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74LCXHR162245TTR

STMicroelectronics

74LCXHR162245TTR by STMicroelectronics

74LCXHR162245TTR by STMicroelectronics is a dual 8-bit bus driver with a fast propagation delay of 4.7 ns, operating at a supply voltage of 2.7-3.6 V. It features a compact SO package and supports bidirectional data transfer, ideal for high-speed applications in military environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,582 parts In-Stock

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Digiode

USA . 3,215 parts In-Stock

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3,215

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Anansix

USA . 2,891 parts In-Stock

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2,891

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$17.908

100+ parts

-

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$16.117

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883

$17.908

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$16.117

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AZTECH Wire

Italy . 856 parts In-Stock

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$18.960

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-

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856

$18.960

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MKK Technologies

India . 741 parts In-Stock

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$33.674

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741

$33.674

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DigiPath Technology Company

USA . 741 parts In-Stock

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$33.674

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741

$33.674

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Microchip USA

USA . 315 parts In-Stock

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$46.103

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315

$46.103

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Perfect Parts

USA . 3,315 parts In-Stock

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Corphita

USA . 3,067 parts In-Stock

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3,067

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Northwest PG Solutions

USA . 2,032 parts In-Stock

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2,032

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Parana Technologies

USA . 422 parts In-Stock

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$21.412

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422

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$21.412

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Native Components

USA . 386 parts In-Stock

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Andel Nordic

Denmark . 116 parts In-Stock

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Overview

Elevate your designs with the 74LCXHR162245TTR from STMicroelectronics, a premium bus driver and transceiver that ensures superior performance and reliability. With lightning-fast propagation delays, this compact powerhouse is perfect for high-speed applications in automotive, industrial, and consumer electronics. STMicroelectronics' commitment to quality guarantees lower power consumption and enhanced efficiency, empowering you to create innovative solutions without compromise. Experience the advantage of dependable technology that keeps your projects ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and ensures reliable performance in various environments.

Propagation Delay At Nominal Supply: 4.7 ns

A low propagation delay allows for faster data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology facilitates compact design, saves space, and allows for automated assembly processes.

No. of Functions: 2

With dual functions, this product optimizes circuit design by reducing component count and enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape is suitable for layout in various PCB designs, maximizing space efficiency.

No. of Bits: 8

An 8-bit architecture simplifies data handling and is compatible with standard communication protocols.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal voltage of 2.7V ensures compatibility with low-power systems, enhancing battery life.

Load Capacitance (CL): 50 pF

A low load capacitance minimizes signal degradation, supporting high-frequency performance.

Power Supplies (V): 3.3

Compatible with widely used 3.3V power supplies, ensuring ease of integration into existing designs.

No. of Terminals: 48

A higher number of terminals offers greater connectivity options in a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for dense PCB layouts, making it suitable for space-constrained applications.

Maximum I (ol): 12 Amp

With a high output current capability, this product can drive substantial loads, making it versatile for various applications.

Propagation Delay (tpd): 5.2 ns

Ensures minimal delay in data transmission, critical for high-speed communication systems.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating makes this device suitable for use in extreme environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Supports multiple output states, enhancing flexibility in bus systems and allowing for efficient data management.

Minimum Operating Temperature: -55 °C

The capability to operate in very low temperatures makes this device suitable for harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve reliability and ensure strong electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies PCB design.

No. of Ports: 2

Having multiple ports offers increased interconnectivity in systems designed for complex data handling.

Maximum Seated Height: 1.2 mm

A low seated height allows for a compact assembly, beneficial for modern, high-density electronics.

Width: 6.1 mm

A narrow width aids in space management on PCBs, crucial for miniaturized devices.

Output Polarity: TRUE

The true output polarity aligns with common digital logic, ensuring compatibility across most systems.

Minimum Supply Voltage (Vsup): 2 V

Operational flexibility with a minimum supply voltage of 2V supports low-power applications.

Length: 12.5 mm

An optimal length aids in compact design, facilitating integration in size-constrained environments.

Temperature Grade: MILITARY

Designed to meet military-grade standards ensures reliability and performance in demanding applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high speed, essential for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminals ensure stable mounting and good soldering characteristics, enhancing durability.

Packing Method: TR

Tape and reel packaging simplifies automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables compact designs and higher terminal density on the PCB.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability supports versatile applications in communication and control systems.

Control Type: COMMON CONTROL

Common control improves ease of integration into multi-device systems, simplifying control logic.

Maximum Supply Voltage (Vsup): 3.6 V

Operational up to 3.6V provides versatility across various applications requiring different voltage levels.

Technical Specifications

Bus Driver & Transceivers 74LCXHR162245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74LCXHR162245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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