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EZR32LG230F256R61G-B0

Silicon Labs

EZR32LG230F256R61G-B0 by Silicon Labs

EZR32LG230F256R61G-B0 by Silicon Labs is a 32-bit microcontroller with 64 terminals, 32768 bytes of RAM, and 262144 ROM words. It features 2 DAC channels, 8 ADC channels, and operates at a max clock frequency of 32 MHz. Ideal for applications requiring low power consumption and connectivity via I2C, LEUART, UART, and USART interfaces.

Median Price

$4.055

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Arrow

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Overview

Unlock the power of innovation with the EZR32LG230F256R61G-B0 microcontroller by Silicon Labs. Designed with cutting-edge technology and a wide range of peripherals, this device is perfect for a variety of applications. From low power modes to high-speed connectivity options, customers can expect top-notch performance and reliability. Embrace the future of technology with Silicon Labs and experience the seamless integration and quality that sets this microcontroller apart. Elevate your projects with the EZR32LG230F256R61G-B0 and discover limitless possibilities.

Feature Benefit Bullets

Surface Mount YES

Allows for easy integration into circuit boards, saving time and space.

Maximum Supply Voltage 3.8 V

Provides a wide voltage range for flexible power supply options.

On Chip Data RAM Width 8

Efficient data processing capabilities for quick and reliable operations.

Package Shape SQUARE

Allows for compact and space-saving design in electronic devices.

Bit Size 32

High processing capability for handling complex tasks and calculations.

DAC Channels YES

Supports digital-to-analog conversion for diverse applications.

No. of Terminals 64

Offers ample connection points for interfacing with various components.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and space optimization in a compact package.

Minimum Supply Voltage 1.98 V

Enables operation at low power levels for energy-efficient performance.

Maximum Operating Temperature 85 °C

Suitable for a wide range of operating environments.

CPU Family CORTEX-M3

Reliable and established processor family for robust performance.

No. of External Interrupts 16

Supports efficient handling of external events and interrupts.

Minimum Operating Temperature -40 °C

Capable of functioning in extreme temperature conditions.

ADC Channels YES

Allows for analog-to-digital conversion for diverse sensor applications.

DMA Channels YES

Improves data transfer efficiency and reduces CPU load.

Terminal Position QUAD

Facilitates easy PCB layout and connection management.

ROM Words 262144

Large memory capacity for storing program instructions and data.

Maximum Seated Height 0.9 mm

Ultra-thin profile for slim device designs.

Digital To Analog Convertors 2 Ch 12-Bit

Provides precise analog output capabilities for varied applications.

Width 9 mm

Compact form factor for fitting into tight spaces.

Peripherals ANALOG COMPARATOR(2), BOD, DMA, POR, PWM(4), RTC, TIMER(9), WDT

Comprehensive set of integrated peripherals for versatile functionality.

Maximum Clock Frequency 32 MHz

High operating speed for rapid data processing and responsiveness.

Peak Reflow Temperature °C 260

Suitable for lead-free soldering processes and high-temperature reflow.

Length 9 mm

Compact size for easy integration into electronic systems.

Peripheral IC Type MICROCONTROLLER, RISC

Features a reliable microcontroller architecture for efficient processing.

No. of Timers 11

Supports precise timing and scheduling functions for various tasks.

RAM Bytes 32768

Sufficient memory capacity for data storage and processing.

Technology CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Terminal Form NO LEAD

Lead-free terminal design for environmental sustainability and compliance.

Analog To Digital Convertors 8-Ch 12-Bit

Multiple analog input channels for diverse sensor integration.

Nominal Supply Voltage 3 V

Ideal voltage level for stable and reliable operation.

No. of Serial I/Os 7

Supports multiple communication interfaces for flexible connectivity options.

PWM Channels YES

Enables pulse-width modulation for motor control and LED brightness adjustment.

Connectivity I2C(2), LEUART(2), UART(2), USART(2)

Versatile communication interfaces for seamless connectivity with external devices.

ROM Programmability FLASH

Allows for easy reprogramming and updating of firmware.

Terminal Pitch 0.5 mm

Fine pitch terminals for compact and space-efficient PCB design.

Format FIXED POINT

Utilizes fixed-point arithmetic for efficient mathematical operations.

Moisture Sensitivity Level (MSL) 3

Resistant to moisture-related damage for enhanced durability.

Speed 48 rpm

Capable of processing tasks at a fast and efficient rate.

Low Power Mode YES

Supports energy-saving operation for extended battery life.

On Chip Program ROM Width 8

Efficient use of on-chip memory for storing program code.

No. of I/O Lines 41

Abundant I/O lines for versatile connection and expansion options.

Technical Specifications

Microcontrollers EZR32LG230F256R61G-B0 attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

16

No. of I/O Lines:

41

No. of Serial I/Os:

7

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.98 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LEUART(2), UART(2), USART(2)

Peripherals:

ANALOG COMPARATOR(2), BOD, DMA, POR, PWM(4), RTC, TIMER(9), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

EZR32LG230F256R61G-B0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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