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74ACT16541TTR

STMicroelectronics

74ACT16541TTR by STMicroelectronics

74ACT16541TTR by STMicroelectronics is a dual 8-bit bus driver with a 5V nominal supply and operates at temperatures from -55 °C to 125°C. It features a fast propagation delay of 9.2 ns and supports up to 24A output current. Ideal for military applications, it ensures reliable data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,868

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-

-

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Digiode

USA . 1,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,358

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-

-

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Anansix

USA . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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319

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,053 parts In-Stock

1+ parts

$6.978

100+ parts

-

1k+ parts

$6.699

10k+ parts

$6.699

4,053

$6.978

-

$6.699

$6.699

AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$10.190

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$10.190

-

-

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IDEA Electronic Components Group

UK . 1,700 parts In-Stock

1+ parts

$21.366

100+ parts

-

1k+ parts

$19.229

10k+ parts

-

1,700

$21.366

-

$19.229

-

Ampacity Inc.

Singapore . 1,218 parts In-Stock

1+ parts

$39.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,218

$39.000

-

-

-

MKK Technologies

India . 1,998 parts In-Stock

1+ parts

$40.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$40.178

-

-

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DigiPath Technology Company

USA . 1,998 parts In-Stock

1+ parts

$40.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$40.178

-

-

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Microchip USA

USA . 368 parts In-Stock

1+ parts

$45.560

100+ parts

-

1k+ parts

-

10k+ parts

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368

$45.560

-

-

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Component Stockers USA

USA . 505 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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505

$99.990

-

-

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Native Components

USA . 578 parts In-Stock

1+ parts

$115.090

100+ parts

-

1k+ parts

-

10k+ parts

$110.486

578

$115.090

-

-

$110.486

Northwest PG Solutions

USA . 465 parts In-Stock

1+ parts

$126.599

100+ parts

-

1k+ parts

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10k+ parts

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465

$126.599

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-

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Corphita

USA . 3,920 parts In-Stock

1+ parts

-

100+ parts

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3,920

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Parana Technologies

USA . 2,321 parts In-Stock

1+ parts

-

100+ parts

$25.546

1k+ parts

-

10k+ parts

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2,321

-

$25.546

-

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Overview

Elevate your design with the 74ACT16541TTR from STMicroelectronics, a premier choice in bus drivers and transceivers. With robust performance under extreme conditions, this high-quality component ensures reliable data transmission for your critical applications. Its compact footprint and efficient power management empower engineers to innovate without compromise. Trust in STMicroelectronics’ legacy of excellence to bring unparalleled value and reliability to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures enhanced protection and longevity of the product, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern circuit boards, optimizing space and performance.

No. of Functions: 2

Having two functions in a single package allows for cost savings and efficiency in circuit design.

Package Shape: RECTANGULAR

Rectangular shape aids in efficient PCB layout and space management in electronic designs.

No. of Bits: 8

An 8-bit configuration supports a wide range of applications, balancing performance and data handling capabilities.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is standard in many applications, providing easy compatibility with existing systems.

Power Supplies (V): 5

Support for 5V power supplies simplifies integration into conventional electronic systems.

No. of Terminals: 48

A higher number of terminals enhances connectivity options, supporting complex designs and features.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to a compact design, ideal for space-constrained applications.

Maximum I (ol): 24 Amp

High output capacity of 24 Amps makes this product suitable for demanding applications requiring significant current.

Propagation Delay (tpd): 9.2 ns

A low propagation delay enhances the speed of data transmission, making it apt for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature extends the operational range, suitable for harsh environments.

Output Characteristics: 3-STATE

3-state output allows for versatile communication in bus systems, enhancing flexibility in circuit design.

Minimum Operating Temperature: -55 °C

Extreme low temperature capability ensures reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves conductivity and resistance to corrosion, increasing reliability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in theoretical layout and design configuration.

No. of Ports: 2

Two ports provide enhanced versatility, allowing multiple connections in a compact design.

Maximum Seated Height: 1.2 mm

A low seated height facilitates integration into low-profile applications.

Width: 6.1 mm

Compact width aids in minimizing PCB real estate usage, making it suitable for tight spaces.

Output Polarity: TRUE

True output polarity simplifies designs requiring direct access to logic levels.

Minimum Supply Voltage (Vsup): 4.5V

A minimum supply voltage of 4.5V ensures compatibility with a range of power supply systems.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures durability during soldering processes.

Length: 12.5 mm

A manageable length enhances placement options during PCB assembly, accommodating various designs.

Temperature Grade: MILITARY

Military temperature grade ensures robustness in extreme conditions, appealing for defense and aerospace applications.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, making it efficient and reliable.

Terminal Form: GULL WING

Gull wing form simplifies soldering and improves surface mount reliability.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, enhancing production efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, making it suitable for compact applications.

Control Type: ENABLE LOW

Low enable control type provides ease of integration with other digital logic components.

Maximum Supply Voltage (Vsup): 5.5V

A maximum supply voltage of 5.5V ensures reliability across different operating conditions.

Technical Specifications

Bus Driver & Transceivers 74ACT16541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ACT16541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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