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74LVC573ATTR

STMicroelectronics

74LVC573ATTR by STMicroelectronics

74LVC573ATTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.2 ns, operating b/w 1.65V and 3.6V. It features a compact SO package and supports high-speed data transfer in military applications. Ideal for low-power designs, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,889 parts In-Stock

1+ parts

-

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8,889

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Semi Source

USA . 2,500 parts In-Stock

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-

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2,500

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Digiode

USA . 162 parts In-Stock

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162

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Anansix

USA . 148 parts In-Stock

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148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,236 parts In-Stock

1+ parts

$4.359

100+ parts

-

1k+ parts

$4.184

10k+ parts

$4.184

1,236

$4.359

-

$4.184

$4.184

IDEA Electronic Components Group

UK . 2,288 parts In-Stock

1+ parts

$12.460

100+ parts

-

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$11.214

10k+ parts

-

2,288

$12.460

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$11.214

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Microchip USA

USA . 393 parts In-Stock

1+ parts

$12.681

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-

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393

$12.681

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AZTECH Wire

Italy . 55 parts In-Stock

1+ parts

$20.700

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-

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55

$20.700

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MKK Technologies

India . 1,757 parts In-Stock

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$23.429

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1,757

$23.429

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DigiPath Technology Company

USA . 1,757 parts In-Stock

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$23.429

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1,757

$23.429

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Ampacity Inc.

Singapore . 1,054 parts In-Stock

1+ parts

$35.000

100+ parts

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1,054

$35.000

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Perfect Parts

USA . 8,635 parts In-Stock

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8,635

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,537 parts In-Stock

1+ parts

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$14.897

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1,537

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$14.897

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Kepictronics

USA . 870 parts In-Stock

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870

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Corphita

USA . 456 parts In-Stock

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456

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Native Components

USA . 319 parts In-Stock

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319

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Northwest PG Solutions

USA . 204 parts In-Stock

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204

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Overview

Unlock seamless data transfer and communication in your designs with the 74LVC573ATTR from STMicroelectronics, a trusted leader in semiconductor innovation. This 8-bit bus driver offers exceptional speed, reliability, and power efficiency, making it ideal for high-performance applications across industries. With its compact design and military-grade durability, you can count on the 74LVC573ATTR to enhance your projects while delivering unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure long-lasting performance and reliability in various applications.

Propagation Delay At Nominal Supply: 8.2 ns

Fast propagation delay allows for high-speed data transfer, making it suitable for modern high-speed communication systems.

Surface Mount: YES

Surface mount technology enables compact designs and is ideal for automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout and design.

No. of Bits: 8

An 8-bit architecture is versatile and supports a wide range of applications in digital circuits.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V balances power consumption and performance, making it energy-efficient.

Load Capacitance (CL): 50 pF

Matching load capacitance ensures compatibility with various circuit designs, enhancing overall performance.

Power Supplies (V): 3.3

Supports common supply voltages, making it easier to integrate into existing systems without modifications.

No. of Terminals: 20

20 terminals provide enough connectivity for diverse applications, ensuring flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile reduce space requirements on PCBs, accommodating compact designs.

Maximum I (ol): 24 Amp

With a high output current capability, this bus driver can handle demanding applications with ease.

Propagation Delay (tpd): 9.4 ns

A low propagation delay enhances performance in high-speed systems, ensuring timely signal transmission.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for harsh environments, increasing overall reliability.

Output Characteristics: 3-STATE

3-state output allows for easy interfacing with multiple devices, increasing versatility in circuit design.

Minimum Operating Temperature: -55 °C

Designed for extreme low temperatures, making it suitable for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and eases integration with existing PCB layouts.

No. of Ports: 2

Having two ports increases the bus driver's utility in multi-device networks, enhancing communication options.

Maximum Seated Height: 1.2 mm

Low seated height facilitates compact product designs, making it ideal for modern electronic devices.

Width: 4.4 mm

Narrow width supports high-density PCB layouts, allowing for more components in a smaller area.

Output Polarity: TRUE

True output polarity allows for predictable signal behavior, simplifying the design and integration process.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 40

Extended reflow time ensures reliable solder connections during assembly, improving durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern assembly processes.

Length: 6.5 mm

Compact length aids in space-constrained applications, making it easier to integrate into small devices.

Temperature Grade: MILITARY

Military-grade specifications guarantee robustness and reliability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall system efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy manual soldering and automated assembly processes.

Terminal Pitch: 0.65 mm

A small terminal pitch is suited for high-density mounting, enabling more functionality in less space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating allows safe exposure to moisture during manufacturing and handling, ensuring product longevity.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide operating range, accommodating various systems without compromising performance.

Technical Specifications

Bus Driver & Transceivers 74LVC573ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

9.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74LVC573ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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