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5962F0253201VXA

STMicroelectronics

5962F0253201VXA by STMicroelectronics

5962F0253201VXA by STMicroelectronics is an adjustable negative LDO regulator with a max output of 9.5 V and current of 3 A. It operates from -55 °C to 150 °C, ensuring reliability in harsh environments. Ideal for military applications due to its MIL-PRF-38535 Class V screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 16 parts In-Stock

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Vyrian

USA . 4,503 parts In-Stock

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4,503

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Anansix

USA . 2,830 parts In-Stock

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Digiode

USA . 490 parts In-Stock

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Native Components

USA . 602 parts In-Stock

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$0.050

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$0.048

602

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$0.048

IDEA Electronic Components Group

UK . 1,926 parts In-Stock

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$4.480

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$4.032

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MKK Technologies

India . 1,602 parts In-Stock

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$8.425

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DigiPath Technology Company

USA . 1,602 parts In-Stock

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$8.425

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Corphita

USA . 1,948 parts In-Stock

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Parana Technologies

USA . 1,699 parts In-Stock

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$5.357

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$5.357

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Northwest PG Solutions

USA . 1,130 parts In-Stock

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Overview

Elevate your designs with the 5962F0253201VXA adjustable negative LDO from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust regulator excels in demanding environments, offering superior stability and performance with minimal dropout voltage. Perfect for aerospace and military applications, it guarantees reliability under extreme conditions. Trust in ST’s decades of innovation to enhance your projects while enjoying exceptional efficiency and long-term value.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package provides excellent thermal performance and reliability, making this regulator suitable for high-performance applications.

Total Dose: 300k Rad(Si)

Withstand a total dose of 300k Rad(Si), this regulator is ideal for use in radiation-sensitive environments, such as space applications.

Maximum Dropout Voltage: 1.8 V

A maximum dropout voltage of 1.8 V ensures efficient operation, allowing for better voltage regulation even when input voltage approach the output voltage.

Surface Mount: YES

Surface mount capability facilitates easier and faster integration into PCB designs, saving both time and space in electronic applications.

Operating Temperature (TJ-Max): 150 °C

The ability to function at a maximum operating temperature of 150 °C makes it well-suited for demanding conditions in automotive and industrial applications.

Screening Level: MIL-PRF-38535 Class V

This screening level ensures high reliability and performance, making it a trusted choice for military and aerospace applications.

Technology: BIPOLAR

Bipolar technology provides enhanced performance characteristics, such as improved power efficiency and better noise performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout on PCBs while maximizing space utilization.

Terminal Form: FLAT

Flat terminals improve solderability and provide a strong mechanical connection, enhancing overall reliability.

Operating Temperature (TJ-Min): -55 °C

With a minimum operating temperature of -55 °C, this regulator can be used in extreme climates, adding to its versatility.

Minimum Output Voltage: 1.2 V

A minimum output voltage of 1.2 V is suitable for low-voltage applications, catering to modern electronic devices requiring efficient regulation.

No. of Terminals: 16

Having 16 terminals provides the designer with numerous connection options, enhancing flexibility in circuit design.

Maximum Line Regulation: 0.046%/V

Low line regulation ensures stable output voltage regardless of variations in input voltage, which is critical for sensitive applications.

Package Style (Meter): FLATPACK

The flatpack style allows for compact assembly in tight spaces, ideal for modern miniaturized electronic designs.

Adjustability: ADJUSTABLE

Adjustable output allows for fine-tuning to meet specific application requirements, providing designers with great flexibility.

Maximum Load Regulation: 0.6%

This ensures that output voltage remains stable under varying load conditions, critical for performance-driven applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch accommodates standard PCB designs, simplifying integration into existing hardware.

Regulator Type: ADJUSTABLE NEGATIVE SINGLE OUTPUT LDO REGULATOR

As an adjustable negative LDO, it suits applications requiring precise voltage regulation with negative output, such as in sensor circuits.

Terminal Finish: TIN LEAD

Tin-lead finish enhances durability and solderability, assuring reliable connections over the lifespan of the device.

Terminal Position: DUAL

Dual terminal positioning can provide better signal integrity and load distribution in circuit designs.

Maximum Output Voltage: 9.5 V

A maximum output voltage of 9.5 V supports a wide range of applications, providing flexibility in voltage requirements.

Maximum Seated Height: 2.72 mm

This low profile helps in creating compact designs, essential in space-constrained applications.

Width: 6.91 mm

A compact width allows for high-density layout on PCBs, which is crucial for modern electronic devices.

Maximum Output Current: 3 A

With a maximum output current of 3 A, this regulator can handle demanding loads, making it ideal for high-performance applications.

Length: 9.91 mm

The moderate length enables efficient use of space on PCBs without sacrificing functionality.

Technical Specifications

Adjustable Regulators - Negative Single Output LDO 5962F0253201VXA attributes and parameters. Explore more Adjustable Regulators - Negative Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-CDFP-F16

JESD-609 Code:

e0

Length:

9.91 mm

Maximum Line Regulation (%/V):

.046

Maximum Load Regulation (%):

.6 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

9.5 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Qualification Status:

Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.91 mm

Trade Compliance

5962F0253201VXA Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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