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E-STA2051

STMicroelectronics

E-STA2051 by STMicroelectronics

E-STA2051 by STMicroelectronics is a 32-bit microcontroller designed for industrial applications, operating b/w -40 °C to 85°C. It features a max supply voltage of 3.6V, 66 MHz clock speed, and offers 32 I/O lines for versatile connectivity. Its low-profile package ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,582 parts In-Stock

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4,582

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Digiode

USA . 1,059 parts In-Stock

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1,059

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Anansix

USA . 277 parts In-Stock

1+ parts

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277

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

1+ parts

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80

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ComSIT USA

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 708 parts In-Stock

1+ parts

$0.723

100+ parts

-

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-

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708

$0.723

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Northwest PG Solutions

USA . 1,883 parts In-Stock

1+ parts

$0.795

100+ parts

-

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1,883

$0.795

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Microchip USA

USA . 258 parts In-Stock

1+ parts

$1.000

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-

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258

$1.000

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AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$17.150

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759

$17.150

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IDEA Electronic Components Group

UK . 1,423 parts In-Stock

1+ parts

$28.113

100+ parts

-

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$25.302

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1,423

$28.113

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$25.302

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MKK Technologies

India . 915 parts In-Stock

1+ parts

$52.865

100+ parts

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915

$52.865

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DigiPath Technology Company

USA . 915 parts In-Stock

1+ parts

$52.865

100+ parts

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915

$52.865

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Parana Technologies

USA . 230 parts In-Stock

1+ parts

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$33.614

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230

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$33.614

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Corphita

USA . 179 parts In-Stock

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179

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Overview

Elevate your designs with the E-STA2051 microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Engineered for versatility, this 32-bit powerhouse excels in industrial applications, offering robust performance even in extreme conditions. Enjoy seamless integration, extended operational life, and enhanced efficiency, ensuring your projects stand out in today's competitive landscape. Trust STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliable performance in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for smaller circuit board designs and facilitates automated assembly processes, making the product suitable for compact applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances energy efficiency, making it ideal for battery-powered applications.

Package Shape: SQUARE

The square package shape allows for efficient placement and component density on printed circuit boards.

Bit Size: 32

A 32-bit architecture enables advanced computational capabilities, making the microcontroller suitable for complex applications.

No. of Terminals: 64

A higher number of terminals provides additional connectivity options, allowing the microcontroller to interface with numerous peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design saves space and is ideal for applications where height is a constraint.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes the microcontroller suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this microcontroller can function well in extreme cold, enhancing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent reliability and ensures high-quality electrical connections.

Terminal Position: QUAD

Quad terminals allow for efficient space utilization and straightforward routing on circuit boards.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact design, making it suitable for applications with space constraints.

Width: 14 mm

A compact width enhances compatibility with various board designs while optimizing layout density.

Maximum Clock Frequency: 66 MHz

A high clock frequency supports faster processing speeds, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with modern soldering processes, reducing manufacturing complications.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capability allows it to be used with lead-free soldering processes, making it more environmentally friendly.

Length: 14 mm

The compact length makes it ideal for integration into small electronic devices where space is a premium.

Temperature Grade: INDUSTRIAL

As an industrial-grade component, it is designed for reliability in demanding environments, ensuring long service life.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency, making it suitable for power-sensitive applications.

Technology: CMOS

CMOS technology promotes lower power consumption and higher integration levels, supporting modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide strong solder joints and easier handling during assembly.

PWM Channels: YES

The inclusion of PWM channels enables dynamic control for applications like motor control or LED dimming.

ROM Programmability: FLASH

Flash programmability offers flexibility and ease of updates or modifications to firmware.

Terminal Pitch: 0.8 mm

The fine terminal pitch supports high-density packaging, making it suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for reasonable handling during production.

Speed: 66 rpm

The specified speed offers good performance for various applications, ensuring efficient operation.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller can interface with a multitude of sensors and devices, enhancing its application scope.

Technical Specifications

Microcontrollers E-STA2051 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

E-STA2051 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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