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E-TEA3718SFP

STMicroelectronics

E-TEA3718SFP by STMicroelectronics

E-TEA3718SFP by STMicroelectronics is a versatile stepper motor controller with a 5V nominal voltage and operates b/w 0 °C to 70°C. It features a compact SO package with 20 terminals, supporting max output current of 1.5A. Ideal for motion control applications in commercial settings.

Median Price

$3.094

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 560 parts In-Stock

1+ parts

$2.197

100+ parts

$1.944

1k+ parts

$1.927

10k+ parts

-

560

$2.197

$1.944

$1.927

-

DigiKey

USA . 998 parts In-Stock

1+ parts

$3.990

100+ parts

$2.673

1k+ parts

$2.239

10k+ parts

$2.172

998

$3.990

$2.673

$2.239

$2.172

Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$3.990

100+ parts

$2.480

1k+ parts

$2.180

10k+ parts

$2.120

26

$3.990

$2.480

$2.180

$2.120

Verical

USA . 558 parts In-Stock

1+ parts

-

100+ parts

$1.949

1k+ parts

$1.932

10k+ parts

-

558

-

$1.949

$1.932

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Avnet

USA . 280 parts In-Stock

1+ parts

-

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-

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280

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Distributors (In-Stock)

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Vyrian

USA . 116 parts In-Stock

1+ parts

$1.949

100+ parts

-

1k+ parts

-

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116

$1.949

-

-

-

Digiode

USA . 3,644 parts In-Stock

1+ parts

$2.087

100+ parts

-

1k+ parts

-

10k+ parts

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3,644

$2.087

-

-

-

Chip Stock

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

-

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ComSIT Distribution GmbH

Germany . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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900

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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520

-

-

-

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Bristol Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$1.756

1k+ parts

$1.543

10k+ parts

-

520

-

$1.756

$1.543

-

Dan-Mar Components

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

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520

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Anansix

USA . 207 parts In-Stock

1+ parts

-

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207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 148 parts In-Stock

1+ parts

$1.977

100+ parts

-

1k+ parts

-

10k+ parts

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148

$1.977

-

-

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

1+ parts

$3.094

100+ parts

-

1k+ parts

$2.785

10k+ parts

-

2,129

$3.094

-

$2.785

-

MKK Technologies

India . 1,935 parts In-Stock

1+ parts

$5.818

100+ parts

-

1k+ parts

-

10k+ parts

-

1,935

$5.818

-

-

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DigiPath Technology Company

USA . 1,935 parts In-Stock

1+ parts

$5.818

100+ parts

-

1k+ parts

-

10k+ parts

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1,935

$5.818

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 19,798 parts In-Stock

1+ parts

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19,798

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Kepictronics

USA . 6,376 parts In-Stock

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6,376

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Microchip USA

USA . 4,793 parts In-Stock

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4,793

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Perfect Parts

USA . 3,350 parts In-Stock

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3,350

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Northwest PG Solutions

USA . 1,858 parts In-Stock

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1,858

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Parana Technologies

USA . 1,314 parts In-Stock

1+ parts

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$3.699

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1,314

-

$3.699

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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900

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Eastek

USA . 680 parts In-Stock

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680

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Cyclops Electronics Ltd (Excess)

UK . 425 parts In-Stock

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425

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Native Components

USA . 367 parts In-Stock

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367

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GreenTree Electronics

Israel . 40 parts In-Stock

1+ parts

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40

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Overview

Unlock unparalleled precision in motion control with the E-TEA3718SFP from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics combines cutting-edge technology with robust design, ensuring reliability across diverse applications—from robotics to industrial automation. Elevate your projects with this compact, efficient controller that delivers exceptional performance while simplifying integration, empowering you to achieve more with less effort!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Being a surface mount device, it allows for compact designs and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and provides ample space for electrical connections.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V makes it compatible with standard digital systems, enhancing its versatility.

Power Supplies (V): 5, 10/45

The ability to operate on a range of power supplies increases its adaptability in different applications.

No. of Terminals: 20

Having 20 terminals allows for more functionality and connections, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving designs, ideal for compact electronics.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in moderately harsh environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows it to function effectively in standard room temperatures.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning simplifies mounting and soldering, enhancing ease of use in assembly.

Maximum Seated Height: 2.65 mm

A low maximum seated height guarantees compatibility with low-profile designs, saving valuable PCB space.

Width: 7.5 mm

A width of 7.5 mm enables high-density placement on PCBs, essential for compact device designs.

Other IC type: STEPPER MOTOR CONTROLLER

Specializing as a stepper motor controller, it is ideal for precision control applications in robotics and automation.

Minimum Supply Voltage (Vsup): 4.75 V

Operating with a minimum supply voltage of 4.75V allows it to work effectively in low-voltage scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for reliable soldering during assembly, ensuring strong connections.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250 °C is compatible with most lead-free solder processes, making it suitable for modern manufacturing.

Length: 12.8 mm

At 12.8 mm in length, it strikes a balance between size and performance, fitting well in various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability in typical operating environments, ideal for consumer electronics.

Maximum Supply Current (Isup): 25 mA

Maximum supply current of 25 mA is efficient for low-power designs, suitable for battery-operated devices.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5 A, it allows for controlling robust motors with significant torque.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and efficiency, beneficial for motion control applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering reliability in surface mount applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with a wide range of PCB layouts and assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring proper handling precautions during manufacturing.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V provides a margin for voltage variations, ensuring stable operation.

Technical Specifications

Motion Control ICs E-TEA3718SFP attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES A 10 TO 45 V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5,10/45

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

E-TEA3718SFP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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