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5962F0253201V9X

STMicroelectronics

5962F0253201V9X by STMicroelectronics

5962F0253201V9X by STMicroelectronics is a negative adjustable LDO regulator with a max output of 9.5 V and current of 3 A, suitable for high-radiation environments (300k Rad(Si)). It operates b/w -55 °C to 150 °C, ensuring reliability in extreme conditions. Ideal for military and aerospace applications due to its MIL-PRF-38535 Class V screening.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,381 parts In-Stock

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Anansix

USA . 2,284 parts In-Stock

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Vyrian

USA . 112 parts In-Stock

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IDEA Electronic Components Group

UK . 840 parts In-Stock

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$8.656

100+ parts

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$7.791

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840

$8.656

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$7.791

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MKK Technologies

India . 923 parts In-Stock

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$16.278

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$16.278

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DigiPath Technology Company

USA . 923 parts In-Stock

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$16.278

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923

$16.278

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Northwest PG Solutions

USA . 785 parts In-Stock

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Native Components

USA . 726 parts In-Stock

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Corphita

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Parana Technologies

USA . 484 parts In-Stock

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$10.350

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Overview

Elevate your designs with the 5962F0253201V9X from STMicroelectronics, a standout in adjustable negative LDO regulators. Renowned for precision and reliability, STMicroelectronics ensures this component excels in demanding applications, from aerospace to industrial systems. With an impressive temperature range and robust construction, it delivers consistent performance under the most challenging conditions, providing engineers peace of mind and unmatched value in their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed cofired package provides excellent reliability and thermal performance, making it suitable for harsh environments.

Total Dose: 300k Rad(Si)

A high radiation tolerance ensures performance stability in demanding applications, particularly in aerospace and nuclear environments.

Maximum Dropout Voltage: 1.8 V

This relatively low dropout voltage allows for better efficiency in power conversion, minimizing losses and maximizing output voltage stability.

Surface Mount: YES

The surface mount design facilitates an easier integration into compact electronic assemblies, improving space efficiency and manufacturing processes.

Operating Temperature (TJ-Max): 150 °C

A high maximum operating temperature ensures that the regulator can operate reliably in extreme conditions without thermal issues.

Screening Level: MIL-PRF-38535 Class V

Complies with military standards for performance and reliability, making it a trustworthy choice for critical applications.

Technology: BIPOLAR

Bipolar technology provides high performance and better noise characteristics, enhancing the overall quality of the output voltage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout design, optimizing the space on printed circuit boards.

Terminal Form: NO LEAD

The no-lead design reduces the footprint and allows for even tighter design constraints, making it suitable for modern compact electronic devices.

Operating Temperature (TJ-Min): -55 °C

The low minimum operating temperature makes this regulator suitable for use in extreme cold environments, ensuring reliable function across a wide temperature range.

Minimum Output Voltage: 1.2 V

With a minimum output voltage of 1.2 V, it can be effectively used in low-voltage applications, providing flexibility in design.

No. of Terminals: 12

A higher number of terminals allows for more versatile connections within the circuit, enabling complex configurations.

Package Style: UNCASED CHIP

An uncased chip style helps in custom thermal management solutions and allows for integration into specialized enclosures.

Regulator Type: ADJUSTABLE NEGATIVE SINGLE OUTPUT LDO REGULATOR

Its adjustable negative output makes it ideal for applications requiring precise negative voltage regulation, enhancing its versatility.

Terminal Finish: TIN LEAD

The tin lead finish offers good solderability, ensuring reliable connections during assembly and improved robustness.

Terminal Position: UPPER

Upper terminal positioning aids in easier PCB layout and assembly, supporting streamlined manufacturing processes.

Maximum Output Voltage: 9.5 V

The capability of providing up to 9.5 V output makes this regulator suitable for a wide range of applications, including sensitive analog devices.

Maximum Output Current: 3 A

A maximum output current of 3 A allows this regulator to handle substantial loads, making it suitable for power-intensive applications.

Technical Specifications

Adjustable Regulators - Negative Single Output LDO 5962F0253201V9X attributes and parameters. Explore more Adjustable Regulators - Negative Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-CUUC-N12

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

12

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

9.5 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIE

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Qualification Status:

Qualified

Screening Level:

MIL-PRF-38535 Class V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

UPPER

Total Dose (V):

300k Rad(Si)

Trade Compliance

5962F0253201V9X Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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