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EZR32LG230F64R61G-B0

Silicon Labs

EZR32LG230F64R61G-B0 by Silicon Labs

EZR32LG230F64R61G-B0 by Silicon Labs is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 32 MHz. It features 8-channel 12-bit ADCs and DACs, suitable for applications requiring low power consumption and high-speed data processing. Ideal for IoT devices, sensor networks, and industrial automation systems.

Median Price

$3.966

Lifecycle Status

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3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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$3.966

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Vyrian

USA . 7,608 parts In-Stock

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Digiode

USA . 400 parts In-Stock

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Argo Parts USA

USA . 4,529 parts In-Stock

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$3.966

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Continental Prestige Electronics

USA . 2,224 parts In-Stock

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$3.887

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AZTECH Wire

Italy . 466 parts In-Stock

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$5.984

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Ampacity Inc.

Singapore . 1,102 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$3.887

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$3.768

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$3.689

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Corphita

USA . 152 parts In-Stock

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Overview

Unleash the power of innovation with the EZR32LG230F64R61G-B0 microcontroller from Silicon Labs. Designed for excellence, this cutting-edge device offers unparalleled performance and efficiency for a wide range of applications. With its advanced technology and versatile features, the EZR32LG230F64R61G-B0 delivers exceptional value and benefits to customers seeking top-tier quality and reliability. Elevate your projects to new heights with this powerhouse microcontroller that promises to exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.8 V

Provides flexibility in power supply options.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage.

Package Shape: SQUARE

Provides a compact form factor for space-constrained applications.

Bit Size: 32

Enables handling of large data sets and complex calculations.

DAC Channels: YES

Enables the generation of accurate analog signals.

No. of Terminals: 64

Offers a sufficient number of connectivity options for various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides multiple packaging options for different application requirements.

Minimum Supply Voltage: 1.98 V

Allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments.

CPU Family: CORTEX-M3

Features a high-performance and energy-efficient processor architecture.

No. of External Interrupts: 16

Facilitates efficient handling of external events and interrupts.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in harsh environmental conditions.

ADC Channels: YES

Allows for accurate analog-to-digital conversion.

DMA Channels: YES

Enables efficient data transfer without CPU intervention.

Terminal Position: QUAD

Provides a standardized terminal layout for easy integration.

ROM Words: 65536

Offers ample storage for program code.

Maximum Seated Height: 0.9 mm

Suitable for compact electronic designs where height is a constraint.

Digital To Analog Convertors: 2 Ch 12-Bit

Provides high-resolution analog output capabilities.

Width: 9 mm

Compact dimensions for space-efficient PCB layouts.

Peripherals: ANALOG COMPARATOR(2), BOD, DMA, POR, PWM(4), RTC, TIMER(9), WDT

Offers a rich set of integrated peripherals for diverse application requirements.

Maximum Clock Frequency: 32 MHz

Provides high processing speed for demanding applications.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Length: 9 mm

Balanced dimensions for PCB layout considerations.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a RISC-based microcontroller architecture for efficient operation.

No. of Timers: 11

Facilitates precise timekeeping and event scheduling.

RAM Bytes: 32768

Offers ample memory for data storage and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

Facilitates automated PCB assembly processes without lead components.

Analog To Digital Convertors: 8-Ch 12-Bit

Enables accurate analog signal conversion for a variety of inputs.

Nominal Supply Voltage: 3 V

Standard voltage level for compatibility with common power sources.

No. of Serial I/Os: 7

Supports multiple serial communication interfaces for connectivity options.

PWM Channels: YES

Enables precise control of PWM signals for various applications.

Connectivity: I2C(2), LEUART(2), UART(2), USART(2)

Provides a range of communication interfaces for peripheral connectivity.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of the ROM.

Terminal Pitch: 0.5 mm

Provides a fine pitch for compact design and efficient board layout.

Format: FIXED POINT

Utilizes fixed-point arithmetic for efficient computational operations.

Moisture Sensitivity Level (MSL): 3

Suitable for handling in moderate moisture environments during assembly.

Speed: 48 rpm

Supports rapid data processing and execution speed for applications.

Low Power Mode: YES

Enables energy-efficient operation for battery-powered devices.

On Chip Program ROM Width: 8

Efficiently stores program code for quick access and execution.

No. of I/O Lines: 41

Provides ample I/O options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers EZR32LG230F64R61G-B0 attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

16

No. of I/O Lines:

41

No. of Serial I/Os:

7

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.98 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LEUART(2), UART(2), USART(2)

Peripherals:

ANALOG COMPARATOR(2), BOD, DMA, POR, PWM(4), RTC, TIMER(9), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

EZR32LG230F64R61G-B0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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