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74VHC27TTR

STMicroelectronics

74VHC27TTR by STMicroelectronics

74VHC27TTR by STMicroelectronics is a CMOS logic gate with three functions and a propagation delay of just 9 ns. It operates at a nominal voltage of 3.3 V and supports temperatures from -55 °C to 125°C. Ideal for compact, high-speed applications in military environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,385 parts In-Stock

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Digiode

USA . 3,040 parts In-Stock

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Anansix

USA . 151 parts In-Stock

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151

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Microchip USA

USA . 400 parts In-Stock

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$0.897

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400

$0.897

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Native Components

USA . 280 parts In-Stock

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$8.750

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280

$8.750

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Northwest PG Solutions

USA . 2,194 parts In-Stock

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$9.625

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$8.662

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$9.625

$8.662

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AZTECH Wire

Italy . 601 parts In-Stock

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$14.790

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601

$14.790

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IDEA Electronic Components Group

UK . 444 parts In-Stock

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$30.974

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$27.876

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444

$30.974

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$27.876

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MKK Technologies

India . 555 parts In-Stock

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$58.244

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$58.244

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DigiPath Technology Company

USA . 555 parts In-Stock

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$58.244

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$58.244

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Component Stockers USA

USA . 434 parts In-Stock

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$99.990

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Perfect Parts

USA . 28,871 parts In-Stock

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Parana Technologies

USA . 1,944 parts In-Stock

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$37.034

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Corphita

USA . 245 parts In-Stock

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Overview

Unlock the potential of your designs with the 74VHC27TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile logic gate offers exceptional performance and reliability, perfect for a wide range of applications, from consumer electronics to industrial automation. With its rapid propagation delay and robust temperature tolerance, it ensures swift processing and durability, empowering you to create innovative products that stand out in today's competitive market. Choose excellence; choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay ensures fast switching speeds, which enhances overall circuit performance and responsiveness.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and assembly, saving space and reducing manufacturing costs.

No. of Functions: 3

Multiple functions in a single IC maximize versatility, reducing component count and simplifying circuit design.

No. of Inputs: 3

With 3 inputs, the device can handle more complex logic functions while remaining compact and efficient.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier placement on PCBs, enhancing layout options and reducing assembly complexity.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V is common in modern digital designs, ensuring compatibility with numerous devices.

Load Capacitance (CL): 50 pF

A relatively low load capacitance allows for faster response and enables efficient operation in high-speed circuits.

Power Supplies (V): 2/5.5

Supports a range of power supplies (2V to 5.5V), enhancing flexibility for various applications and reducing supply constraints.

No. of Terminals: 14

With 14 terminals, the device offers ample connectivity options for complex designs while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this product ideal for space-constrained applications where performance is still critical.

Maximum I (ol): 8 Amp

The ability to handle a maximum output current of 8 Amps indicates that this product can drive substantial loads, suitable for high-power applications.

Propagation Delay (tpd): 14 ns

The second propagation delay specification ensures reliability in timing-sensitive applications, maintaining consistent performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating enhances reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Operating effectively at low temperatures allows this device to be used in harsh environments, including aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and reliable electrical connectivity, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB design, accommodating various mounting configurations with ease.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm provides compatibility with low-profile designs, enhancing the aesthetics and compactness of the final product.

Width: 4.4 mm

A narrow width supports space-efficient designs, making this product a practical choice for compact electronic solutions.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V expands usability in battery-powered and low-voltage applications.

Length: 5 mm

Compact length allows for versatile placement on PCBs, optimizing layout and minimizing space usage.

Temperature Grade: MILITARY

A military temperature grade ensures high reliability and performance under extreme conditions, ideal for defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a top choice for modern digital applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust connections on PCBs, contributing to overall reliability.

Packing Method: TR

Tape and reel packing method allows for automated assembly processes, enhancing efficiency in manufacturing.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for dense component layouts, which is critical in modern electronics design.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum supply voltage of 5.5V allows compatibility with a wide range of systems, enhancing its usability.

Technical Specifications

Logic Gates 74VHC27TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC27TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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