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74LVC374ATTR

STMicroelectronics

74LVC374ATTR by STMicroelectronics

74LVC374ATTR by STMicroelectronics is an 8-bit bus driver with a 3.3V supply, featuring a fast propagation delay of 9.4 ns and robust output characteristics in a compact SOIC package. It operates in extreme temperatures from -55 °C to 125 °C, making it ideal for military applications. This CMOS device supports dual ports and offers true output polarity for reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,504 parts In-Stock

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6,504

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Digiode

USA . 4,512 parts In-Stock

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4,512

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Anansix

USA . 2,196 parts In-Stock

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2,196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,037 parts In-Stock

1+ parts

$17.980

100+ parts

-

1k+ parts

-

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-

1,037

$17.980

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.980

100+ parts

$18.182

1k+ parts

$16.384

10k+ parts

-

500

$19.980

$18.182

$16.384

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Corohmni

South Africa . 447 parts In-Stock

1+ parts

$24.272

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-

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447

$24.272

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IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$24.546

100+ parts

-

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$22.091

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582

$24.546

-

$22.091

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Microchip USA

USA . 274 parts In-Stock

1+ parts

$32.164

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274

$32.164

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MKK Technologies

India . 2,006 parts In-Stock

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$46.156

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2,006

$46.156

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DigiPath Technology Company

USA . 2,006 parts In-Stock

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$46.156

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2,006

$46.156

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Native Components

USA . 776 parts In-Stock

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$50.133

100+ parts

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$48.127

776

$50.133

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$48.127

Northwest PG Solutions

USA . 1,002 parts In-Stock

1+ parts

$55.146

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1,002

$55.146

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Component Stockers USA

USA . 493 parts In-Stock

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$99.990

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493

$99.990

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Perfect Parts

USA . 6,055 parts In-Stock

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6,055

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Corphita

USA . 2,717 parts In-Stock

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Parana Technologies

USA . 1,075 parts In-Stock

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$29.348

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1,075

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$29.348

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Overview

Elevate your designs with the 74LVC374ATTR from STMicroelectronics—where cutting-edge technology meets unrivaled performance. This advanced bus driver and transceiver is crafted for reliability, ensuring seamless data integrity even in demanding environments. With a compact design and exceptional temperature range, it’s perfect for automotive, industrial, and consumer applications. Trust STMicroelectronics for quality and innovation that empowers your projects with speed and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and easier assembly processes in modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape simplifies layout designs and optimizes space on the circuit board.

No. of Bits: 8

An 8-bit capacity enables effective data handling for various standard applications, increasing versatility.

Nominal Supply Voltage / Vsup: 2.7 V

Operating with a low nominal supply voltage increases energy efficiency, making it suitable for battery-powered devices.

Power Supplies (V): 3.3 V

Compatibility with standard 3.3 V power supplies allows for easy integration into most electronic systems.

No. of Terminals: 20

Twenty terminals provide sufficient connectivity options for a wide array of circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of this package are ideal for high-density applications.

Maximum I (ol): 24 Amp

A maximum output load current of 24 Amps allows for handling significant power, making it suitable for demanding applications.

Propagation Delay (tpd): 9.4 ns

A low propagation delay enhances the speed of signal transmission, beneficial for high-frequency applications.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliability in harsh environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state outputs enhance flexibility in data bus configurations, allowing for better resource management.

Trigger Type: POSITIVE EDGE

A positive edge trigger improves synchronization with digital signals, ensuring reliable operation.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures suits applications in cold environments, enhancing reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish offers excellent corrosion resistance and conductivity, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible design layouts in circuit board assembly.

No. of Ports: 2

Having two ports enhances connectivity options, enabling numerous application configurations.

Maximum Seated Height: 1.2 mm

A low seated height supports dense surface mounting, a plus for compact electronic designs.

Width: 4.4 mm

A narrow width aids in fitting into tight PCB spaces, optimizing design for compact devices.

Output Polarity: TRUE

True output polarity improves system reliability and predictability in logical operations.

Minimum Supply Voltage (Vsup): 1.65 V

Supports low voltage operation, which is crucial for energy-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

A longer maximum time at peak reflow temperature allows for robust soldering practices during manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures compatibility with advanced soldering technologies.

Length: 6.5 mm

This compact length aids in saving PCB space and is adaptable to various applications.

Temperature Grade: MILITARY

Military-grade temperature rating assures durability and reliability in extreme conditions, suitable for critical applications.

Technology: CMOS

Utilizing CMOS technology enhances efficiency and reduces power consumption compared to other technologies.

Terminal Form: GULL WING

Gull wing terminal form provides stable mechanical support, facilitating easy soldering and robust connection.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch allows for compact layouts while ensuring reliable connections and performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suitable for various manufacturing environments.

Maximum Supply Voltage (Vsup): 3.6 V

Being able to operate at a maximum supply voltage of 3.6 V ensures compatibility with a range of power circuits.

Technical Specifications

Bus Driver & Transceivers 74LVC374ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

9.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LVC374ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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