Loading...

74LVQ574TTR

STMicroelectronics

74LVQ574TTR by STMicroelectronics

STMicroelectronics' 74LVQ574TTR is an 8-bit bus driver with a propagation delay of 12 ns at 3.3V, suitable for military-grade applications. It features a max frequency of 80MHz, operates b/w -55 to 125 °C, and has a small outline package with dual terminals for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,943

-

-

-

-

Digiode

USA . 2,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,577

-

-

-

-

Anansix

USA . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,108 parts In-Stock

1+ parts

$11.495

100+ parts

-

1k+ parts

$10.346

10k+ parts

-

1,108

$11.495

-

$10.346

-

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$14.260

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$14.260

-

-

-

MKK Technologies

India . 1,571 parts In-Stock

1+ parts

$21.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

$21.616

-

-

-

DigiPath Technology Company

USA . 1,571 parts In-Stock

1+ parts

$21.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

$21.616

-

-

-

Corohmni

South Africa . 351 parts In-Stock

1+ parts

$32.761

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$32.761

-

-

-

Microchip USA

USA . 351 parts In-Stock

1+ parts

$33.014

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$33.014

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$38.440

100+ parts

$34.980

1k+ parts

$31.521

10k+ parts

-

5,000

$38.440

$34.980

$31.521

-

Component Stockers USA

USA . 238 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$99.990

-

-

-

Native Components

USA . 344 parts In-Stock

1+ parts

$189.297

100+ parts

-

1k+ parts

-

10k+ parts

$181.725

344

$189.297

-

-

$181.725

Northwest PG Solutions

USA . 1,124 parts In-Stock

1+ parts

$208.227

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

$208.227

-

-

-

Corphita

USA . 2,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

-

-

-

-

Parana Technologies

USA . 1,545 parts In-Stock

1+ parts

-

100+ parts

$13.744

1k+ parts

-

10k+ parts

-

1,545

-

$13.744

-

-

Andel Nordic

Denmark . 456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

456

-

-

-

-

Overview

Unlock the power of seamless data transmission with the 74LVQ574TTR by STMicroelectronics. Crafted with precision and reliability, this Bus Driver & Transceiver offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product guarantees fast propagation delay, low power consumption, and high-speed operation. Trust STMicroelectronics to deliver top-notch quality and cutting-edge technology that meets your needs. Upgrade your projects with the 74LVQ574TTR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight, durable, and cost-effective, making this product suitable for applications where weight and cost are important factors.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast data transmission, making this bus driver suitable for high-speed communication systems.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular package shape is standard and easy to handle during installation, making it compatible with a wide range of PCB designs.

No. of Bits: 8

8-bit bus driver provides a sufficient number of data lines for transmitting information between components in a system.

Nominal Supply Voltage / Vsup (V): 2.7

Low nominal supply voltage helps in reducing power consumption and heat dissipation in the system.

Load Capacitance (CL): 50 pF

Optimized load capacitance value ensures efficient data transmission and signal integrity in high-speed applications.

Power Supplies (V): 3.3

Operating voltage of 3.3V is common in digital systems, ensuring compatibility with a wide range of electronic devices.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionality, making this bus driver versatile for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package save space on the PCB, while shrink pitch improves signal integrity and reduces crosstalk.

Maximum I (ol): 24 Amp

High maximum output current rating allows the bus driver to drive multiple loads or long bus lines without overheating or signal degradation.

Propagation Delay (tpd): 16 ns

Low propagation delay ensures fast data transmission, making this bus driver suitable for high-speed communication systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes this bus driver suitable for harsh environments and industrial applications.

Output Characteristics: 3-STATE

3-state output allows the bus driver to control bus lines effectively by driving them high, driving them low, or releasing them to float.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures synchronized data transmission on rising edges of clock signals, enhancing system performance.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the bus driver to operate in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile installation options, making this bus driver compatible with different PCB layouts.

No. of Ports: 2

Having 2 ports enables the bus driver to connect to multiple devices simultaneously, improving system flexibility and data exchange capabilities.

Maximum Seated Height: 1.2 mm

Low seated height profile saves space on the PCB and ensures compatibility with compact electronic devices.

Width: 4.4 mm

Narrow width dimension allows for dense PCB designs and efficient use of board space in tight layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission with minimal noise interference in digital systems.

Minimum Supply Voltage (Vsup): 2V

Low minimum supply voltage ensures reliable operation even in low-power scenarios, extending the bus driver's application range.

Length: 6.5 mm

Compact length dimension allows for space-efficient placement on the PCB, accommodating compact system designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures robust performance in challenging environments and critical applications.

Maximum Frequency At Nominal Supply: 80000000 Hz

High maximum frequency capability allows the bus driver to support high-speed data transmission and communication protocols.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength, easy soldering, and secure PCB mounting for reliable electrical connections.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes and protects the bus driver during shipping and handling.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density PCB layouts and precise connections, optimizing signal transmission efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources and operating conditions, enhancing the bus driver's versatility.

Technical Specifications

Bus Driver & Transceivers 74LVQ574TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

LVQ

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LVQ574TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20