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74ACT20MTR

STMicroelectronics

74ACT20MTR by STMicroelectronics

74ACT20MTR by STMicroelectronics is a dual 4-input CMOS logic gate with a propagation delay of just 9.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and supports temperatures from -55 °C to 125 °C. This compact surface-mount device features a robust nickel palladium gold finish for enhanced reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,066 parts In-Stock

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5,066

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Digiode

USA . 4,460 parts In-Stock

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4,460

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Anansix

USA . 1,181 parts In-Stock

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1,181

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Distributors (Availability)

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Native Components

USA . 796 parts In-Stock

1+ parts

$1.880

100+ parts

-

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796

$1.880

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Northwest PG Solutions

USA . 234 parts In-Stock

1+ parts

$2.068

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-

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234

$2.068

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$14.704

100+ parts

$13.381

1k+ parts

$12.057

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-

60

$14.704

$13.381

$12.057

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Microchip USA

USA . 164 parts In-Stock

1+ parts

$17.475

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164

$17.475

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AZTECH Wire

Italy . 1,114 parts In-Stock

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$18.680

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1,114

$18.680

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IDEA Electronic Components Group

UK . 915 parts In-Stock

1+ parts

$19.527

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$17.574

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915

$19.527

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$17.574

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Corohmni

South Africa . 602 parts In-Stock

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$27.113

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602

$27.113

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MKK Technologies

India . 1,346 parts In-Stock

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$36.719

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1,346

$36.719

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DigiPath Technology Company

USA . 1,346 parts In-Stock

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$36.719

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1,346

$36.719

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Component Stockers USA

USA . 478 parts In-Stock

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$99.990

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478

$99.990

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Parana Technologies

USA . 1,792 parts In-Stock

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$23.348

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Corphita

USA . 531 parts In-Stock

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531

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Overview

Unlock superior performance with the 74ACT20MTR from STMicroelectronics, a leader in cutting-edge technology. This robust logic gate solution offers exceptional reliability and rapid response times, making it ideal for diverse applications from consumer electronics to advanced industrial systems. With STMicroelectronics' commitment to quality and innovation, you can trust that this component will elevate your designs, ensuring efficiency and longevity while driving success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and reliability under various operating conditions.

Propagation Delay At Nominal Supply: 9.5 ns

The fast propagation delay allows for high-speed performance, making this logic gate suitable for efficient digital circuits.

Surface Mount: YES

Surface mount design enables compact PCB layouts and facilitates automated assembly, reducing production costs.

No. of Functions: 2

Having multiple functions increases versatility, allowing for more complex logic operations in a single package.

No. of Inputs: 4

With 4 inputs, this logic gate can handle complex logic scenarios, enhancing its application range.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, promoting efficient design.

Nominal Supply Voltage / Vsup: 5V

Operating at a common supply voltage simplifies integration into existing systems without additional voltage regulation.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal degradation, enhancing the overall stability of circuits.

Power Supplies (V): 5V

Standard power supply requirements promote compatibility with a wide range of digital systems.

No. of Terminals: 14

The 14 terminals provide ample connection points for input and output, facilitating versatile circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline saves precious board space, ideal for compact electronic devices.

Maximum I (ol): 24 Amp

High output current capability allows for driving larger loads, increasing the logic gate's application potential.

Maximum Operating Temperature: 125 °C

The ability to function at high temperatures ensures reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

Designed for extreme temperatures, this product is suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance solderability and resistance to corrosion, ensuring long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning aids in easy integration and layout flexibility on printed circuit boards.

Maximum Seated Height: 1.75 mm

A compact seated height allows for low-profile designs, which is essential in space-constrained applications.

Width: 3.9 mm

Narrow width supports efficient board space usage, essential for modern compact electronics.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in supply voltage ensures compatibility with a diverse range of circuits.

Length: 8.65 mm

A manageable length enhances compatibility with existing PCB layouts while maintaining a small footprint.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring reliability in rugged and hostile environments.

Technology: CMOS

CMOS technology provides low power consumption and allows for high-density integration, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improves the mechanical stability of the device.

Packing Method: TR

Tape and reel packing method makes automated handling and assembly processes seamless, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

The standard pitch size promotes compatibility with existing footprints and tools, making it easier to integrate into designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to tolerate higher supply voltages adds versatility, enabling operation in various circuit configurations.

Technical Specifications

Logic Gates 74ACT20MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74ACT20MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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