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ESD0P8RFLE6327XTSA1

Infineon Technologies

ESD0P8RFLE6327XTSA1 by Infineon Technologies

Infineon Technologies' ESD0P8RFLE6327XTSA1 is a Transient Suppression Device with separate configuration and 2 elements. It is surface mountable and has a rectangular package shape. With a max breakdown voltage of 15V, it is commonly used as a trans voltage suppressor diode in various applications.

Median Price

$0.116

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$0.116

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$0.116

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Rutronik

Germany . 105,000 parts In-Stock

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Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

USA . 4,921 parts In-Stock

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Bristol Electronics

USA . 2,929 parts In-Stock

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Atlantic Semiconductor

USA . 2,929 parts In-Stock

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Ashlea Components Ltd

UK . 1,539 parts In-Stock

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Digiode

USA . 37 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

1+ parts

$0.010

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Argo Parts USA

USA . 2,043 parts In-Stock

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$0.116

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$0.112

2,043

$0.116

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Netroflash

USA . 500 parts In-Stock

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$0.116

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$0.113

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500

$0.116

$0.113

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Continental Prestige Electronics

USA . 306 parts In-Stock

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$0.116

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306

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Modulus Dynamics

Lithuania . 14,845 parts In-Stock

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$0.127

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$0.122

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$0.117

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Corohmni

South Africa . 6 parts In-Stock

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$0.162

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6

$0.162

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$0.183

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$0.167

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$0.150

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300

$0.183

$0.167

$0.150

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Aztec Data Supply Inc.

USA . 3,858 parts In-Stock

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$0.186

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Semicontronic

India . 726 parts In-Stock

1+ parts

$1.010

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$0.985

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$0.980

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726

$1.010

$0.985

$0.980

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AZTECH Wire

Italy . 218 parts In-Stock

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$12.619

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Perfect Parts

USA . 87,062 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Corphita

USA . 246 parts In-Stock

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iodParts Technologies Inc.

India . 122 parts In-Stock

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Overview

Discover the ESD0P8RFLE6327XTSA1 by Infineon Technologies, a high-quality Transient Suppression Device designed to protect your electronics from harmful voltage spikes. With its separate configuration and two elements, this surface mount device offers reliable protection in a compact rectangular package. Whether it's for automotive, industrial, or consumer applications, this chip carrier device is your ideal solution. Benefit from its maximum operating temperature of 150 °C and superior performance in a wide temperature range from -55 °C. Experience the value and peace of mind provided by Infineon Technologies, a trusted manufacturer known for their cutting-edge technology and exceptional reliability. Stay protected with the ESD0P8RFLE6327XTSA1 and ensure the longevity of your valuable electronic devices.

Feature Benefit Bullets

Config SEPARATE:

This product has a separate configuration, allowing for efficient and focused transient suppression. This makes it a good choice for protecting sensitive electronic devices.

Surface Mount YES:

With surface mount capability, this product can be easily integrated into various PCB designs, providing convenience and versatility for manufacturers.

Package Shape RECTANGULAR:

The rectangular package shape of this product ensures efficient use of board space and facilitates easy placement during assembly.

No. of Terminals 4:

Equipped with four terminals, this product offers enhanced connectivity, enabling secure and reliable electrical connections in a variety of applications.

Package Style (Meter) CHIP CARRIER:

The chip carrier package style of this product provides improved thermal performance and protection against environmental factors, making it suitable for demanding conditions.

Maximum Operating Temperature 150 °C:

With a maximum operating temperature of 150°C, this product can withstand high temperature environments, ensuring reliable performance in challenging conditions.

Minimum Operating Temperature -55 °C:

The product's minimum operating temperature of -55°C allows for operation in extremely cold environments, making it suitable for diverse applications.

Terminal Finish GOLD:

The gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and optimal performance in various operating conditions.

Terminal Position BOTTOM:

The bottom terminal position facilitates easy and secure installation, ensuring efficient assembly processes and reliable connections in the final product.

Maximum Breakdown Voltage 15 V:

This product has a maximum breakdown voltage of 15V, providing effective protection against voltage spikes and transients, safeguarding sensitive electronic components.

Diode Type TRANS VOLTAGE SUPPRESSOR DIODE:

Equipped with a trans voltage suppressor diode, this product is specifically designed to suppress and divert high voltage transients, offering reliable protection for electronic circuits.

Technology AVALANCHE:

The avalanche technology employed in this product provides quick response and high energy handling capabilities, ensuring efficient transient suppression and reliable operation.

Terminal Form NO LEAD:

With a no-lead terminal form, this product offers a lead-free and environmentally friendly solution, meeting regulatory requirements and promoting sustainability.

No. of Elements 2:

Featuring two elements, this product provides redundancy and increased transient suppression capacity, enhancing the overall protection for sensitive electronic devices.

Maximum Repetitive Peak Reverse Voltage 50 V:

The maximum repetitive peak reverse voltage of 50V enables this product to handle high peak voltage transients effectively, offering reliable protection against voltage surges.

Moisture Sensitivity Level (MSL) 1:

With an MSL rating of 1, this product demonstrates excellent moisture resistance, ensuring reliable performance and durability in humid environments.

Polarity UNIDIRECTIONAL:

The unidirectional polarity of this product allows for the suppression of transients in one direction, providing focused protection for sensitive electronic components.

Maximum Clamping Voltage 12 V:

This product has a maximum clamping voltage of 12V, which limits voltage spikes during transients to a safe level, preventing damage to connected devices.

Diode Element Material SILICON:

Made of silicon, this product offers excellent electrical characteristics, superior thermal stability, and high reliability, making it an ideal choice for transient suppression applications.

Technical Specifications

Transient Suppression Devices ESD0P8RFLE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Maximum Breakdown Voltage:

15 V

Maximum Clamping Voltage:

12 V

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

50 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD0P8RFLE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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