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ESD0P4RFLE6327XTSA1

Infineon Technologies

ESD0P4RFLE6327XTSA1 by Infineon Technologies

ESD0P4RFLE6327XTSA1 by Infineon Tech: 2-element TRANS VOLTAGE SUPPRESSOR DIODE with 50V max reverse voltage, 6V clamping voltage. AVALANCHE tech for transient suppression in electronics, temp range -55 to 150 °C. Ideal for surface mount applications needing reliable ESD protection.

Median Price

$0.140

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 15,000 parts In-Stock

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Verical

USA . 15,000 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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$0.140

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870

$0.140

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Chip Stock

USA . 5,010 parts In-Stock

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Vyrian

USA . 3,776 parts In-Stock

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Bristol Electronics

USA . 1,731 parts In-Stock

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Digiode

USA . 991 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,875 parts In-Stock

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$0.010

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$0.010

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Semicontronic

India . 14,526 parts In-Stock

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$0.010

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$0.010

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$0.010

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14,526

$0.010

$0.010

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Modulus Dynamics

Lithuania . 28,970 parts In-Stock

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$0.018

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$0.017

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$0.017

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28,970

$0.018

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$0.017

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Aztec Data Supply Inc.

USA . 3,688 parts In-Stock

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$0.020

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Corohmni

South Africa . 462 parts In-Stock

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$0.027

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Continental Prestige Electronics

USA . 4,080 parts In-Stock

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$0.129

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$0.126

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Argo Parts USA

USA . 350 parts In-Stock

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$0.129

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$0.125

350

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$0.125

AZTECH Wire

Italy . 199 parts In-Stock

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$18.680

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Perfect Parts

USA . 100,636 parts In-Stock

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Metaverse IC Inc.

Canada . 53,451 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Benley Electronics

USA . 4,000 parts In-Stock

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Futuretech Components

Singapore . 1,600 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.137

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$0.133

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$0.130

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$0.130

Corphita

USA . 227 parts In-Stock

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Advanced Electronics

New Zealand . 57 parts In-Stock

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Overview

Discover a world of superior quality and reliable protection with the ESD0P4RFLE6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch transient suppression devices that are designed for seamless integration and optimal performance. Whether you're safeguarding sensitive electronic components or ensuring the longevity of your systems, this product offers unrivaled value, benefits, and advantages. Trust in the expertise of Infineon to provide you with the best solutions for all your protection needs.

Feature Benefit Bullets

Config: SEPARATE, 2 ELEMENTS

Having separate elements allows for better protection and reliability as each element can work independently.

Surface Mount: YES

Surface mount devices are easier to install and take up less space on a circuit board.

Package Shape: RECTANGULAR

Rectangular shape can be easily accommodated on a circuit board, making it convenient for installation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this device can withstand harsh operating environments.

Maximum Breakdown Voltage: 9 V

The high breakdown voltage ensures protection against voltage surges and spikes.

Technical Specifications

Transient Suppression Devices ESD0P4RFLE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Maximum Breakdown Voltage:

9 V

Maximum Clamping Voltage:

6 V

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

50 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD0P4RFLE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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