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74VHC373MTR

STMicroelectronics

74VHC373MTR by STMicroelectronics

74VHC373MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 10.5 ns, operating at a supply voltage of 3.3V. It features a compact rectangular package and supports true output polarity. Ideal for high-speed data transmission in military applications, it ensures reliable performance across extreme temperatures.

Median Price

$33.172

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$33.172

100+ parts

$30.187

1k+ parts

$27.201

10k+ parts

-

5,000

$33.172

$30.187

$27.201

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,118 parts In-Stock

1+ parts

$31.513

100+ parts

-

1k+ parts

-

10k+ parts

-

1,118

$31.513

-

-

-

Vyrian

USA . 7,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,295

-

-

-

-

Anansix

USA . 1,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,240

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 136 parts In-Stock

1+ parts

$8.670

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$8.670

-

-

-

Corohmni

South Africa . 201 parts In-Stock

1+ parts

$13.066

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$13.066

-

-

-

Andel Nordic

Denmark . 869 parts In-Stock

1+ parts

$13.550

100+ parts

-

1k+ parts

$9.485

10k+ parts

$9.485

869

$13.550

-

$9.485

$9.485

IDEA Electronic Components Group

UK . 1,607 parts In-Stock

1+ parts

$16.103

100+ parts

-

1k+ parts

$14.492

10k+ parts

-

1,607

$16.103

-

$14.492

-

Corphita

USA . 1,801 parts In-Stock

1+ parts

$29.855

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

$29.855

-

-

-

MKK Technologies

India . 1,351 parts In-Stock

1+ parts

$30.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

$30.280

-

-

-

DigiPath Technology Company

USA . 1,351 parts In-Stock

1+ parts

$30.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

$30.280

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$33.172

100+ parts

$30.187

1k+ parts

$27.201

10k+ parts

-

5,000

$33.172

$30.187

$27.201

-

Microchip USA

USA . 432 parts In-Stock

1+ parts

$33.840

100+ parts

$33.840

1k+ parts

$33.840

10k+ parts

$33.840

432

$33.840

$33.840

$33.840

$33.840

Native Components

USA . 144 parts In-Stock

1+ parts

$780.990

100+ parts

$765.370

1k+ parts

$757.560

10k+ parts

$749.750

144

$780.990

$765.370

$757.560

$749.750

Northwest PG Solutions

USA . 192 parts In-Stock

1+ parts

$859.089

100+ parts

-

1k+ parts

-

10k+ parts

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192

$859.089

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,984

-

-

-

-

Parana Technologies

USA . 905 parts In-Stock

1+ parts

-

100+ parts

$19.253

1k+ parts

-

10k+ parts

-

905

-

$19.253

-

-

Overview

Unlock exceptional performance with the 74VHC373MTR from STMicroelectronics, a leading name in the semiconductor industry known for its innovative and reliable solutions. This versatile 8-bit bus driver excels in speed and efficiency, perfect for high-speed data applications in automotive, industrial, and consumer electronics. With superior thermal stability and a compact design, it ensures optimal functionality in demanding environments, delivering unmatched value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protects the internal components of the bus driver in various environments.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay allows for faster data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables easy integration into compact designs and automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space in circuit layouts, accommodating more components in limited areas.

No. of Bits: 8

An 8-bit configuration allows for the handling of larger data sets, enhancing the versatility for different applications.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3V is compatible with modern logic levels and reduces power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is suitable for driving common loads, maintaining signal integrity and strength.

Power Supplies (V): 2/5.5 V

Supports a range of power supply voltages, making it flexible for various design requirements.

No. of Terminals: 20

With 20 terminals, this product offers significant connectivity options, useful for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design solutions, crucial for space-constrained applications.

Maximum I (ol): 8 Amp

The ability to handle a maximum output current of 8 Amps makes this product capable of driving larger loads.

Propagation Delay (tpd): 16.5 ns

A propagation delay of 16.5 ns is beneficial for ensuring quick response times in communication lines.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating makes it suitable for harsh environments and demanding applications.

Output Characteristics: 3-STATE

3-state output allows for shared bus systems, improving flexibility in circuit configurations.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature extends its functionality to extreme conditions, enhancing reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish offers excellent corrosion resistance and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal position can simplify connections in certain designs and enhance layout flexibility.

No. of Ports: 2

With two ports, this driver can manage multiple signal paths, increasing its applicability in complex circuits.

Maximum Seated Height: 2.65 mm

The low seated height is beneficial in low-profile applications where space is a critical constraint.

Width: 7.5 mm

A width of 7.5 mm contributes to space-efficient designs in compact electronic circuits.

Output Polarity: TRUE

True output polarity can simplify logic levels in designs, ensuring compatibility with existing systems.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V allows for operation in low-power conditions, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time ensures reliable soldering without damaging the component, maintaining quality during assembly.

Peak Reflow Temperature (°C): 260

Designed to withstand high peak temperatures, suitable for modern PCB assembly processes.

Length: 12.8 mm

The compact length supports efficient layout in tight spaces, aiding in overall design optimization.

Temperature Grade: MILITARY

Military grade ensures reliability under extreme conditions, suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed, ideal for energy-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and enhances the component's stability on PCBs.

Packing Method: TR

Taped and reeled packing facilitates automated and efficient handling in manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables high-density packaging while ensuring manufacturability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable shelf life, ensuring reliability before assembly while avoiding moisture damage.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers flexibility for higher voltage applications, broadening its usage.

Technical Specifications

Bus Driver & Transceivers 74VHC373MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHC373MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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