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74LVQ244TTR

STMicroelectronics

74LVQ244TTR by STMicroelectronics

74LVQ244TTR by STMicroelectronics is a Bus Driver & Transceiver with 14ns Propagation Delay, 2.7V Nominal Voltage, and 3-STATE Output Characteristics. It is used in applications requiring fast signal transmission over short distances in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,687 parts In-Stock

1+ parts

-

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8,687

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Digiode

USA . 647 parts In-Stock

1+ parts

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647

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Anansix

USA . 573 parts In-Stock

1+ parts

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573

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LWI Electronics Inc

India . 50 parts In-Stock

1+ parts

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100+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 191 parts In-Stock

1+ parts

$1.000

100+ parts

-

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191

$1.000

-

-

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Andel Nordic

Denmark . 1,917 parts In-Stock

1+ parts

$1.858

100+ parts

-

1k+ parts

$1.784

10k+ parts

$1.784

1,917

$1.858

-

$1.784

$1.784

IDEA Electronic Components Group

UK . 1,312 parts In-Stock

1+ parts

$8.367

100+ parts

-

1k+ parts

$7.531

10k+ parts

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1,312

$8.367

-

$7.531

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MKK Technologies

India . 1,078 parts In-Stock

1+ parts

$15.734

100+ parts

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1,078

$15.734

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DigiPath Technology Company

USA . 1,078 parts In-Stock

1+ parts

$15.734

100+ parts

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1,078

$15.734

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AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$15.840

100+ parts

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608

$15.840

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Native Components

USA . 760 parts In-Stock

1+ parts

$22.240

100+ parts

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760

$22.240

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Northwest PG Solutions

USA . 1,078 parts In-Stock

1+ parts

$24.464

100+ parts

$22.018

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1,078

$24.464

$22.018

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Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

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100+ parts

$10.004

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1,316

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$10.004

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Corphita

USA . 1,002 parts In-Stock

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1,002

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Overview

Enhance your electronic designs with the 74LVQ244TTR by STMicroelectronics, a top-tier manufacturer known for delivering high-quality components. This Bus Driver & Transceiver offers fast data transmission and reliable performance, making it ideal for a wide range of applications. With 3-STATE output characteristics, low propagation delay, and a compact design, this product provides value by enhancing efficiency and reducing power consumption in your projects. Upgrade your circuits with the best in the industry and experience the benefits of precision engineering with the 74LVQ244TTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, providing good protection for the internal components.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability makes the product easy to install on circuit boards, saving space and improving assembly efficiency.

No. of Functions: 2

Having multiple functions allows for versatile use of the product in different circuit configurations, increasing its applicability.

Nominal Supply Voltage / Vsup: 2.7V

Operating at a nominal supply voltage of 2.7V ensures efficient power consumption, making it suitable for low power applications.

Load Capacitance (CL): 50pF

The specified load capacitance of 50pF ensures compatibility with external components, facilitating easy integration into existing circuit designs.

Power Supplies (V): 3.3

The availability of dual power supplies at 3.3V provides flexibility in voltage requirements, allowing compatibility with a wider range of systems.

No. of Terminals: 20

Having a sufficient number of terminals enables convenient connectivity with other components, making installation and wiring straightforward.

Maximum I (ol): 24Amp

The high maximum output current of 24Amp allows the product to drive heavy loads, making it suitable for demanding applications.

Propagation Delay (tpd): 14ns

With a low propagation delay of 14ns, the product ensures fast signal transmission, reducing latency in data communication.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible signal control, enabling the product to work effectively in multi-device communication scenarios.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Temperature Grade: MILITARY

Designed for military-grade temperature requirements, this product can withstand extreme environmental conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers 74LVQ244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVQ

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVQ244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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