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ACST10-7SFP

STMicroelectronics

ACST10-7SFP by STMicroelectronics

ACST10-7SFP by STMicroelectronics is a robust power management IC designed for automotive applications. It operates b/w -40 °C and 125 °C, features a flange mount with 3 terminals, and supports power supply circuits efficiently. Ideal for reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,335

-

-

-

-

Digiode

USA . 2,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

-

-

-

-

Anansix

USA . 1,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,647

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 824 parts In-Stock

1+ parts

$3.301

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$3.301

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-

-

Ampacity Inc.

Singapore . 1,461 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$7.500

-

-

-

IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$16.066

100+ parts

-

1k+ parts

$14.459

10k+ parts

-

2,302

$16.066

-

$14.459

-

AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$16.970

100+ parts

-

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-

10k+ parts

-

328

$16.970

-

-

-

MKK Technologies

India . 297 parts In-Stock

1+ parts

$30.211

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$30.211

-

-

-

DigiPath Technology Company

USA . 297 parts In-Stock

1+ parts

$30.211

100+ parts

-

1k+ parts

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10k+ parts

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297

$30.211

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-

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Corphita

USA . 828 parts In-Stock

1+ parts

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1k+ parts

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828

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Parana Technologies

USA . 677 parts In-Stock

1+ parts

-

100+ parts

$19.209

1k+ parts

-

10k+ parts

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677

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$19.209

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Native Components

USA . 253 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.911

10k+ parts

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253

-

-

$2.911

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Overview

Elevate your power management solutions with the ACST10-7SFP from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for automotive applications, this robust IC ensures reliability even in extreme temperatures, enhancing system efficiency and longevity. Its user-friendly flange mount design simplifies integration, providing you with unmatched performance and peace of mind. Experience the superior quality and innovation that STMicroelectronics delivers, empowering your projects to thrive!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, facilitating easier integration into compact designs.

No. of Terminals: 3

Having three terminals simplifies connections, reducing potential points of failure and easing the assembly process.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides additional stability and secure mounting options, making it ideal for applications where vibration or movement is a concern.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this IC can function reliably in high-temperature environments, suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures functionality in extreme cold conditions, making it suitable for automotive and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, promoting longevity and reliable performance over time.

Terminal Position: SINGLE

A single terminal position can simplify designs and reduce the complexity of PCB layouts, which is advantageous for ease of manufacturing.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC enhances the reliability and performance of power management systems, critical for various electronic applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent reliability and performance standards required for vehicles, ensuring safe and durable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and enhance electrical connection reliability, making them suitable for demanding environments.

Technical Specifications

Power Management ICs ACST10-7SFP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XSFM-T3

JESD-609 Code:

e3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

ACST10-7SFP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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