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74LVC08AMTR

STMicroelectronics

74LVC08AMTR by STMicroelectronics

74LVC08AMTR from STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs, ideal for high-speed applications. It features a propagation delay of just 4.1 ns and operates within a supply voltage range of 1.65V to 3.6V. This compact surface-mount device ensures reliable performance in military-grade environments.

Median Price

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Lifecycle Status

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8

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1k+

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Vyrian

USA . 6,210 parts In-Stock

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Digiode

USA . 3,844 parts In-Stock

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Anansix

USA . 470 parts In-Stock

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Inventory MP

USA . 216 parts In-Stock

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Bristol Electronics

USA . 216 parts In-Stock

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Semi Source

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Connector Distribution Corp

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Right Parts Inc.

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Microchip USA

USA . 165 parts In-Stock

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$4.919

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$4.919

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AZTECH Wire

Italy . 1,017 parts In-Stock

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$13.350

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IDEA Electronic Components Group

UK . 126 parts In-Stock

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$23.087

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$20.779

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MKK Technologies

India . 1,777 parts In-Stock

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$43.414

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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Kepictronics

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Perfect Parts

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Corphita

USA . 3,132 parts In-Stock

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Northwest PG Solutions

USA . 1,587 parts In-Stock

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Native Components

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Parana Technologies

USA . 253 parts In-Stock

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Overview

Unlock limitless potential with the 74LVC08AMTR from STMicroelectronics, a superior logic gate solution designed for precision and reliability. With its exceptional speed and robust performance, this component is perfect for a wide array of applications—from automotive to industrial automation. Trust in STMicroelectronics' legacy of quality and innovation to enhance your designs, ensuring efficiency and longevity in every project. Elevate your engineering prowess today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection against environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 4.1 ns

The low propagation delay indicates fast switching times, which enhances the speed of operation in digital circuits.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic devices.

No. of Functions: 4

Offering multiple functions enhances versatility, allowing this logic gate to perform various tasks within a single package.

No. of Inputs: 2

Having two inputs makes this product suitable for basic logic operations, ideal for a variety of digital applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, suitable for high-density circuit designs.

Nominal Supply Voltage / Vsup: 2.7 V

A moderate supply voltage enhances compatibility with a wide range of power sources, ensuring efficient operation.

Load Capacitance (CL): 50 pF

A low load capacitance ensures better performance in high-speed applications by minimizing signal degradation.

Power Supplies (V): 3.3 V

Compatibility with common 3.3 V power supplies makes integration straightforward with most modern electronics.

No. of Terminals: 14

Having 14 terminals allows for greater connectivity options, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact electronic devices where space is at a premium.

Maximum I (ol): 24 Amp

A high output current capability enables the product to drive larger loads, making it suitable for demanding applications.

Propagation Delay (tpd): 12 ns

This specification allows the gate to function effectively in moderate-speed applications, balancing performance with power.

Maximum Operating Temperature: 125 °C

High operating temperature withstands harsh conditions, making it ideal for military and industrial applications.

Minimum Operating Temperature: -55 °C

The capability to operate in extremely low temperatures ensures reliability in challenging environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on PCBs for better design optimization.

Maximum Seated Height: 1.75 mm

Low seated height ensures compatibility with surface-mount technology, fitting into slim designs effectively.

Width: 3.9 mm

Narrow width makes this logic gate suitable for compact applications without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate at lower supply voltages improves energy efficiency and compatibility with battery-operated devices.

Length: 8.65 mm

This length makes the device compact enough for space-constrained applications while providing multiple functionalities.

Temperature Grade: MILITARY

Designed to military specifications, this product ensures reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a popular choice for digital circuits.

Terminal Form: GULL WING

Gull wing terminals provide better soldering and mechanical strength, leading to improved reliability in connections.

Packing Method: TR

This packing method allows for easy handling and integration into automated assembly processes.

Terminal Pitch: 1.27 mm

The terminal pitch ensures compatibility with PCB designs, facilitating easier integration with existing circuits.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to operate at a higher supply voltage broadens the product's application range in various electronic devices.

Technical Specifications

Logic Gates 74LVC08AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74LVC08AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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