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74VHC541MTR

STMicroelectronics

74VHC541MTR by STMicroelectronics

74VHC541MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8 ns, operating at a nominal voltage of 3.3 V. It features a compact SO package and supports dual ports for efficient data transmission in military applications. With a max temp of 125 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,037 parts In-Stock

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8,037

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Anansix

USA . 1,963 parts In-Stock

1+ parts

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1,963

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Digiode

USA . 881 parts In-Stock

1+ parts

-

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881

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 580 parts In-Stock

1+ parts

$5.985

100+ parts

-

1k+ parts

$5.746

10k+ parts

$5.746

580

$5.985

-

$5.746

$5.746

IDEA Electronic Components Group

UK . 648 parts In-Stock

1+ parts

$16.355

100+ parts

-

1k+ parts

$14.719

10k+ parts

-

648

$16.355

-

$14.719

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AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$20.610

100+ parts

-

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1,165

$20.610

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MKK Technologies

India . 1,088 parts In-Stock

1+ parts

$30.754

100+ parts

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1,088

$30.754

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DigiPath Technology Company

USA . 1,088 parts In-Stock

1+ parts

$30.754

100+ parts

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1,088

$30.754

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$41.930

100+ parts

$41.930

1k+ parts

$41.930

10k+ parts

$41.930

354

$41.930

$41.930

$41.930

$41.930

Native Components

USA . 463 parts In-Stock

1+ parts

$2,492.560

100+ parts

$2,442.709

1k+ parts

$2,417.783

10k+ parts

$2,392.858

463

$2,492.560

$2,442.709

$2,417.783

$2,392.858

Northwest PG Solutions

USA . 1,999 parts In-Stock

1+ parts

$2,741.816

100+ parts

-

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1,999

$2,741.816

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Corphita

USA . 2,006 parts In-Stock

1+ parts

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2,006

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 571 parts In-Stock

1+ parts

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100+ parts

$19.555

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571

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$19.555

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Overview

Unlock unparalleled performance with the 74VHC541MTR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust 8-bit bus driver excels in high-speed applications, ensuring reliable data transfer with minimal delay. Its compact design and military-grade durability make it perfect for automotive, industrial, and telecommunications sectors. Experience superior quality and efficiency, enhancing your projects while reducing time-to-market. Choose STMicroelectronics for unmatched reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay indicates fast signal transmission, which is crucial for high-speed data communication.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

Rectangular shape optimizes space efficiency on PCB layouts, facilitating better component placement.

No. of Bits: 8

An 8-bit width is suitable for various applications, allowing for efficient data handling and control.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3 V is commonly used in many digital circuits, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

A manageable load capacitance helps maintain high performance and minimizes signal distortion.

Power Supplies (V): 2/5.5

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Terminals: 20

20 terminals provide ample connectivity options for integrating into complex systems.

Package Style (Meter): SMALL OUTLINE

A small outline package is space-efficient and ideal for high-density circuit designs.

Maximum I (ol): 8 Amp

High output current capability allows it to drive significant loads effectively in a variety of applications.

Propagation Delay (tpd): 12 ns

With a propagation delay of 12 ns, this product offers rapid response times for various signaling applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates suitability for demanding environments, including industrial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in managing multiple data lines in bus systems, facilitating effective communication.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures reliable operation in extreme conditions, appealing for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures excellent solderability and long-term reliability, enhancing performance in critical applications.

Terminal Position: DUAL

Dual terminal positioning facilitates versatile mounting options in various circuit layouts.

No. of Ports: 2

Two ports allow for flexible data transfer between multiple devices, enhancing connectivity options.

Maximum Seated Height: 2.65 mm

Compact height allows for low-profile designs, making it ideal for tight spaces on PCBs.

Width: 7.5 mm

A width of 7.5 mm contributes to its suitability for space-constrained designs, ensuring compatibility with various layouts.

Output Polarity: TRUE

True output polarity ensures consistent performance compatible with standard logic levels.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage provides flexibility for battery-powered and low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand up to 30 seconds at peak reflow temperature without degrading ensures robust assembly processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature supports modern soldering processes, making it easy to integrate into advanced manufacturing.

Length: 12.8 mm

Compact length helps in maintaining a small footprint on PCBs, promoting efficient use of space.

Temperature Grade: MILITARY

Military-grade specification assures high reliability and performance in defense and aerospace applications.

Technology: CMOS

CMOS technology yields low power consumption and high efficiency, essential for battery-operated or energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals are widely used for surface mounting and offer excellent mechanical stability and soldering reliability.

Packing Method: TR

Tape and reel (TR) packing method ensures easy handling and automatic feeding during assembly, boosting manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in surface-mounted devices, providing compatibility and ease of design.

Control Type: ENABLE LOW

Low enable control allows for easy integration into systems that require low-power standby modes.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures proper handling instructions, maintaining reliability in humid environments.

Maximum Supply Voltage (Vsup): 5.5 V

The capacity to operate at a maximum voltage of 5.5 V provides versatility for various applications.

Technical Specifications

Bus Driver & Transceivers 74VHC541MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHC541MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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