Loading...

74VHC126MTR

STMicroelectronics

74VHC126MTR by STMicroelectronics

74VHC126MTR by STMicroelectronics is a CMOS bus driver with a propagation delay of 8.5 ns and operates at supply voltages from 2V to 5.5V. It features 4 functions in a compact 14-terminal package, ideal for high-speed data transmission in military applications. Its robust design supports temperatures from -55 °C to 125°C, ensuring reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,969

-

-

-

-

Digiode

USA . 4,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,087

-

-

-

-

Anansix

USA . 1,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 602 parts In-Stock

1+ parts

$2.925

100+ parts

-

1k+ parts

$2.808

10k+ parts

$2.808

602

$2.925

-

$2.808

$2.808

AZTECH Wire

Italy . 806 parts In-Stock

1+ parts

$8.650

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$8.650

-

-

-

IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$25.881

100+ parts

-

1k+ parts

$23.292

10k+ parts

-

1,691

$25.881

-

$23.292

-

MKK Technologies

India . 506 parts In-Stock

1+ parts

$48.667

100+ parts

-

1k+ parts

-

10k+ parts

-

506

$48.667

-

-

-

DigiPath Technology Company

USA . 506 parts In-Stock

1+ parts

$48.667

100+ parts

-

1k+ parts

-

10k+ parts

-

506

$48.667

-

-

-

Native Components

USA . 610 parts In-Stock

1+ parts

$602.190

100+ parts

$590.146

1k+ parts

$584.124

10k+ parts

$578.102

610

$602.190

$590.146

$584.124

$578.102

Northwest PG Solutions

USA . 1,991 parts In-Stock

1+ parts

$662.409

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$662.409

-

-

-

Microchip USA

USA . 6,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,002

-

-

-

-

Corphita

USA . 914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

914

-

-

-

-

Parana Technologies

USA . 535 parts In-Stock

1+ parts

-

100+ parts

$30.944

1k+ parts

-

10k+ parts

-

535

-

$30.944

-

-

Overview

Elevate your designs with the 74VHC126MTR from STMicroelectronics, a leader in high-performance semiconductor solutions. This versatile bus driver & transceiver offers remarkable speed and reliability, making it ideal for everything from automotive to industrial applications. With superior temperature tolerance and robust construction, it ensures long-lasting performance, providing you with peace of mind and exceptional value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay ensures high-speed data transmission, making this device ideal for performance-critical applications.

Surface Mount: YES

Surface mount technology facilitates easier integration into modern circuit boards, saving space and improving overall design efficiency.

No. of Functions: 4

Multiple functions allow for versatile applications, reducing the need for additional components and simplifying circuit designs.

Package Shape: RECTANGULAR

A rectangular package shape allows for easier placement on PCBs and efficient use of space.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V ensures compatibility with a wide range of digital systems, making it a flexible choice.

Power Supplies (V): 2/5.5

This wide range of supply voltage enhances the product's versatility in various applications and operating conditions.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options, making it suitable for complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package design is ideal for space-constrained applications, allowing for compact PCB layouts.

Maximum I (ol): 8 Amp

A high maximum output current capability supports demanding loads, making this product capable of driving various devices efficiently.

Propagation Delay (tpd): 13 ns

The specified propagation delay indicates that the device can handle fast signal changes, ensuring responsiveness in data transfers.

Maximum Operating Temperature: 125 °C

This high operating temperature rating allows for use in harsh environments, making the product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristic enables flexible communication between multiple devices, allowing for efficient bus architectures.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures reliability in extreme conditions, ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and oxidation resistance, ensuring a reliable connection over time.

Terminal Position: DUAL

Dual terminal positioning aids in various mounting configurations, providing flexibility for PCB layout designers.

No. of Ports: 2

Having two ports allows for inter-device communication, making this device versatile for various data bus applications.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for applications where space is at a premium, supporting slimmer overall designs.

Width: 3.9 mm

A narrow width aids in dense PCB layouts, making it easy to incorporate into compact designs.

Output Polarity: TRUE

True output polarity provides predictable logic behavior, simplifying design and debugging processes.

Minimum Supply Voltage (Vsup): 2 V

A minimal supply voltage of 2V allows for energy-efficient designs, reducing power consumption in low-power applications.

Length: 8.65 mm

Compact length contributes to an overall smaller device profile, ideal for space-conscious designs.

Temperature Grade: MILITARY

Mil-spec grade indicates robustness and reliability under extreme conditions, perfect for defense and aerospace applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher speed performance, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, improving the manufacturability and assembly processes.

Packing Method: TR

Taping and reels (TR) packing method simplifies automation in PCB assembly, improving efficiency in production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and accessibility, facilitating both design flexibility and ease of handling.

Control Type: ENABLE HIGH

High enable control provides a straightforward method to activate the device, enhancing integration into logic circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage provides flexibility for higher voltage applications while maintaining efficient operation.

Technical Specifications

Bus Driver & Transceivers 74VHC126MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHC126MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20