

The reverse test voltage confirms the device's capability to withstand voltages, ensuring it can protect circuits effectively.

Number of Terminals: 2

Having just two terminals simplifies circuit design and connections, reducing potential installation errors.

Package Style (Meter): CHIP CARRIER

The chip carrier style is suited for high-density applications and facilitates easier handling during manufacturing processes.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the device to function in challenging environments, increasing its application range.

Minimum Operating Temperature: -55 °C

This low operating temperature ensures the device can be used in extreme cold environments without failure.

Terminal Position: BOTTOM

Bottom terminal positioning enhances thermal performance and makes it compatible with various PCB designs.

Minimum Breakdown Voltage: 5.8 V

The minimum breakdown voltage means the device can effectively clamp over-voltage transients safely above this level.

Reference Standard: IEC61000-4-2

Compliance with this standard signifies the device's reliability in protecting against electrostatic discharge (ESD), assuring customers of its quality.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Being a transient voltage suppressor diode, it is specifically designed to protect sensitive electronics from voltage spikes.

Technology: AVALANCHE

Avalanche technology allows for rapid response to transient events, enhancing the protection of connected circuitry.

Terminal Form: NO LEAD

No lead terminal form minimizes space requirements on the PCB and eliminates lead-related environmental concerns.

Maximum Repetitive Peak Reverse Voltage: 5 V

This indicates the device can handle repetitive transient voltages, ensuring consistent protection over time.

Polarity: BIDIRECTIONAL

Bidirectional operation allows for protection in both directions, making it suitable for AC applications and enhancing flexibility in design.

Maximum Clamping Voltage: 11 V

A maximum clamping voltage of 11 V ensures that devices are protected while allowing normal operation under typical conditions.

Diode Element Material: SILICON

Silicon as the diode element material provides excellent electrical properties and stability, contributing to high performance and reliability.

Technical Specifications

Transient Suppression Devices ESD051-1BF4 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

5.8 V

Maximum Clamping Voltage:

11 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

Maximum Non Repetitive Peak Reverse Power Dissipation:

110 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC61000-4-2

Maximum Repetitive Peak Reverse Voltage:

5 V

Maximum Reverse Current:

.07 uA

Reverse Test Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESD051-1BF4 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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