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E-STA2051TR

STMicroelectronics

E-STA2051TR by STMicroelectronics

E-STA2051TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in extreme temps from -40 °C to 85°C. It features 64 terminals, supports PWM channels, and is ideal for industrial applications requiring robust performance. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,428

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-

-

-

Digiode

USA . 4,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,031

-

-

-

-

Anansix

USA . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

664

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$57.038

100+ parts

-

1k+ parts

$51.334

10k+ parts

-

1,673

$57.038

-

$51.334

-

MKK Technologies

India . 2,162 parts In-Stock

1+ parts

$107.257

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

$107.257

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-

-

DigiPath Technology Company

USA . 2,162 parts In-Stock

1+ parts

$107.257

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

$107.257

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-

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Corphita

USA . 2,359 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,359

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-

-

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Northwest PG Solutions

USA . 1,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.450

10k+ parts

-

1,037

-

-

$3.450

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Parana Technologies

USA . 678 parts In-Stock

1+ parts

-

100+ parts

$68.198

1k+ parts

-

10k+ parts

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678

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$68.198

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Native Components

USA . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.414

10k+ parts

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332

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$3.414

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Overview

Unlock unparalleled performance with the E-STA2051TR microcontroller from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for versatility and reliability, this 32-bit powerhouse thrives in diverse applications, from industrial automation to smart IoT devices. With robust temperature tolerance and superior packaging, it ensures longevity and efficiency, delivering exceptional value that empowers your projects to excel in any environment—elevate your design with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability in various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and facilitates automated assembly.

Maximum Supply Voltage: 3.6 V

Working within a low voltage range enhances energy efficiency and is suitable for battery-operated devices.

Package Shape: SQUARE

The square shape provides an even distribution of thermal and electrical performance.

Bit Size: 32

The 32-bit architecture allows for complex computations and improved performance in applications.

No. of Terminals: 64

A higher number of terminals provides flexibility in connectivity and circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design makes it suitable for compact and space-constrained applications.

Minimum Supply Voltage: 2.7 V

The low minimum voltage requirement broadens its usability in various applications without risking power failure.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it capable of functioning reliably in harsh environments.

Minimum Operating Temperature: -40 °C

Operation in extreme cold conditions expands its applicability in outdoor and industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures excellent corrosion resistance and improved durability of connections.

Terminal Position: QUAD

Quad terminal positioning facilitates easier access for soldering and assembly.

Maximum Seated Height: 1.6 mm

The low seated height contributes to overall compactness in device design.

Width: 14 mm

The compact width makes it suitable for tight spaces while maintaining performance.

Maximum Clock Frequency: 66 MHz

A high clock frequency supports faster processing speeds, enhancing overall application performance.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to endure during reflow soldering processes increases manufacturing reliability.

Peak Reflow Temperature °C: 260

Designed to withstand high temperatures during reflow, ensuring compatibility with modern assembly methods.

Length: 14 mm

A short length contributes to a compact form factor, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built for durability and reliability in tough operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture usually results in higher efficiency and speed in processing tasks.

Technology: CMOS

CMOS technology enables low power consumption, making it suitable for portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable electrical connections.

PWM Channels: YES

Presence of PWM channels allows for precise control in motor speed and light dimming applications.

ROM Programmability: FLASH

Flash programmable ROM is beneficial for firmware updates and customization in various applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for a denser arrangement of circuits on the PCB.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that it can be handled in typical environments but requires proper storage/sealing against moisture.

Speed: 66 rpm

The operational speed is adequate for many control applications without straining the system.

No. of I/O Lines: 32

A good number of I/O lines provides ample I/O options for interfacing with various peripherals.

Technical Specifications

Microcontrollers E-STA2051TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

E-STA2051TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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