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74LVX00TTR

STMicroelectronics

74LVX00TTR by STMicroelectronics

74LVX00TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 11 ns and operates at a nominal voltage of 3.3 V. It features 4 functions with dual inputs, ideal for compact applications in military-grade electronics. Its small outline package ensures efficient space utilization.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 6,081 parts In-Stock

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6,081

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Digiode

USA . 4,562 parts In-Stock

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4,562

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Bristol Electronics

USA . 2,415 parts In-Stock

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-

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$0.225

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$0.135

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$0.090

2,415

-

$0.225

$0.135

$0.090

Microfarads

USA . 2,328 parts In-Stock

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2,328

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Anansix

USA . 899 parts In-Stock

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899

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Distributors (Availability)

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Native Components

USA . 116 parts In-Stock

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$6.809

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116

$6.809

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Andel Nordic

Denmark . 3,660 parts In-Stock

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$7.181

100+ parts

-

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$6.894

10k+ parts

$6.894

3,660

$7.181

-

$6.894

$6.894

AZTECH Wire

Italy . 336 parts In-Stock

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$17.090

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336

$17.090

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IDEA Electronic Components Group

UK . 80 parts In-Stock

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$19.314

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$17.382

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80

$19.314

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$17.382

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Microchip USA

USA . 245 parts In-Stock

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$33.238

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MKK Technologies

India . 1,678 parts In-Stock

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$36.318

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1,678

$36.318

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DigiPath Technology Company

USA . 1,678 parts In-Stock

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$36.318

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1,678

$36.318

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Component Stockers USA

USA . 358 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 7,130 parts In-Stock

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Perfect Parts

USA . 2,206 parts In-Stock

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Parana Technologies

USA . 335 parts In-Stock

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$23.092

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335

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$23.092

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Corphita

USA . 269 parts In-Stock

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Northwest PG Solutions

USA . 262 parts In-Stock

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$6.672

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262

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$6.672

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Overview

Elevate your design with the 74LVX00TTR from STMicroelectronics—a robust logic gate solution engineered for durability and efficiency. This high-quality component boasts exceptional performance in diverse applications, ensuring reliability under various conditions. With a compact profile and low power consumption, it’s perfect for space-constrained projects. Trust STMicroelectronics for innovative solutions that enhance your products with superior functionality and long-term value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay means faster switching, which is essential for high-speed logic applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards.

No. of Functions: 4

Offering multiple functions in a single package saves space and cost, making it a versatile choice for designers.

No. of Inputs: 2

With 2 inputs, it provides flexibility for various logic configurations, suitable for many digital applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient layout designs and optimized use of PCB space.

Nominal Supply Voltage / Vsup (V): 2.7

Working at a nominal supply voltage of 2.7V allows compatibility with low-power applications and reduces energy consumption.

Load Capacitance (CL): 50 pF

A moderate load capacitance means it can work effectively with various load types while maintaining performance.

Power Supplies (V): 3.3

Compatible with a 3.3V power supply, this product fits well into many existing systems, enhancing design flexibility.

No. of Terminals: 14

With 14 terminals, the device can accommodate a range of circuit configurations, promoting versatility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for high-density designs in compact spaces, ideal for modern electronic devices.

Maximum I (ol): 4 Amp

A high output current capacity of 4 Amps ensures the device can drive significant loads, making it suitable for robust applications.

Propagation Delay (tpd): 16 ns

The propagation delay of 16 ns is competitive, ensuring reliable operation in fast-switching environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is reliable in demanding environments, ensuring longevity.

Minimum Operating Temperature: -55 °C

A wide operating temperature range, from -55 °C to 125 °C, makes this device suitable for military and harsh industrial applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

This terminal finish provides excellent solderability and long-term reliability, ideal for high-performance applications.

Terminal Position: DUAL

Dual terminal positioning allows for more versatile PCB layout options, enhancing design flexibility.

Maximum Seated Height: 1.2 mm

A low profile height contributes to more compact designs, essential for space-constrained applications.

Width: 4.4 mm

A slim width allows for denser packing of components on PCB, optimizing space efficiency.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product can operate with lower supply voltages, which is advantageous for energy-sensitive designs.

Length: 5 mm

The compact length enhances the possibility of fitting into small spaces without compromising performance.

Temperature Grade: MILITARY

Classified as a military temperature grade ensures reliability and robustness in critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals ease the soldering process and provide reliable connections, enhancing assembly efficiency.

Packing Method: TR

The tape and reel (TR) packing method facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for tighter component placement on PCBs, which is advantageous for high-density designs.

Maximum Supply Voltage (Vsup): 3.6 V

Capable of handling up to 3.6V supply voltage, this product offers flexibility for integration into various power supply systems.

Technical Specifications

Logic Gates 74LVX00TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX00TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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