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74VHC541TTR

STMicroelectronics

74VHC541TTR by STMicroelectronics

74VHC541TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8 ns, operating at a nominal voltage of 3.3 V. It features a compact SOIC package and supports true output polarity. Ideal for high-speed data transmission in military applications, it operates b/w -55 °C to 125°C.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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R&J Components

USA . 10,000 parts In-Stock

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Vyrian

USA . 7,907 parts In-Stock

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Digiode

USA . 4,898 parts In-Stock

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Bristol Electronics

USA . 2,943 parts In-Stock

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Flex Direct, LLC

USA . 1,590 parts In-Stock

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Anansix

USA . 409 parts In-Stock

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Native Components

USA . 608 parts In-Stock

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$0.497

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Northwest PG Solutions

USA . 947 parts In-Stock

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$0.546

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$0.482

947

$0.546

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$0.482

Andel Nordic

Denmark . 206 parts In-Stock

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$2.411

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$2.314

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$2.314

206

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$2.314

Microchip USA

USA . 378 parts In-Stock

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$8.544

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IDEA Electronic Components Group

UK . 1,359 parts In-Stock

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$9.394

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$8.455

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AZTECH Wire

Italy . 1,158 parts In-Stock

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$16.040

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MKK Technologies

India . 1,554 parts In-Stock

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$17.665

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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Perfect Parts

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Corphita

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Parana Technologies

USA . 1,296 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 789 parts In-Stock

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Kepictronics

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Overview

Elevate your designs with the 74VHC541TTR from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for quality and reliability, STMicro offers exceptional performance with low propagation delays, ensuring efficient data transfer for a variety of applications—from automotive to industrial systems. With its compact, robust design and military-grade temperature tolerance, this device guarantees durability without compromising on efficiency, making it an invaluable asset for any project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay enhances performance, making this device suitable for high-speed operations.

Surface Mount: YES

Surface mount technology facilitates compact designs and automated assembly, saving space on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient circuit layout and optimal use of PCB space.

No. of Bits: 8

An 8-bit data bus supports a wider range of data transfer, promoting versatility in applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal 3.3V makes this device compatible with modern low-voltage designs.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for effective signal integrity and reduces noise in the circuit.

Power Supplies (V): 2/5.5

The device can operate over a wide voltage range, making it adaptable to different power supply configurations.

No. of Terminals: 20

With 20 terminals, the package can accommodate various signal connections, increasing its utility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design maximizes space efficiency, enabling designs that require minimal footprint.

Maximum I (ol): 8 Amp

An 8 Amp output capability supports high-load applications, making it ideal for robust systems.

Propagation Delay (tpd): 12 ns

The additional propagation delay ensures reliable performance in systems requiring precise timing.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes this part suitable for harsh environments and demanding applications.

Output Characteristics: 3-STATE

3-state output capability enables better bus management and resource sharing in multi-device setups.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in extreme environments, meeting military and industrial standards.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance solderability and corrosion resistance, promoting long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for versatile placement on PCBs, accommodating various design requirements.

No. of Ports: 2

Having two ports allows for more complex communication pathways, enhancing overall system performance.

Maximum Seated Height: 1.2 mm

A low seated height permits designs with tight vertical restrictions, ideal for compact devices.

Width: 4.4 mm

A narrow width enables effective space management on PCBs, allowing for higher density layouts.

Output Polarity: TRUE

True output polarity simplifies integration into systems designed with standard logic levels.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a low minimum supply voltage enhances versatility across various applications.

Length: 6.5 mm

A compact length ensures efficient use of limited PCB space while maintaining functionality.

Temperature Grade: MILITARY

Rated for military use, this part guarantees reliability under challenging conditions, ideal for defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for portable and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical strength and provide better soldering reliability.

Packing Method: TR

Tape and reel packing methods facilitate automated assembly processes, making manufacturing more efficient.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for compact designs while ensuring effective connection and signal integrity.

Control Type: ENABLE LOW

Low-enable control simplifies interfacing with other devices, increasing design ease and flexibility.

Moisture Sensitivity Level (MSL): 3

This moisture sensitivity level indicates appropriate handling and environmental considerations during manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5V allows for flexible design implementations across different systems.

Technical Specifications

Bus Driver & Transceivers 74VHC541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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