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74LCX646TTR

STMicroelectronics

74LCX646TTR by STMicroelectronics

74LCX646TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 7 ns at 2.7-3.3V, featuring a small outline package and dual terminal position. It operates bidirectionally with independent control, suitable for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,757 parts In-Stock

1+ parts

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6,757

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Digiode

USA . 1,759 parts In-Stock

1+ parts

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1,759

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Anansix

USA . 724 parts In-Stock

1+ parts

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724

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Connector Distribution Corp

USA . 300 parts In-Stock

1+ parts

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300

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Right Parts Inc.

USA . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 126 parts In-Stock

1+ parts

$2.763

100+ parts

-

1k+ parts

$2.652

10k+ parts

$2.652

126

$2.763

-

$2.652

$2.652

AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$21.570

100+ parts

-

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391

$21.570

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IDEA Electronic Components Group

UK . 1,752 parts In-Stock

1+ parts

$21.697

100+ parts

-

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$19.528

10k+ parts

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1,752

$21.697

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$19.528

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Microchip USA

USA . 400 parts In-Stock

1+ parts

$23.786

100+ parts

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400

$23.786

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Ampacity Inc.

Singapore . 449 parts In-Stock

1+ parts

$31.000

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449

$31.000

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MKK Technologies

India . 796 parts In-Stock

1+ parts

$40.800

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796

$40.800

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DigiPath Technology Company

USA . 796 parts In-Stock

1+ parts

$40.800

100+ parts

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796

$40.800

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Native Components

USA . 201 parts In-Stock

1+ parts

$351.190

100+ parts

$344.166

1k+ parts

$340.654

10k+ parts

$337.142

201

$351.190

$344.166

$340.654

$337.142

Northwest PG Solutions

USA . 1,492 parts In-Stock

1+ parts

$386.309

100+ parts

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1,492

$386.309

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QUARKTWIN TECHNOLOGY LTD

USA . 14,408 parts In-Stock

1+ parts

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14,408

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Corphita

USA . 2,626 parts In-Stock

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2,626

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Parana Technologies

USA . 1,873 parts In-Stock

1+ parts

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100+ parts

$25.942

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1,873

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$25.942

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Overview

Enhance your electronic designs with the high-quality 74LCX646TTR from STMicroelectronics, a leading manufacturer in the industry. Ideal for bus driver and transceiver applications, this product offers reliable performance and efficiency. With a low propagation delay and 3-state output characteristics, this component delivers seamless data transmission. Its compact design and wide temperature range make it suitable for various environments. Trust STMicroelectronics to provide cutting-edge technology that meets your needs. Upgrade your projects today with the 74LCX646TTR and experience top-notch results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, ideal for use in various environments.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures fast and efficient data transmission within the bus driver and transceivers.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

No. of Bits: 8

8-bit capacity provides sufficient data handling capability for various applications.

Nominal Supply Voltage / Vsup (V): 2.7

Nominal supply voltage of 2.7V ensures optimal performance and compatibility with other components.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies widely used in electronic devices.

No. of Terminals: 24

Ample terminals allow for easy and flexible connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and enables efficient PCB design.

Maximum I (ol): 24 Amp

High maximum output current capability for reliable and robust performance.

Propagation Delay (tpd): 9.5 ns

Low propagation delay ensures minimal signal latency for smooth data transmission.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control over the output signal.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures accurate timing and control over the data transmission.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connectivity and durability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options.

No. of Ports: 2

2 ports for connecting multiple devices and expanding connectivity options.

Maximum Seated Height: 1.1 mm

Low profile design with maximum seated height of 1.1mm for compact and space-saving installation.

Width: 4.4 mm

Narrow width allows for efficient use of space on the circuit board.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement for efficient power consumption.

Length: 7.8 mm

Compact length for space-saving installation.

Temperature Grade: MILITARY

Military-grade temperature tolerance for reliable performance in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable soldering.

Packing Method: TR

TR packing method for easy handling and storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm for precise and compact connections.

Count Direction: BIDIRECTIONAL

Bidirectional count direction for versatile data transmission.

Control Type: INDEPENDENT CONTROL

Independent control for each terminal for customized operation.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection against moisture damage.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V for safe and reliable operation within specified limits.

Technical Specifications

Bus Driver & Transceivers 74LCX646TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LCX646TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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