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74VHC174TTR

STMicroelectronics

74VHC174TTR by STMicroelectronics

74VHC174TTR by STMicroelectronics is a 6-bit CMOS latch with a propagation delay of just 10.5 ns, ideal for high-speed applications. It operates at supply voltages b/w 2-5.5 V and supports frequencies up to 80 MHz. Its compact design makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 25,000 parts In-Stock

1+ parts

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25,000

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Vyrian

USA . 2,333 parts In-Stock

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2,333

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Anansix

USA . 2,196 parts In-Stock

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2,196

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Digiode

USA . 1,448 parts In-Stock

1+ parts

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1,448

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ACDS - Activité Composants Distribution Service

France . 720 parts In-Stock

1+ parts

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720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 128 parts In-Stock

1+ parts

$0.323

100+ parts

-

1k+ parts

-

10k+ parts

$0.310

128

$0.323

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-

$0.310

Northwest PG Solutions

USA . 1,155 parts In-Stock

1+ parts

$0.356

100+ parts

-

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-

10k+ parts

$0.314

1,155

$0.356

-

-

$0.314

IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$10.411

100+ parts

-

1k+ parts

$9.370

10k+ parts

-

569

$10.411

-

$9.370

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AZTECH Wire

Italy . 95 parts In-Stock

1+ parts

$13.280

100+ parts

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95

$13.280

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Ampacity Inc.

Singapore . 184 parts In-Stock

1+ parts

$15.000

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184

$15.000

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MKK Technologies

India . 1,340 parts In-Stock

1+ parts

$19.577

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1,340

$19.577

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$19.577

100+ parts

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1,340

$19.577

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Kepictronics

USA . 10,500 parts In-Stock

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Corphita

USA . 4,762 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,833 parts In-Stock

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3,833

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Perfect Parts

USA . 1,613 parts In-Stock

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1,613

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Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

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$12.448

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1,347

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$12.448

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Cyclops Electronics Ltd (Excess)

UK . 720 parts In-Stock

1+ parts

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720

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Overview

Elevate your designs with the 74VHC174TTR by STMicroelectronics, a reliable 6-bit latch that combines speed and efficiency in one sleek package. Renowned for their commitment to quality, STMicroelectronics ensures this device operates seamlessly in diverse applications—from consumer electronics to industrial automation. Experience rapid switching times and low power consumption, empowering you to create cutting-edge solutions that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable encapsulation, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures faster signal processing, improving system efficiency and performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, ideal for modern electronic circuits.

Package Shape: RECTANGULAR

A rectangular package shape promotes efficient space utilization on PCBs, making it easier to integrate into various designs.

No. of Bits: 6

With 6 bits, the product supports a variety of digital signaling needs, enhancing versatility in applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V ensures compatibility with a wide range of digital systems.

Load Capacitance (CL): 50 pF

A moderate load capacitance facilitates good signal integrity while minimizing power consumption.

Power Supplies (V): 2/5.5

Flexible power supply options allow for adaptation in various applications, enhancing design choices.

No. of Terminals: 16

A 16-terminal configuration provides ample connectivity options for complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained environments, ensuring versatile usage in compact devices.

Maximum I (ol): 8 Amp

Support for high output current up to 8A makes it ideal for driving loads directly, enhancing its applicability in power-sensitive situations.

Propagation Delay (tpd): 16.5 ns

This stable propagation delay allows for synchronized operations in high-speed digital systems.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for harsh operating environments, ensuring reliability.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides a stable and predictable switching behavior, simplifying design considerations for clock-driven circuits.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, making it suitable for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes ensure excellent conductivity and resistance to corrosion, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile layout options on circuit boards, facilitating design flexibility.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a slim profile, ideal for applications where height restrictions are a concern.

Width: 4.4 mm

Compact width makes this product suitable for tight spaces, ideal for modern consumer electronics.

Output Polarity: TRUE

A true output polarity enhances compatibility with various digital signal levels and logic devices.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for battery-operated devices, increasing energy efficiency.

Length: 5 mm

Compact length enhances potential use in miniaturized devices and systems.

Temperature Grade: MILITARY

Military-grade specifications ensure reliability and performance under extreme environmental conditions, vital for defense applications.

Maximum Frequency At Nominal Supply: 80000000 Hz

Supports high-frequency operations, making it suitable for advanced digital applications requiring fast data processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal shapes facilitate easier soldering and better connections, enhancing manufacturing efficiency.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated assembly, optimizing production processes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch supports higher density layouts on PCBs, allowing for more compact and efficient circuit design.

Minimum fmax: 110 MHz

Minimum frequency capability of 110 MHz ensures compatibility with various communication and processing needs.

Maximum Supply Voltage (Vsup): 5.5 V

Support for up to 5.5V supply voltage provides design flexibility for interfacing with a range of components.

Technical Specifications

Latches & Flip-Flops 74VHC174TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

74VHC174TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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