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74LVX16240TTR

STMicroelectronics

74LVX16240TTR by STMicroelectronics

74LVX16240TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 13.5 ns and operates b/w 2-3.6 V. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in compact designs. Its military-grade specs ensure reliability in extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,001 parts In-Stock

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4,001

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Anansix

USA . 2,423 parts In-Stock

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2,423

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Digiode

USA . 196 parts In-Stock

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196

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Distributors (Availability)

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Native Components

USA . 60 parts In-Stock

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$1.591

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60

$1.591

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Northwest PG Solutions

USA . 2,053 parts In-Stock

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$1.750

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2,053

$1.750

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AZTECH Wire

Italy . 613 parts In-Stock

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$10.600

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613

$10.600

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Microchip USA

USA . 454 parts In-Stock

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$15.455

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$15.455

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$21.379

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$19.241

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1,675

$21.379

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$19.241

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MKK Technologies

India . 1,990 parts In-Stock

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$40.202

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$40.202

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DigiPath Technology Company

USA . 1,990 parts In-Stock

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$40.202

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$40.202

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Corphita

USA . 1,066 parts In-Stock

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Parana Technologies

USA . 53 parts In-Stock

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$25.562

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Overview

Elevate your designs with the 74LVX16240TTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance bus driver is perfect for applications demanding reliability and efficiency, offering robust features in a compact form factor. With its exceptional speed and low power consumption, it ensures seamless data transmission while enhancing system performance. Choose STMicroelectronics to empower your projects with quality solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental stress, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 13.5 ns

A low propagation delay allows for faster data transmission, enhancing the performance of systems where speed is critical.

Surface Mount: YES

Surface mount capability enables compact design and easy integration onto PCBs, ideal for modern electronic devices with limited space.

No. of Functions: 4

Having multiple functions increases versatility and minimizes the number of components needed, saving space and reducing costs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates effective layout in circuit designs, optimizing space utilization on PCBs.

No. of Bits: 4

Four bits offer a sufficient data width for a variety of applications, striking a balance between complexity and functionality.

Nominal Supply Voltage / Vsup (V): 2.7

A low nominal supply voltage makes this device energy efficient, which is crucial for battery-powered applications.

Power Supplies (V): 3.3

The capability to operate at 3.3V makes it compatible with a wide range of devices and systems, ensuring broad usability.

No. of Terminals: 48

A larger number of terminals allows for more connections and enhanced functionality within complex circuit applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is optimal for high-density designs, offering a compact footprint while maintaining performance.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps ensures that the product can drive heavier loads, making it suitable for demanding applications.

Propagation Delay (tpd): 14 ns

A consistent propagation delay allows for predictable timing behavior in digital circuits, improving system reliability.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in extreme environments, making it ideal for military and industrial applications.

Output Characteristics: 3-STATE

3-state outputs provide greater flexibility in design by allowing multiple devices to share the same bus, minimizing signal interference.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the device to function in harsh environments, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The durable terminal finish enhances reliability and signal integrity, particularly in high-frequency applications.

Terminal Position: DUAL

Dual terminal position simplifies connections in tight layouts and improves mounting stability on PCBs.

No. of Ports: 2

Two ports facilitate communication between different system components, enhancing interconnectivity in complex designs.

Maximum Seated Height: 1.2 mm

A low seated height enables stacking of components in compact assemblies, optimizing design space.

Width: 6.1 mm

A narrow width contributes to space-saving designs while maintaining ease of handling and placement on circuit boards.

Output Polarity: INVERTED

The inverted output allows for compatibility with a wider range of devices and can simplify circuit design in certain applications.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply of 2V enhances compatibility with low-voltage systems, improving versatility.

Length: 12.5 mm

Compact length aids in maintaining a small overall footprint in electronic designs, crucial for modern electronics.

Temperature Grade: MILITARY

A military temperature rating ensures reliability and performance in extreme environmental conditions, suitable for defense applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and high density, making it ideal for a range of applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering characteristics and ease of PCB assembly, enhancing manufacturing efficiency.

Packing Method: TR

Tape and reel packing method facilitates automated assembly, making it suitable for high-volume manufacturing.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for tighter spacing on PCBs, enabling more compact designs.

Control Type: ENABLE LOW

Low enable control type enhances the flexibility and responsiveness of the device in various circuit applications.

Maximum Supply Voltage (Vsup): 3.6 V

Operating up to 3.6V allows compatibility with a wider range of devices, increasing potential application areas.

Technical Specifications

Bus Driver & Transceivers 74LVX16240TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LVX16240TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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