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74VHCT00AMTR

STMicroelectronics

74VHCT00AMTR by STMicroelectronics

74VHCT00AMTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9 ns and operates at a nominal voltage of 5V. It features four functions with dual inputs, ideal for high-speed digital applications. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,730 parts In-Stock

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5,730

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Anansix

USA . 403 parts In-Stock

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403

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Digiode

USA . 156 parts In-Stock

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156

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Distributors (Availability)

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Native Components

USA . 155 parts In-Stock

1+ parts

$0.728

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155

$0.728

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Northwest PG Solutions

USA . 2,124 parts In-Stock

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$0.801

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2,124

$0.801

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IDEA Electronic Components Group

UK . 1,995 parts In-Stock

1+ parts

$17.107

100+ parts

-

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$15.397

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1,995

$17.107

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$15.397

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AZTECH Wire

Italy . 354 parts In-Stock

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$18.340

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354

$18.340

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Microchip USA

USA . 298 parts In-Stock

1+ parts

$26.930

100+ parts

$26.930

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$26.930

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$26.930

298

$26.930

$26.930

$26.930

$26.930

MKK Technologies

India . 1,215 parts In-Stock

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$32.169

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$32.169

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DigiPath Technology Company

USA . 1,215 parts In-Stock

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$32.169

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1,215

$32.169

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Ampacity Inc.

Singapore . 753 parts In-Stock

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$65.000

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753

$65.000

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Perfect Parts

USA . 32,077 parts In-Stock

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32,077

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Cyclops Electronics Ltd (Excess)

UK . 12,500 parts In-Stock

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Corphita

USA . 622 parts In-Stock

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Parana Technologies

USA . 444 parts In-Stock

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$20.454

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$20.454

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Overview

Unlock the potential of your projects with the 74VHCT00AMTR from STMicroelectronics—a leader in cutting-edge technology. Renowned for exceptional quality and reliability, this versatile logic gate is perfect for high-speed applications, delivering rapid response times and robust performance even in extreme conditions. Benefit from its compact design, ease of integration, and power efficiency, ensuring your designs are not only advanced but also cost-effective. Choose excellence; choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay allows for faster signal processing, ensuring optimal performance in high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient placement on printed circuit boards (PCBs), improving manufacturing processes.

No. of Functions: 4

With four functions available, this product offers versatility, allowing designers to realize multiple logic operations using a single component.

No. of Inputs: 2

Having two inputs enables simpler circuit designs, making it a good choice for applications requiring basic logic functions.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, facilitating easier integration into various circuit layouts.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is widely used, making the product compatible with a vast array of systems and reducing design complexity.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps maintain good performance and stability in electronic circuits, especially in digital logic designs.

Power Supplies (V): 5

Single 5V power supply operation simplifies design and reduces the number of components needed for power distribution.

No. of Terminals: 14

With 14 terminals, the product supports multiple connections, enhancing its functionality and integration into complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern compact electronics, allowing for space-efficient designs without sacrificing functionality.

Maximum I (ol): 8 Amp

The ability to handle up to 8 amps makes this logic gate suitable for high-power applications where higher driving capabilities are required.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can function reliably in challenging thermal environments, ensuring stability.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the device to be used in extreme conditions, making it suitable for military and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent corrosion resistance and reliability of electrical connections, enhancing durability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on PCBs, facilitating easier design and assembly.

Maximum Seated Height: 1.75 mm

The low seated height contributes to the product's compact design, making it easier to fit in tight spaces within electronic devices.

Width: 3.9 mm

A narrow width enables efficient use of board space, contributing to the overall compactness of electronic assemblies.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for flexible power supply design, accommodating various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature indicates strong thermal stability during soldering processes, ensuring product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature means this product can withstand modern PCB soldering techniques without compromising performance.

Length: 8.65 mm

The compact length enhances the product's suitability for tight spaces in PCB layouts, aiding in efficient design.

Temperature Grade: MILITARY

The military temperature grade indicates high reliability and robustness, making this product ideal for critical and high-reliability applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated and sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form ensures easy soldering and reliable connections, simplifying assembly processes.

Packing Method: TR

The tape and reel packing method allows for efficient packaging, storage, and automated assembly, enhancing workflow efficiency.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard size for many applications, ensuring compatibility with various PCB layouts and designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for flexibility in integrations with devices requiring slightly higher voltage levels.

Technical Specifications

Logic Gates 74VHCT00AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHCT00AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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