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74VHCT373AMTR

STMicroelectronics

74VHCT373AMTR by STMicroelectronics

74VHCT373AMTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 14.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and supports a max load capacitance of 50 pF. This CMOS device features a compact SO package, making it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,798 parts In-Stock

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8,798

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Digiode

USA . 2,806 parts In-Stock

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2,806

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Anansix

USA . 2,772 parts In-Stock

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2,772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 433 parts In-Stock

1+ parts

$0.810

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433

$0.810

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Northwest PG Solutions

USA . 1,837 parts In-Stock

1+ parts

$0.891

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1,837

$0.891

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Andel Nordic

Denmark . 1,454 parts In-Stock

1+ parts

$10.303

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-

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$9.890

10k+ parts

$9.890

1,454

$10.303

-

$9.890

$9.890

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$19.260

100+ parts

$17.527

1k+ parts

$15.793

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-

1,000

$19.260

$17.527

$15.793

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AZTECH Wire

Italy . 258 parts In-Stock

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$21.530

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258

$21.530

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Corohmni

South Africa . 148 parts In-Stock

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$24.424

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148

$24.424

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IDEA Electronic Components Group

UK . 970 parts In-Stock

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$29.926

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$26.933

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970

$29.926

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$26.933

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Microchip USA

USA . 171 parts In-Stock

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$34.845

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171

$34.845

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MKK Technologies

India . 2,369 parts In-Stock

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$56.273

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2,369

$56.273

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DigiPath Technology Company

USA . 2,369 parts In-Stock

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$56.273

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2,369

$56.273

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Component Stockers USA

USA . 413 parts In-Stock

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$99.990

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413

$99.990

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Corphita

USA . 3,177 parts In-Stock

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Parana Technologies

USA . 618 parts In-Stock

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$35.781

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618

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$35.781

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Overview

Unlock unparalleled performance and reliability with the 74VHCT373AMTR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust bus driver transceiver delivers exceptional speed and efficiency, making it perfect for a variety of applications, from industrial automation to consumer electronics. With its advanced design and military-grade temperature range, you can count on it for superior quality and longevity, ensuring your projects run smoothly and efficiently. Elevate your designs with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 14.5 ns

With a low propagation delay, this bus driver can handle rapid signal changes efficiently, ensuring high-speed communication in digital circuits.

Surface Mount: YES

Being surface mountable allows for compact designs and optimized PCB space usage, making this component ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier placement and assembly on printed circuit boards (PCBs), contributing to efficient manufacturing.

No. of Bits: 8

An 8-bit configuration allows for the transmission of data across multiple lines simultaneously, improving overall data throughput.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5 V makes this bus driver compatible with standard digital logic levels, simplifying integration into existing systems.

Load Capacitance (CL): 50 pF

A low load capacitance allows for faster switching and improved performance in high-speed applications, reducing signal degradation.

Power Supplies (V): 5

Compatible with typical power supplies facilitates ease of use and interoperation with existing hardware.

No. of Terminals: 20

A 20-terminal design provides ample connections for multiple input/output operations, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline design ensures space efficiency and enables high-density PCBs, meeting the demands of compact electronic devices.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps allows for driving larger loads, increasing the versatility of applications this component can support.

Propagation Delay (tpd): 14.5 ns

Consistent low propagation delay across both specifications reiterates reliability and performance consistency in various operational scenarios.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures enhances reliability in harsh environments, making this bus driver suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output features improve bus utilization and prevent conflicts in shared bus architectures, making it ideal for multi-device communication setups.

Minimum Operating Temperature: -55 °C

Operating down to -55 °C ensures functionality in extreme conditions, appealing for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning simplifies device mounting on the PCB and enhances thermal management.

No. of Ports: 2

Having two ports allows for flexible routing and configuration options, making this chip versatile in system design.

Maximum Seated Height: 2.65 mm

Low maximum seated height contributes to a slim profile, essential for modern compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm ensures compatibility with common PCB layouts, making mounting and integration straightforward.

Output Polarity: TRUE

True output polarity ensures compatibility with prevalent logic standards, facilitating easy integration into digital systems.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage allows for operation in battery-powered applications, maximizing power efficiency.

Length: 12.8 mm

A compact length of 12.8 mm ensures it fits well in space-constrained designs, essential for portable electronics.

Temperature Grade: MILITARY

Military-grade components guarantee performance and reliability in extreme conditions, ideal for defense and aerospace applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide mechanical stability, enhancing device reliability.

Packing Method: TR

Tape and reel packing method enhances manufacturing efficiency and facilitates automated assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm accommodates smaller board designs while maintaining reliable electrical connections.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for some flexibility in power supply architecture, accommodating slight variations.

Technical Specifications

Bus Driver & Transceivers 74VHCT373AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74VHCT373AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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