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S29GL256S10FHI013

Spansion

S29GL256S10FHI013 by Spansion

EEPROM CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 207 parts In-Stock

1+ parts

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207

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Vyrian

USA . 68 parts In-Stock

1+ parts

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100+ parts

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68

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,678 parts In-Stock

1+ parts

$4.076

100+ parts

$3.913

1k+ parts

$3.750

10k+ parts

-

4,678

$4.076

$3.913

$3.750

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Component Stockers USA

USA . 545 parts In-Stock

1+ parts

$99.990

100+ parts

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545

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 5,437 parts In-Stock

1+ parts

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5,437

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Microchip USA

USA . 1,372 parts In-Stock

1+ parts

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1,372

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Corphita

USA . 403 parts In-Stock

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403

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Technical Specifications

EEPROM S29GL256S10FHI013 attributes and parameters. Explore more EEPROM devices from Spansion

Specs

Maximum Access Time:

100 ns

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

256

No. of Terminals:

64

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

16

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.4 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11 mm

Trade Compliance

S29GL256S10FHI013 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

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