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74LVX00MTR

STMicroelectronics

74LVX00MTR by STMicroelectronics

74LVX00MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 11 ns and operates at supply voltages b/w 2-3.6 V. It features 4 functions with dual inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 6,226 parts In-Stock

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Digiode

USA . 4,854 parts In-Stock

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Anansix

USA . 2,550 parts In-Stock

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Semi Source

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A&K Electronics

USA . 48 parts In-Stock

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Bristol Electronics

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EMSNET

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LWI Electronics Inc

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Native Components

USA . 483 parts In-Stock

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$0.780

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Northwest PG Solutions

USA . 1,365 parts In-Stock

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$0.858

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Microchip USA

USA . 434 parts In-Stock

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$2.650

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$2.650

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Ampacity Inc.

Singapore . 365 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 586 parts In-Stock

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$21.370

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IDEA Electronic Components Group

UK . 1,586 parts In-Stock

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MKK Technologies

India . 1,606 parts In-Stock

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$41.221

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,256 parts In-Stock

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Parana Technologies

USA . 1,718 parts In-Stock

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Corphita

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Overview

Elevate your designs with the 74LVX00MTR from STMicroelectronics, a leader in quality and innovation. This versatile logic gate offers rapid response times and exceptional reliability, making it ideal for a wide range of applications—from consumer electronics to industrial systems. With STMicroelectronics' commitment to excellence, you gain peace of mind, knowing your projects are powered by cutting-edge technology that ensures efficiency and performance at every turn.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

With a fast propagation delay, this logic gate ensures quicker response times in digital circuits, enhancing overall system performance.

Surface Mount: YES

Surface mount technology allows for reduced footprint on PCBs, improving space efficiency in compact electronic designs.

No. of Functions: 4

Offering multiple functions, this logic gate can simplify circuit design by replacing multiple single-function components, saving both space and costs.

No. of Inputs: 2

The dual-input configuration is versatile for a wide range of logical operations, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint, making it easier to integrate into existing PCB layouts.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage that is ideal for low-power applications, ensuring energy efficiency in device operation.

Load Capacitance (CL): 50 pF

The low load capacitance allows for high-speed operation, making this logic gate suitable for fast signal processing applications.

Power Supplies (V): 3.3

Compatibility with a 3.3V power supply makes this component widely applicable in modern electronic systems.

No. of Terminals: 14

The 14-terminal design provides ample connection options for a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package is designed for efficient space utilization on printed circuit boards.

Maximum I (ol): 4 Amp

With a high output current capability, this logic gate can drive larger loads, expanding its versatility in applications.

Propagation Delay (tpd): 16 ns

A competitive propagation delay ensures reliable and efficient signal transmission, crucial for high-frequency applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes this logic gate suitable for demanding environments, enhancing reliability in harsh conditions.

Minimum Operating Temperature: -55 °C

This wide temperature range makes the component ideal for military and aerospace applications where extreme conditions are common.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish offers excellent corrosion resistance and ensures reliable electrical connectivity over time.

Terminal Position: DUAL

The dual terminal position allows for flexible circuit design, making integration easier.

Maximum Seated Height: 1.75 mm

A low seated height supports compact designs, which is increasingly important in modern electronics.

Width: 3.9 mm

The narrow width helps in minimizing PCB space, allowing for more efficient layouts.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2V enhances flexibility, making it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 40

This specification indicates compatibility with standard soldering processes, ensuring ease of assembly.

Peak Reflow Temperature °C: 260

A high reflow temperature capability is essential for reliability during assembly and increases the range of compatible solder materials.

Length: 8.65 mm

A compact length enables efficient board placements in space-constrained designs.

Temperature Grade: MILITARY

With military-grade specifications, this logic gate ensures high reliability and performance in critical applications.

Technology: CMOS

The CMOS technology offers low power consumption while maintaining high speed, making this logic gate ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Packing Method: TR

Tape and reel packing ensures automated assembly processes are efficient, reducing labor costs and increasing throughput.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with a wide range of PCB layouts and machine pick-and-place systems.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to support up to 3.6V makes this logic gate suitable for a wide array of applications, including higher power scenarios.

Technical Specifications

Logic Gates 74LVX00MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX00MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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