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74VHCT244AMTR

STMicroelectronics

74VHCT244AMTR by STMicroelectronics

74VHCT244AMTR by STMicroelectronics is a CMOS bus driver featuring a 9.5 ns propagation delay and operates at a nominal voltage of 5V. With 4 bits and dual ports, it supports efficient data transmission in compact electronic designs. Ideal for military applications, it ensures reliable performance across -55 °C to 125°C.

Median Price

$7.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 14 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

1k+ parts

$5.000

10k+ parts

-

14

$7.690

$5.770

$5.000

-

Vyrian

USA . 7,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,241

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-

-

Digiode

USA . 3,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,172

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-

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Anansix

USA . 1,520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,520

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 557 parts In-Stock

1+ parts

$5.198

100+ parts

-

1k+ parts

$4.990

10k+ parts

$4.990

557

$5.198

-

$4.990

$4.990

AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

473

$8.800

-

-

-

IDEA Electronic Components Group

UK . 69 parts In-Stock

1+ parts

$26.235

100+ parts

-

1k+ parts

$23.611

10k+ parts

-

69

$26.235

-

$23.611

-

Microchip USA

USA . 371 parts In-Stock

1+ parts

$28.020

100+ parts

$28.020

1k+ parts

$28.020

10k+ parts

$28.020

371

$28.020

$28.020

$28.020

$28.020

MKK Technologies

India . 33 parts In-Stock

1+ parts

$49.333

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$49.333

-

-

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DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

$49.333

100+ parts

-

1k+ parts

-

10k+ parts

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33

$49.333

-

-

-

Component Stockers USA

USA . 332 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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332

$99.990

-

-

-

Corphita

USA . 2,605 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,605

-

-

-

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Native Components

USA . 528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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528

-

-

-

-

Parana Technologies

USA . 428 parts In-Stock

1+ parts

-

100+ parts

$31.368

1k+ parts

-

10k+ parts

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428

-

$31.368

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-

Northwest PG Solutions

USA . 105 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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105

-

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Overview

Unlock unparalleled performance with the 74VHCT244AMTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This advanced bus driver and transceiver enhances system efficiency and reliability while supporting a wide range of applications, from automotive to industrial automation. Enjoy rapid signal processing, robust temperature resilience, and seamless integration—all within a compact design. Elevate your projects with a trusted component that delivers exceptional value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's reliability and longevity in various environments.

Propagation Delay At Nominal Supply: 9.5 ns

With a low propagation delay of 9.5 ns, this bus driver & transceiver ensures fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, maximizing space usage while ensuring reliable connections.

No. of Functions: 2

Having two functions integrated into one package increases versatility and reduces component count on the PCB.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient space utilization and can be easily aligned during PCB assembly.

No. of Bits: 4

The 4-bit design allows for efficient data handling while keeping power consumption low, fitting well with various digital applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard in many digital circuits, ensuring compatibility and ease of integration.

Load Capacitance (CL): 50 pF

Having a load capacitance of 50 pF helps in maintaining signal integrity and ensures compatibility with various loads.

Power Supplies (V): 5

The requirement for a 5V power supply simplifies the design process and makes it easier to utilize in common digital applications.

No. of Terminals: 20

With 20 terminals, this device accommodates multiple connections, enhancing its functionality in complex circuitry.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes board space usage while ensuring adequate performance and heat dissipation.

Maximum I (ol): 8 Amp

The capability to handle up to 8 Amps makes this transceiver suitable for devices requiring high current, like motor drivers.

Propagation Delay (tpd): 9.5 ns

Again, the 9.5 ns propagation delay confirms rapid switching speeds, which is crucial for high-frequency applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C makes this product suitable for harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for better control over bus connections, facilitating smooth data flow in multi-device environments.

Minimum Operating Temperature: -55 °C

An extended operating temperature range ensures that this component performs reliably in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances contact reliability, ensuring durability.

Terminal Position: DUAL

Dual terminal position allows for flexible layout designs, accommodating various PCB configurations with ease.

No. of Ports: 2

Having two ports enhances communication capabilities, allowing for efficient data sharing between devices.

Maximum Seated Height: 2.65 mm

A low maximum seated height contributes to a thin profile, beneficial for compact designs.

Width: 7.5 mm

The moderate width ensures it fits well on most PCBs without consuming excessive space.

Output Polarity: TRUE

True output polarity indicates predictable performance in logic levels, enhancing reliability in digital systems.

Minimum Supply Voltage (Vsup): 4.5 V

The operational range starting from 4.5V allows flexibility in power supply options without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

An allowed peak reflow time of 30 seconds indicates compatibility with modern soldering techniques, ensuring good assembly yield.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this component is designed to withstand high-temperature soldering processes, enhancing reliability.

Length: 12.8 mm

The compact length contributes to space-saving designs, particularly useful in tightly packed electronic systems.

Temperature Grade: MILITARY

The military-grade temperature specification assures performance under extreme conditions, making it ideal for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed performance, which is essential in modern electronics.

Terminal Form: GULL WING

Gull wing terminals offer improved soldering characteristics, enhancing robustness and reliability in PCB assembly.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies automated assembly processes, improving efficiency in production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy handling and placement in PCB layouts, ensuring tight yet accessible connections.

Control Type: ENABLE LOW

Low enable control simplifies circuit design and ensures consistent operation within logical systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate sensitivity to moisture, guiding proper storage and handling practices to maintain reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers headroom for supply variations, ensuring stable device operation under fluctuating conditions.

Technical Specifications

Bus Driver & Transceivers 74VHCT244AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHCT244AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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